BY229, BY229X, BY229B Series
Vishay Semiconductors
formerly General Semiconductor
Document Number 88540
www.vishay.com
07-Oct-02
1
Fast Switching Plastic Rectifier
Reverse Voltage 200 to 800V
Forward Current 8.0A
0.08
(2.032)
0.24
(6.096)
0.42
(10.66)
0.63
(17.02)
0.12
(3.05)
0.33
(8.38)
Mounting Pad Layout TO-263AB
0.380 (9.65)
0.411 (10.45)
0.320 (8.13)
0.360 (9.14)
0.591 (15.00)
0.624 (15.85)
1
2
0.245 (6.22)
MIN
K
0.027 (0.686)
0.037 (0.940)
0.105 (2.67)
0.095 (2.41)
0.205 (5.20)
0.195 (4.95)
K
0.160 (4.06)
0.190 (4.83)
0.045 (1.14)
0.055 (1.40)
0.021 (0.53)
0.014 (0.36)
0.110 (2.79)
0.140 (3.56)
0.090 (2.29)
0.110 (2.79)
0.047 (1.19)
0.055 (1.40)
PIN 1
PIN 2
K - HEATSINK
0-0.01 (0-0.254)
0.060 (1.52)
0.405 (10.27)
0.383 (9.72)
0.191 (4.85)
0.171 (4.35)
0.600 (15.5)
0.580 (14.5)
0.560 (14.22)
0.530 (13.46)
0.037 (0.94)
0.027 (0.69)
0.140 (3.56)
0.130 (3.30)
0.350 (8.89)
0.330 (8.38)
0.188 (4.77)
0.172 (4.36)
0.110 (2.80)
0.100 (2.54)
0.131 (3.39)
0.122 (3.08)
0.110 (2.80)
0.100 (2.54)
0.022 (0.55)
0.014 (0.36)
0.205 (5.20)
0.195 (4.95)
1
2
PIN
DIA.
DIA.
PIN 1
PIN 2
0.676 (17.2)
0.646 (16.4)
ITO-220AC (BY229X Series)
TO-220AC (BY229 Series)
Dimensions in inches
and (millimeters)
TO-263AB (BY229B Series)
0.154 (3.91)
0.148 (3.74)
DIA.
0.113 (2.87)
0.103 (2.62)
0.185 (4.70)
0.175 (4.44)
0.055 (1.39)
0.045 (1.14)
0.145 (3.68)
0.135 (3.43)
0.350 (8.89)
0.330 (8.38)
0.160 (4.06)
0.140 (3.56)
0.037 (0.94)
0.027 (0.68)
0.205 (5.20)
0.195 (4.95)
0.560 (14.22)
0.530 (13.46)
0.022 (0.56)
0.014 (0.36)
0.110 (2.79)
0.100 (2.54)
1
2
1.148 (29.16)
1.118 (28.40)
0.105 (2.67)
0.095 (2.41)
0.410 (10.41)
0.390 (9.91)
0.635 (16.13)
0.625 (15.87)
0.603 (15.32)
0.573 (14.55)
PIN
0.415 (10.54) MAX.
PIN 1
PIN 2
CASE
0.370 (9.40)
0.360 (9.14)
Features
· Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
· Glass passivated chip junction
· Low leakage, high voltage
· High surge current capability
· Superfast recovery time, for high efficiency
· High temperature soldering guaranteed:
250°C, 0.25" (6.35mm) from case for 10 seconds
Mechanical Data
Case: JEDEC TO-220AC, ITO-220AC and TO-263AB
plastic body over passivated chip
Terminals: Plated leads, solderable per
MIL-STD-750, Method 2026
Polarity: As marked
Mounting Position: Any
Weight: 0.064 oz., 1.81 g
Mounting Torque: 10 in-lbs maximum
BY229, BY229X, BY229B Series
Vishay Semiconductors
formerly General Semiconductor
www.vishay.com
Document Number 88540
2
07-Oct-02
Maximum Ratings
(T
C
= 25°C unless otherwise noted)
Parameter
Symbol
BY229-200 BY229-400 BY229-600 BY229-800
Unit
Maximum recurrent peak reverse voltage
V
RRM
200
400
600
800
V
Maximum RMS voltage
V
RMS
140
280
420
560
V
Maximum DC blocking voltage
V
DC
200
400
600
800
V
Maximum average forward rectified current at T
C
=100°C
I
F(AV)
8.0
A
Peak forward surge current
8.3ms single half sine-wave superimposed
I
FSM
100
A
on rated load (JEDEC Method)
Maximum slope of reverse recovery current
I
F
=2.0A, V
R
=30V, di/dt=20A/
µ
s
dir/dt
60
A/
µ
s
Operating junction and storage temperature range
T
J
, T
STG
40 to +150
°C
RMS Isolation voltage from terminals to heatsink
4500
(Note 1)
with t = 1 second, RH
30% (BY229X only)
V
ISOL
3500
(Note 2)
V
1500
(Note 3)
Electrical Characteristics
(T
C
= 25°C unless otherwise noted)
Parameter
Symbol
BY229-200 BY229-400 BY229-600 BY229-800
Unit
Maximum instantaneous forward voltage at 20A
V
F
1.85
V
Maximum DC reverse current
at T
J
= 25°C
10
at rated DC blocking voltage
T
J
= 125°C
I
R
300
µ
A
Maximum reverse recovery time at
I
F
=1.0A, V
R
=30V, di/dt=50A/
µ
s, I
rr
=10% I
RM
t
rr
145
ns
Maximum recovered stored charge
(Note 2)
I
F
=2.0A, V
R
=30V, di/dt=20A/
µ
s
Q
rr
700
nC
Thermal Characteristics
(T
C
= 25°C unless otherwise noted)
Parameter
Symbol
BY229
BY229X
BY229B
Unit
Typical thermal resistance, junction to case
R
JC
2.0
4.8
2.0
°C/W
Typical thermal resistance, junction to air
R
JA
20
--
20
°C/W
Notes:
(1) Clip mounting, where lead does not overlap heatsink with 0.110" offset.
(2) Clip mounting, where leads do overlap heatsink.
(3) Screw mounting with 4-40 screw, where washer diameter is
4.9 mm (0.19").
I
F
Instantaneous F
orw
ard Current (A)
100
10
I
R
Instantaneous Re
v
erse
Leakage Current (
µ
A)
1
0.1
Forward Current Derating Curve
Maximum Non-Repetitive Peak
Forward Surge Current
0
4.0
12
0
75
25
50
100
125
150
8.0
A
v
er
age F
orw
ard Rectified Current (A)
0
75
100
125
50
25
150
1
10
100
Case Ambient Temperature (
°
C)
0.1
1
10
100
0.01
100
°
C
25
°
C
Resistive or Inductive Load
0.4
0.6
1.4
1.6
1.8
2.0
0.8
1.0
1.2
Pulse Width = 300
µ
s
1% Duty Cycle
T
L
= 75
°
C
8.3ms Single Half Sine-Wave
(JEDEC Method)
20
0
100
40
60
80
Percent of Rated Peak Reverse Voltage (%)
Typical Instantaneous
Forward Characteristics
Instantaneous Forward Voltage (V)
2.0
6.0
10
T
J
= 25
°
C
125
°
C
P
eak F
orw
ard Surge Current (A)
1
10
100
100
10
Reverse Voltage (V)
T
J
= 25
°
C
f = 1.0 MH
Z
V
sig
= 50mVp-p
Typical Junction Capacitance
pF
J
unction Capacitance
T
J
= 100
°
C
T
J
= 150
°
C
T
J
= 125
°
C
1000
T
J
= 150
°
C
Typical Reverse Leakage Characteristics
Number of Cycles at 60 H
Z
BY229, BY229X, BY229B Series
Vishay Semiconductors
formerly General Semiconductor
Document Number 88540
www.vishay.com
07-Oct-02
3
Ratings and
Characteristic Curves
(T
A
= 25°C unless otherwise noted)
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