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HF115TAAC-105 — HEATPAD SIP PKG W/ADH HI-FLOW

Manufacturer: Bergquist  •  RoHS/pb-free: RoHS   Pb-free  •  Series: Hi-Flow 115 AC  •  Usage: SIP  •  Shape: Rectangular  •  Outline: 36.83mm x 21.08mm  •  Thickness: 0.005" (0.127mm)  •  Material: Fiberglass  •  Thermal Resistivity: 0.2°C/W  •  Thermal Conductivity: 0.8 W/m-K  •  Other PartNo: BER170, HF115AC-105
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Suppliers of «HF115TAAC-105»

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ООО "Интегральные схемы"HF115TAAC-105 from 7 days
AspectHF115TAAC-105 from 7 days


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AspectSt. Petersburg+7 (812) 309-89-320  0 Hide
ООО "Интегральные схемы"St. Petersburg+7 (812) 448-53-820  0 Hide
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