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Q3-101
— HEATPAD POWER MODULE .005" Q3
Fans, Thermal Management
»
Heat Sink Pads
Manufacturer: Bergquist
•
RoHS/pb-free:
RoHS
Pb-free
•
Series: Q-Pad® 3
•
Usage: SIP, Power Module
•
Shape: Rectangular
•
Outline: 63.50mm x 50.80mm
•
Thickness: 0.005" (0.127mm)
•
Material: Graphite Elastomer
•
Thermal Resistivity: 0.35°C/W
•
Thermal Conductivity: 2 W/m-K
•
Other PartNo: BER137
Datasheet
PDS_QP_3_12.08_E.pdf
on site bergquistcompany.com
q-pad_3.pdf (16.97Kb)
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Q3-101
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St. Petersburg
+7 (812) 309-89-32
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St. Petersburg
+7 (812) 448-53-82
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