FEATURES

ANALOG FEATURES

24 Bits No Missing Codes

22 Bits Effective Resolution at 10Hz

- Low Noise: 75nV

PGA From 1 to 128

Precision On-Chip Voltage Reference

- Accuracy: 0.2%
- Drift: 5ppm/

8 Differential/Single-Ended Channels

On-Chip Offset/Gain Calibration

Offset Drift: 0.02ppm/

Gain Drift: 0.5ppm/

On-Chip Temperature Sensor

Selectable Buffer Input

Burnout Detect

16-Bit Monotonic Voltage DACS:

- Quad Voltage DACs (MSC1211, MSC1212)
- Dual Voltage DACs (MSC1213, MSC1214)

DIGITAL FEATURES

Microcontroller Core

8051-Compatible

High-Speed Core

- 4 Clocks per Instruction Cycle

DC to 40MHz at +85

Single Instruction 100ns

Dual Data Pointer

Memory

Up To 32kB Flash Memory

Flash Memory Partitioning

Endurance 1M Erase/Write Cycles,
100-Year Data Retention

In-System Serially Programmable

External Program/Data Memory (64kB)

1,280 Bytes Data SRAM

Flash Memory Security

2kB Boot ROM

Programmable Wait State Control

Peripheral Features

34 I/O Pins

Additional 32-Bit Accumulator

Three 16-Bit Timer/Counters

System Timers

Programmable Watchdog Timer

Full-Duplex Dual USARTs

Master/Slave SPI

with DMA

Multi-master I

(MSC1211 and MSC1213)

16-Bit PWM

Power Management Control

Internal Clock Divider

Idle Mode Current < 200

Stop Mode Current < 100nA

Programmable Brownout Reset

Programmable Low-Voltage Detect

21 Interrupt Sources

Two Hardware Breakpoints

GENERAL FEATURES

Pin-Compatible with MSC1210

Package: TQFP-64

Low Power: 4mW

Industrial Temperature Range:
-40

C to +125

Power Supply: 2.7V to 5.25V

APPLICATIONS

Industrial Process Control

Instrumentation

Liquid/Gas Chromatography

Blood Analysis

Smart Transmitters

Portable Instruments

Weigh Scales

Pressure Transducers

Intelligent Sensors

Portable Applications

DAS Systems

MSC1211, MSC1212

MSC1213, MSC1214

SBAS323D - JUNE 2004 - REVISED SEPTEMBER 2005

Precision Analog to Digital Converter (ADC)

and Digital to Analog Converters (DACs)

with 8051 Microcontroller and Flash Memory

www.ti.com

2004-2005, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.

I2C is a trademark of Philips corporation. SPI is a trademark of Motorola Inc. All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date. Products

conform to specifications per the terms of Texas Instruments standard warranty.

Production processing does not necessarily include testing of all parameters.

MSC1211, MSC1212

MSC1213, MSC1214

SBAS323D - JUNE 2004 - REVISED SEPTEMBER 2005

www.ti.com

PACKAGE/ORDERING INFORMATION

(1)

PRODUCT

FLASH

MEMORY

16-BIT

DACS

I2C

PACKAGE-LEAD

PACKAGE

DESIGNATOR

SPECIFIED

TEMPERATURE

RANGE

PACKAGE

MARKING

MSC1211Y2

TQFP-64

PAG

-40

C to +125

MSC1211Y2

MSC1211Y3

TQFP-64

PAG

-40

C to +125

MSC1211Y3

MSC1211Y4

16k

TQFP-64

PAG

-40

C to +125

MSC1211Y4

MSC1211Y5

32k

TQFP-64

PAG

-40

C to +125

MSC1211Y5

MSC1212Y2

TQFP-64

PAG

-40

C to +125

MSC1212Y2

MSC1212Y3

TQFP-64

PAG

-40

C to +125

MSC1212Y3

MSC1212Y4

16k

TQFP-64

PAG

-40

C to +125

MSC1212Y4

MSC1212Y5

32k

TQFP-64

PAG

-40

C to +125

MSC1212Y4

MSC1213Y2

TQFP-64

PAG

-40

C to +125

MSC1213Y2

MSC1213Y3

TQFP-64

PAG

-40

C to +125

MSC1213Y3

MSC1213Y4

16k

TQFP-64

PAG

-40

C to +125

MSC1213Y4

MSC1213Y5

32k

TQFP-64

PAG

-40

C to +125

MSC1213Y5

MSC1214Y2

TQFP-64

PAG

-40

C to +125

MSC1214Y2

MSC1214Y3

TQFP-64

PAG

-40

C to +125

MSC1214Y3

MSC1214Y4

16k

TQFP-64

PAG

-40

C to +125

MSC1214Y4

MSC1214Y5

32k

TQFP-64

PAG

-40

C to +125

MSC1214Y5

(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this datasheet, or refer to our

web site at www.ti.com.

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause the device not to meet its published specifications.

ABSOLUTE MAXIMUM RATINGS

(1)

MSC1211/12/13/14

UNITS

Analog Inputs

Input current

Momentary

100

Input current

Continuous

Input voltage

AGND - 0.3 to AVDD + 0.3

Power Supply

DVDD to DGND

-0.3 to +6

AVDD to AGND

-0.3 to +6

AGND to DGND

-0.3 to +0.3

VREF to AGND

-0.3 to AVDD + 0.3

Digital input voltage to DGND

-0.3 to DVDD + 0.3

Digital output voltage to DGND

-0.3 to DVDD + 0.3

Maximum junction temperature (TJ Max)

+150

Operating temperature range

-40 to +125

Storage temperature range

-65 to +150

Lead temperature (soldering, 10s)

+235

Junction to ambient (

JA)

High K (2s 2p)

48.9

C/W

Thermal resistance

Junction to ambient (

JA)

Low K (1s)

72.9

C/W

Thermal resistance

Junction to case (

JC)

12.2

C/W

Package power dissipation

(TJ Max - TAMBIENT)/

Output current, all pins

200

Output pin short-circuit

Digital Outputs

Output current

Continuous

100

I/O source/sink current

100

Power pin maximum

300

(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for

extended periods may affect device reliability.

MSC1211, MSC1212

MSC1213, MSC1214

SBAS323D - JUNE 2004 - REVISED SEPTEMBER 2005

www.ti.com

MSC121xYX FAMILY FEATURES

FEATURES(1)

MSC121xY2

(2)

MSC121xY3

(2)

MSC121xY4

(2)

MSC121xY5

(2)

Flash Program Memory (Bytes)

Up to 4k

Up to 8k

Up to 16k

Up to 32k

Flash Data Memory (Bytes)

Up to 4k

Up to 8k

Up to 16k

Up to 32k

Internal Scratchpad SRAM (Bytes)

256

Internal MOVX RAM (Bytes)

1024

Externally Accessible Memory (Bytes)

64k Program, 64k Data

(1) All peripheral features are the same on all devices; the flash memory size is the only difference.
(2) The last digit of the part number (N) represents the onboard flash size = (2

)kBytes.

ELECTRICAL CHARACTERISTICS: AV

= 5V

All specifications from TMIN to TMAX, DVDD = +2.7V to 5.25V, AVDD = +5V, fMOD = 15.625kHz, PGA = 1, filter = Sinc3, Buffer ON, fDATA = 10Hz, Bipolar, fCLK = 8MHz,
and VREF

(REF IN+) - (REF IN-) = +2.5V, unless otherwise noted. For VDAC, VREF = AVDD, RLOAD = 10k

, and CLOAD = 200pF, unless otherwise noted.

MSC1211/12/13/14

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Analog Inputs (AIN0-AIN7, AINCOM)

Analog Input Range

Buffer OFF

AGND - 0.1

AVDD + 0.1

Analog Input Range

Buffer ON

AGND + 50mV

AVDD - 1.5

Full-Scale Input Voltage Range

(AIN+) - (AIN-)

VREF/PGA

Differential Input Impedance

Buffer OFF

7/PGA(1)

Input Current

Buffer ON

0.5

Fast Settling Filter

-3dB

0.469

DATA

Bandwidth

Sinc2 Filter

-3dB

0.318

DATA

Bandwidth

Sinc3 Filter

-3dB

0.262

DATA

Programmable Gain Amplifier

User-Selectable Gain Range

128

Input Capacitance

Buffer ON

Input Leakage Current

Multiplexer Channel ON, T = +25

0.5

Burnout Current Sources

Buffer ON

ADC Offset DAC

Offset DAC Range

Bipolar Mode

REF

/(2

PGA)

Offset DAC Monotonicity

Bits

Offset DAC Gain Error

1.5

% of Range

Offset DAC Gain Error Drift

ppm/

System Performance

Resolution

Bits

ENOB

See Typical Characteristics

Bits

Output Noise

See Typical Characteristics

No Missing Codes

Sinc

Filter, Decimation >360

Bits

Integral Nonlinearity

End Point Fit, Bipolar Mode

0.0015

%FSR

Offset Error

After Calibration

3.5

ppm of FS

Offset Drift(2)

Before Calibration

0.001

ppm of FS/

Gain Error(3)

After Calibration

-0.002

Gain Error Drift(2)

Before Calibration

0.5

ppm/

System Gain Calibration Range

120

% of FS

System Offset Calibration Range

-50

% of FS

At DC

115

Common-Mode Rejection

fCM = 60Hz, fDATA = 10Hz

130

Common-Mode Rejection

fCM = 50HZ, fDATA = 50Hz

120

fCM = 60Hz, fDATA = 60Hz

120

Normal-Mode Rejection

fSIG = 50Hz, fDATA = 50Hz

100

Normal-Mode Rejection

fSIG = 60Hz, fDATA = 60Hz

100

Power-Supply Rejection

At DC, dB = -20log(

VOUT/

VDD)(4)

(1) The input impedance for PGA = 128 is the same as that for PGA = 64 (that is, 7M

/64).

(2) Calibration can minimize these errors.
(3) The self gain calibration cannot have a REF IN+ of more than AV

-1.5V with Buffer ON. To calibrate gain, turn Buffer OFF.

(4)

VOUT is change in digital result.

(5) 9pF switched capacitor at f

SAMP

clock frequency (see Figure 14).

(6) Linearity calculated using a reduced code range of 512 to 65024; output unloaded.
(7) Ensured by design and characterization; not production tested.
(8) Analog Brownout Detect OFF (HCR1.3 = 1), Analog LVD OFF (LVDCON.7 = 1).

MSC1211, MSC1212

MSC1213, MSC1214

SBAS323D - JUNE 2004 - REVISED SEPTEMBER 2005

www.ti.com

ELECTRICAL CHARACTERISTICS: AV

= 5V (continued)

All specifications from TMIN to TMAX, DVDD = +2.7V to 5.25V, AVDD = +5V, fMOD = 15.625kHz, PGA = 1, filter = Sinc3, Buffer ON, fDATA = 10Hz, Bipolar, fCLK = 8MHz,
and VREF

(REF IN+) - (REF IN-) = +2.5V, unless otherwise noted. For VDAC, VREF = AVDD, RLOAD = 10k

, and CLOAD = 200pF, unless otherwise noted.

MSC1211/12/13/14

PARAMETER

UNITS

MAX

TYP

MIN

CONDITIONS

Voltage Reference Inputs

Reference Input Range

REF IN+, REF IN-

AGND

AVDD(3)

VREF

(REF IN+) - (REF IN-)

0.1

2.5

AVDD

VREF Common-Mode Rejection

At DC

110

Input Current(5)

VREF = 2.5V, ADC Only

DAC Reference Input Resistance

For Each DAC, PGA = 1

On-Chip Voltage Reference

Output Voltage

VREFH = 1 at +25

C, REFCLK = 250kHz

2.495

2.5

2.505

Output Voltage

VREFH = 0 at +25

C, REFCLK = 250kHz

1.25

Power-Supply Rejection Ratio

Short-Circuit Current Source

2.6

Short-Circuit Current Sink

Short-Circuit Duration

Sink or Source

Indefinite

Drift

ppm/

Output Impedance

Sourcing 100

Startup Time from Power ON

CREFOUT = 0.1

Temperature Sensor Voltage

Buffer ON, T = +25

115

Temperature Sensor Coefficient

Buffer ON

375

Voltage DAC Static Performance(6)

Resolution

Bits

Relative Accuracy

0.05

0.146

Differential Nonlinearity

Ensured Monotonic by Design

LSB

Zero Code Error

All 0s Loaded to DAC Register

+13

+35

Full-Scale Error

All 1s Loaded to DAC Register

-1.25

% of FSR

Gain Error

-1.25

+1.25

% of FSR

Zero Code Error Drift

Gain Temperature Coefficient

ppm of FSR/

Voltage DAC Output Characteristics(7)

Output Voltage Range

REF IN+ = AVDD

AGND

AVDD

Output Voltage Settling Time

0.003% FSR, 0200h to FD00h

Slew Rate

DC Output Impedance

Short-Circuit Current

All 1s Loaded to DAC Register

IDAC Output Characteristics

Full-Scale Output Current

Maximum VREF = 2.5V

Maximum Short-Circuit Current Duration

Indefinite

Compliance Voltage

AVDD - 1.5

Relative Accuracy

0.185

% of FSR

Zero Code Error

All 0s Loaded to DAC Register

0.5

Full-Scale Error

All 1s Loaded to DAC Register

-0.4

% of FSR

Gain Error

-0.6

% of FSR

(1) The input impedance for PGA = 128 is the same as that for PGA = 64 (that is, 7M

/64).

(2) Calibration can minimize these errors.
(3) The self gain calibration cannot have a REF IN+ of more than AV

-1.5V with Buffer ON. To calibrate gain, turn Buffer OFF.

(4)

VOUT is change in digital result.

(5) 9pF switched capacitor at f

SAMP

clock frequency (see Figure 14).

MSC1211, MSC1212

MSC1213, MSC1214

SBAS323D - JUNE 2004 - REVISED SEPTEMBER 2005

www.ti.com

ELECTRICAL CHARACTERISTICS: AV

= 5V (continued)

All specifications from TMIN to TMAX, DVDD = +2.7V to 5.25V, AVDD = +5V, fMOD = 15.625kHz, PGA = 1, filter = Sinc3, Buffer ON, fDATA = 10Hz, Bipolar, fCLK = 8MHz,
and VREF

(REF IN+) - (REF IN-) = +2.5V, unless otherwise noted. For VDAC, VREF = AVDD, RLOAD = 10k

, and CLOAD = 200pF, unless otherwise noted.

MSC1211/12/13/14

PARAMETER

UNITS

MAX

TYP

MIN

CONDITIONS

Analog Power-Supply Requirements

Analog Power-Supply Voltage

AVDD

4.75

5.25

Analog Off Current(8)

Analog OFF, PDCON = 48h

< 1

PGA = 1, Buffer OFF

200

Analog

ADC Current (IADC)

PGA = 128, Buffer OFF

500

Analog
Power-Supply

ADC Current (IADC)

PGA = 1, Buffer ON

240

Power-Supply
Current

PGA = 128, Buffer ON

850

Current

VDAC Current (IVDAC)

Excluding Load Current, External Reference

250

VREF Supply Current
(IVREF)

ADC ON, VDAC OFF

250

(1) The input impedance for PGA = 128 is the same as that for PGA = 64 (that is, 7M

/64).

(2) Calibration can minimize these errors.
(3) The self gain calibration cannot have a REF IN+ of more than AV

-1.5V with Buffer ON. To calibrate gain, turn Buffer OFF.

(4)

VOUT is change in digital result.

(5) 9pF switched capacitor at f

SAMP

clock frequency (see Figure 14).

ELECTRICAL CHARACTERISTICS: AV

= 3V

All specifications from TMIN to TMAX, DVDD = +2.7V to 5.25V, AVDD = +3V, fMOD = 15.625kHz, PGA = 1, filter = Sinc3, Buffer ON, fDATA = 10Hz, Bipolar, fCLK = 8MHz,
and VREF

(REF IN+) - (REF IN-) = +1.25V, unless otherwise noted. For VDAC, VREF = AVDD, RLOAD = 10k

, and CLOAD = 200pF, unless otherwise noted.

MSC1211/12/13/14

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Analog Inputs (AIN0-AIN7, AINCOM)

Analog Input Range

Buffer OFF

AGND - 0.1

AVDD + 0.1

Analog Input Range

Buffer ON

AGND + 50mV

AVDD - 1.5

Full-Scale Input Voltage Range

(AIN+) - (AIN-)

VREF/PGA

Differential Input Impedance

Buffer OFF

7/PGA

(1)

Input Current

Buffer ON

0.5

Fast Settling Filter

-3dB

0.469

fDATA

Bandwidth

Sinc2 Filter

-3dB

0.318

fDATA

Bandwidth

Sinc3 Filter

-3dB

0.262

fDATA

Programmable Gain Amplifier

User-Selectable Gain Range

128

Input Capacitance

Buffer ON

Input Leakage Current

Modulator OFF, T = +25

0.5

Burnout Current Sources

Sensor Input Open Circuit

(1) The input impedance for PGA = 128 is the same as that for PGA = 64 (that is, 7M

/64).

(2) Calibration can minimize these errors.
(3) The gain calibration cannot have a REF IN+ of more than AVDD -1.5V with Buffer ON. To calibrate gain, turn Buffer OFF.

(4)

VOUT is change in digital result.

(5) 9pF switched capacitor at fSAMP clock frequency (see Figure 14).

Part Number MSC1213