Features

Q3-67 — HEATPAD POWER MODULE .005" Q3

Manufacturer: Bergquist  •  RoHS/pb-free: RoHS   Pb-free  •  Series: Q-Pad® 3  •  Usage: SIP, Power Module  •  Shape: Rectangular  •  Outline: 38.10mm x 22.86mm  •  Thickness: 0.005" (0.127mm)  •  Material: Graphite Elastomer  •  Thermal Resistivity: 0.35°C/W  •  Thermal Conductivity: 2 W/m-K  •  Other PartNo: BER136
Datasheet

Suppliers of «Q3-67»

Part NoManufacturerPriceStock
HongKong Teyou Huicheng Electronic Technology Limited, ShenZhen
(86) 18938853596, Fax: (0755) 82569815, info3@tyhchk.com
Q367 339-4CNC (Package: : BGA; , D/c: : 22+)ATMEL/45000
LDC18836M26Q-367 (Package: : 0603; , D/c: : 22+)MURATA/55000
IC STOCK TECHNOLOGY LIMITED, Changsha
(731) 85241908, Fax: (731) 85241908, claire2022@hkicstock.com
Q367 (D/c: : 07+)ATMEL8236
LDC18836M26Q-367 (D/c: : 10+)MURATA2750
King-YiKu Optoelectronics Co., Ltd., ShenZhen
(86) 18819033453, vladimir@kingyiku.com
LDC18836M26Q-367 (22+; , D/c: : 3750)MURATA603$
ООО "Интегральные схемы", St. Petersburg
+7 (812) 448-53-82, info@ic-ltd.ru
Q3-67from 7 days
Aspect, St. Petersburg
+7 (812) 309-89-32, info@aspect.spb.su
Q3-67from 7 days