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CPU .63X.63
— HEATPAD CPU .63"X.63
Fans, Thermal Management
»
Heat Sink Pads
Manufacturer: Bergquist
•
RoHS/pb-free:
RoHS
Pb-free
•
Usage: CPU
•
Shape: Square
•
Thickness: 0.005" (0.127mm)
•
Thermal Conductivity: 0.6 W/m-K
•
Other PartNo: BER133
Datasheet
cpu_pad.pdf (209.39Kb)
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