RG1A thru RG1M
Vishay Semiconductors
formerly General Semiconductor
Document Number 88693
www.vishay.com
08-Feb-02
1
Glass Passivated Fast Switching Rectifier
Reverse Voltage 50 to 1000V
Forward Current 1.0A
Patented*
0.034 (0.86)
0.028 (0.71)
DIA.
0.150 (3.8)
0.100 (2.5)
DIA.
1.0 (25.4)
MIN.
0.240 (6.1)
MAX.
1.0 (25.4)
MIN.
Maximum Ratings & Thermal Characteristics
Ratings at 25°C ambient temperature unless otherwise specified.
Parameter
Symbol RG1A
RG1B RG1D
RG1G
RG1J
RG1K
RG1M
Unit
Maximum repetitive peak reverse voltage
V
RRM
50
100
200
400
600
800
1000
V
Maximum RMS voltage
V
RMS
35
70
140
280
420
560
700
V
Maximum DC blocking voltage
V
DC
50
100
200
400
600
800
1000
V
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
=55°C
I
F(AV
)
1.0
A
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
I
FSM
30
A
Maximum full load reverse current,
full cycle average 0.375" (9.5mm) T
A
=25°C
I
R(AV)
1.0
µ
A
lead length at
T
A
=100°C
100
Typical thermal resistance
(1)
R
JA
55
°C/W
Operating junction and storage temperature range T
J
, T
STG
-65 to +175
°C
Electrical Characteristics
Ratings at 25°C ambient temperature unless otherwise specified.
Maximum instantaneous forward voltage at 1.0A
V
F
1.3
V
Maximum DC reverse current
at rated DC blocking voltage
I
R
2.0
µ
A
Maximum reverse recovery time at
at I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
t
rr
150
200
250
500
ns
Typical junction capacitance at 4.0V, 1MHz
C
J
15
pF
Note:
(1) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, P.C.B. mounted
DO204AP
Features
· High temperature metallurgically bonded construction
· Hermetically sealed package
· Cavity-free glass passivated junction
· 1.0 ampere operation at T
A
= 55°C with no thermal runaway
· Typical I
R
less than 0.1
µ
A
· Capable of meeting environmental standards of MIL-S-19500
· Fast switching for high efficiency
· High temperature soldering guaranteed: 350°C/10 seconds,
0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
Mechanical Data
Case: JEDEC DO-204AP Solid glass body
Terminals: Solder plated axial leads, solderable per MIL-
STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.02 ounce, 0.56 gram
Dimensions in inches and (millimeters)
*
Brazed-lead assembly is covered by Patent No. 3,930,306
RG1A thru RG1M
Vishay Semiconductors
formerly General Semiconductor
www.vishay.com
Document Number 88693
2
08-Feb-02
Ambient Temperature (
°
C)
Fig. 1 -- Forward Current
Derating Curve
A
verage Forward Rectified Current (A)
Fig. 3 -- Typical Instantaneous
Forward Characteristics
Instantaneous Forward Voltage (V)
Instantaneous Forward Current (A)
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Reverse Current (
µ
A)
Fig. 4 -- Typical Reverse
Characteristics
Number of Cycles at 60 H
Z
Fig. 2 -- Maximum Non-Repetitive
Peak Forward Surge Current
Peak Forward Surge Current (A)
Reverse Voltage (V)
Junction Capacitance (pF)
Fig. 5 -- Typical Junction
Capacitance
0
25
50
75
100
125
175
0
0.2
0.4
0.6
0.8
1.0
150
0.375" (9.5mm) Lead Length
Ipk / I
AV
=
Ipk / I
AV =
Resistive or Inductive Load
Capacitance Load
30
20
10
0
1
10
100
T
A
= 25
°
C
8.3ms Single Half Sine-Wave
(JEDEC Method)
20
10
1
0.1
0.01
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0
20
40
60
80
100
0.01
0.1
1
10
20
1
10
100
1
10
30
T
J
= 25
°
C
f = 1.0MH
Z
Vsig, 50mVp-p max.
5.0
10
20
T
J
= 75
°
C
T
J
= 25
°
C
T
J
= 25
°
C
T
J
= 125
°
C
Pulse Width = 300
µ
s
1% Duty Cycle
Ratings and
Characteristic Curves
(T
A
= 25°C unless otherwise noted)
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