Optimized for mobile terminals, the BRF6300 from Texas Instruments (TI) is a
highly integrated, digital CMOS, single-chip solution supporting Bluetooth
®
Specification v1.2. The new chip is based on TI's prior generation BRF6150,
leveraging and exceeding its capabilities to provide maximum Enhanced
Data Rate (EDR) support and lowest power consumption in most Bluetooth
scenarios. The BRF6300 requires a small number of external components,
offers enhanced WLAN co-existence algorithms and is software
upgradeable to support future Bluetooth technology enhancements.
P R O D U C T B U L L E T I N
BRF6300: Bluetooth
®
Specification v1.2 + Enhanced
Data Rate, single-chip solution
Key benefits:
· Best cost and performance Bluetooth ®
wireless technology solution
· Supports specifications v1.2 and
Enhanced Data Rate single-chip
solutions for mobile terminals
· Industry best power management
including lowest power consumption,
direct connection to battery (up to
5.4 V) and shut-down (6 µA) to enable
market's longest talk, standby and
shut-down times
· Complete solutions for faster time-to
market and integration cost savings
Complete set of reference designs
with TI's OMAPTM processors and
TCS cellular chipsets
WLAN coexistence solution
· Based on TI's cutting-edge
90-nm CMOS and Digital RF
Processor (DRP) technology
Overview
Technology for Innovators
TM
2
TI's BRF6300 integrates the Bluetooth baseband, RF transceiver, ARM7TDMI
®
,
memory (ROM and RAM) and power management on one chip. The BRF6300
utilizes TI's Digital RF Processor (DRP) technology, a revolution in RF technolo-
gy offering major advantages over the existing solutions based on analog RF.
All-digital single-chip benefits include increased scalability, lower power
consumption, reduced size and ultimately lower cost.
The single-chip BRF6300 is optimized for mobile terminals delivering the RF
performance and ease of integration required by manufactures. TI's advanced
process and novel design enables the BRF6300 to connect directly to the
battery (up to 5.4 V). This saves the cost and space of an external regulator
and simplifies the interface and integration with the host by separating their
power management entities.
The BRF6300 is pre-integrated in complete reference designs with TI's TCS
chipsets and OMAPTM processors. The single chip combines TI's industry
proven collaborative coexistence mechanism with Bluetooth Specification v1.2
adaptive frequency hopping (AFH) and extended Synchronous Connection
Oriented (eSCO). This delivers a high quality Bluetooth voice link and enhanced
WLAN data throughput when co-located into small mobile products such as
smartphones and wireless PDAs.
Digital
3
· Enhanced Data Rate: 2 Mbps and 3 Mbps
· Full Bluetooth Specification v1.2:
Including eSCO, AFH and faster connection
Based on BRF6150 and exceeds its leading
performance and features
· Support of SDIO 1 bit, byte basis mode
· Low power scan (Page and inquiry scan < 100 µA)
· Single reference design for all power supply options
(battery or external regulator)
· Improved power management:
Direct connection to battery: 1.7 V to 5.4 V
Extended LDO support range: 1.7 V to 5.4 V
Less external components
All external components' form factor <= 0.4 x 0.2
· Improved RF performance
Sensitivity: 90 dBm
Tx Power: 4 dBm (typical)
· Fast UART, up to 4 Mbps for full EDR support
· Highly optimized for mobile terminals:
Six external passive components
PCB layout area 45 mm
2
McBSP compatible I/F
Supports 12-MHz to 40-MHz FCLK signal
· Superior coexistence mechanisms:
Collaborative interface with TI's WLAN to
enable VoIPoWLAN and Bluetooth voice
Shared antenna with TI's mobile WLAN chipsets
Bluetooth Specification v1.2 AFH
· Enhanced Codec (PCM) I/F capabilities
· TI's Digital RF Processor technology enables:
Support for EDR Bluetooth technology
(DQPSK & 8PSK)
RF built-in-self-test (BIST)
· 1.8 v VIO
· Pin-to-pin backwards compatible with
BRF6150 1.8 v I/O
· Smaller package:
4.5 x 4.5 x 0.8 ROM
Microstar BGATM Ultra-Thin Package
· Complete reference designs with TI's TCS
cellular chipsets and OMAP processors
for fast time-to-market
· Manufactured in TI 90-nm CMOS advanced
process technology
BRF6300 key features
Important Notice: The products and services of Texas Instruments Incorporated and its subsidiaries described herein are sold subject to TI's standard terms and
conditions of sale. Customers are advised to obtain the most current and complete information about TI products and services before placing orders. TI assumes no
liability for applications assistance, customer's applications or product designs, software performance, or infringement of patents. The publication of information
regarding any other company's products or services does not constitute TI's approval, warranty or endorsement thereof.
SWMT008
Technology for Innovators, the black/red banner, OMAP and Microstar BGA are trademarks of Texas Instruments. The Bluetooth word mark and logos are owned by the
Bluetooth SIG, Inc., and any use of such marks by Texas Instruments is under license. All other trademarks are the property of their respective owners.
© 2004 Texas Instruments Incorporated
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Printed on recycled paper
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