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BYV32, BYVF32 & BYVB32 Series
Vishay Semiconductors
formerly General Semiconductor
Document Number 88558
www.vishay.com
26-Mar-03
1
Dual Ultrafast Rectifiers
Reverse Voltage 50 to 200V
Forward Current 18A
Reverse Recovery Time 25ns
0.08
(2.032)
0.24
(6.096)
0.42
(10.66)
0.63
(17.02)
0.12
(3.05)
0.33
(8.38)
Mounting Pad Layout TO-263AB
0.380 (9.65)
0.411 (10.45)
0.320 (8.13)
0.360 (9.14)
0.591 (15.00)
0.624 (15.85)
1
2
0.245 (6.22)
MIN
K
K
0.160 (4.06)
0.190 (4.83)
0.045 (1.14)
0.055 (1.40)
0.014 (0.36)
0.021 (0.53)
0.110 (2.79)
0.140 (3.56)
0.090 (2.29)
0.110 (2.79)
0.047 (1.19)
0.055 (1.40)
PIN 1
PIN 2
K - HEATSINK
0-0.01 (0-0.254)
0.027 (0.686)
0.037 (0.940)
0.105 (2.67)
0.095 (2.41)
0.205 (5.20)
0.195 (4.95)
1
3
PIN
2
0.060 (1.52)
0.405 (10.27)
0.383 (9.72)
0.191 (4.85)
0.171 (4.35)
0.600 (15.5)
0.580 (14.5)
0.560 (14.22)
0.530 (13.46)
0.037 (0.94)
0.027 (0.69)
0.140 (3.56)
0.130 (3.30)
0.350 (8.89)
0.330 (8.38)
0.188 (4.77)
0.172 (4.36)
0.110 (2.80)
0.100 (2.54)
0.131 (3.39)
0.122 (3.08)
0.110 (2.80)
0.100 (2.54)
0.022 (0.55)
0.014 (0.36)
DIA.
DIA.
0.676 (17.2)
0.646 (16.4)
0.205 (5.20)
0.195 (4.95)
0.105 (2.67)
0.095 (2.41)
PIN 2
PIN 1
PIN 3
ITO-220AB (BYVF32 Series)
TO-220AB (BYV32 Series)
Dimensions in inches
and (millimeters)
TO-263AB (BYVB32 Series)
1
2
3
PIN
0.185 (4.70)
0.175 (4.44)
0.055 (1.39)
0.045 (1.14)
0.145 (3.68)
0.135 (3.43)
0.350 (8.89)
0.330 (8.38)
0.560 (14.22)
0.530 (13.46)
0.022 (0.56)
0.014 (0.36)
0.110 (2.79)
0.100 (2.54)
0.603 (15.32)
0.573 (14.55)
CASE
1.148 (29.16)
1.118 (28.40)
PIN 2
0.154 (3.91)
0.148 (3.74)
0.113 (2.87)
0.103 (2.62)
0.160 (4.06)
0.140 (3.56)
0.410 (10.41)
0.390 (9.91)
0.635 (16.13)
0.625 (15.87)
0.415 (10.54) MAX.
0.370 (9.40)
0.360 (9.14)
PIN 1
PIN 3
0.028 (0.70)
0.104 (2.65)
0.096 (2.45)
0.035 (0.90)
0.205 (5.20)
0.195 (4.95)
0.105 (2.67)
0.095 (2.41)
Features
· Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
· Dual rectifier construction, positive centertap
· Glass passivated chip junctions
· Low power loss
· Low forward voltage, high current capability
· High surge current capability
· Superfast recovery times for high efficiency
Mechanical Data
Case: JEDEC TO-220AB, ITO-220AB & TO-263AB
molded plastic body
Terminals: Plated leads, solderable per
MIL-STD-750, Method 2026
High temperature soldering guaranteed:
250°C, 0.16" (4.06mm) from case for 10 seconds
Polarity: As marked Mounting Position: Any
Mounting Torque: 10 in-lbs maximum
Weight: 0.08 oz., 2.24 g
BYV32, BYVF32 & BYVB32 Series
Vishay Semiconductors
formerly General Semiconductor
www.vishay.com
Document Number 88558
2
26-Mar-03
Maximum Ratings
(T
C
= 25°C unless otherwise noted)
Parameter
Symbol
BYV32-50 BYV32-100 BYV32-150 BYV32-200
Unit
Maximum repetitive peak reverse voltage
V
RRM
50
100
150
200
V
Maximum RMS voltage
V
RMS
35
70
105
140
V
Maximum DC blocking voltage
V
DC
50
100
150
200
V
Maximum average forward rectified current at T
C
= 125°C
I
F(AV)
18
A
Peak forward surge current
8.3ms single half sine-wave superimposed
I
FSM
150
A
on rated load (JEDEC Method) per leg
Operating junction and storage temperature range
T
J
, T
STG
65 to +150
°C
RMS Isolation voltage (BYVF type only) from terminals to
4500
(1)
heatsink with t = 1.0 second, RH
30%
V
ISOL
3500
(2)
V
1500
(3)
Electrical Characteristics
(T
C
= 25°C unless otherwise noted)
Parameter
Symbol
BYV32-50 BYV32-100 BYV32-150 BYV32-200
Unit
Maximum instantaneous forward voltage per leg at:
(4)
at I
F
= 20A
V
F
1.15
V
at I
F
= 5.0A, T
J
= 100°C
0.85
Maximum DC reverse current per leg
T
J
= 25°C
10
at rated DC blocking voltage
T
J
= 100°C
I
R
600
µ
A
Maximum reverse recovery time per leg at
I
F
= 1A, V
R
= 30V, di/dt = 100A/
µ
s, I
rr
= 10% I
RM
t
rr
25
ns
Typical junction capacitance per leg at 4V, 1MHz
C
J
45
pF
Thermal Characteristics
(T
C
= 25°C unless otherwise noted)
Parameter
Symbol
BYV
BYVF
BYVB
Unit
Thermal resistance from junction to case per leg
R
JC
1.6
5.0
1.6
°C/W
Notes:
(1) Clip mounting (on case), where lead does not overlap heatsink with 0.110" offset
(2) Clip mounting (on case), where leads do overlap heatsink
(3) Screw mounting with 4-40 screw, where washer diameter is
4.9mm (0.19")
(4) Pulse test: 300µs pulse width, 1% duty cycle
BYV32, BYVF32 & BYVB32 Series
Vishay Semiconductors
formerly General Semiconductor
Document Number 88558
www.vishay.com
26-Mar-03
3
Ratings and
Characteristic Curves
(T
A
= 25°C unless otherwise noted)
I
F
Instantaneous F
orw
ard Current (A)
100
10
I
R
Instantaneous Re
v
erse
Leakage Current (mA)
1
0.1
0.01
Maximum Non-Repetitive Peak
Forward Surge Current Per Leg
0
4.0
16
18
20
0
75
25
50
100
125
150
8.0
A
v
er
age F
orw
ard Rectified Current (A)
0
75
100
125
50
25
150
1
10
100
0.1
1
10
100
Resistive or Inductive Load
0.1
0.3
1.1
1.3
0.5
0.7
0.9
Pulse Width = 300
µ
s
1% Duty Cycle
T
J
= 150
°
C
10ms Single Half Sine-Wave
(JEDEC Method)
20
0
100
40
60
80
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Forward Voltage (V)
12
P
eak F
orw
ard Surge Current (A)
1
10
100
10
0
20
30
40
50
60
Reverse Voltage (V)
T
J
= 25
°
C
f = 1.0 MH
Z
V
sig
= 5mVp-p
pF
J
unction Capacitance
1000
T
C
= 100
°
C
Number of Cycles at 50 H
Z
T
J
= 125
°
C
T
J
= 25
°
C
Typical Instantaneous
Forward Characteristics Per Leg
Typical Reverse Leakage
Characteristics Per Leg
T
C
= 25
°
C
Forward Current Derating Curve
Case Ambient Temperature (
°
C)
Typical Junction Capacitance Per Leg
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