TN2540-G
®
May 1998 - Ed: 5
SCR
Symbol
Parameter
Value
Unit
I
T(RMS)
RMS on-state current
(180
°
conduction angle)
Tc= 100
°
C
25
A
I
T(AV)
Average on-state current
(180
°
conduction angle)
Tc= 100
°
C
16
A
I
TSM
Non repetitive surge peak on-state current
tp = 8.3 ms
314
A
(Tj initial = 25°C)
tp = 10 ms
300
I
2
t
I
2
t Value for fusing
tp = 10ms
450
A
2
s
dI/dt
Critical rate of rise of on-state current
I
G
= 100 mA dI
G
/dt = 1 A/
µ
s.
100
A/
µ
s
T
stg
T
j
Storage junction temperature range
Operating junction temperature range
- 40 to + 150
- 40 to + 125
°
C
Tl
Maximum temperature for soldering during 10s
260
°
C
ABSOLUTE MAXIMUM RATINGS
D
2
PAK
HIGH SURGE CAPABILITY
HIGH ON-STATE CURRENT
HIGH STABILITY AND RELIABILITY
FEATURES
The TN2540 series of Silicon Controlled Rectifiers
uses a high performance glass passivated tech-
nology.
This SCR is designed for power supplies up to
400Hz on resistive or inductive load.
DESCRIPTION
K
A
G
A
Symbol
Parameter
TN2540-
Unit
600G
800G
V
DRM
V
RRM
Repetitive peak off-state voltage
Tj = 125°C
600
800
V
1/5
P
G (AV)
= 1W P
GM
= 10 W (tp = 20
µ
s) I
GM
= 4 A (tp = 20
µ
s) V
RGM
= 5 V
GATE CHARACTERISTICS
Symbol
Parameter
Value
Unit
Rth(j-a)
Junction to ambient (S=1cm
2
)
45
°
C/W
Rth(j-c)
Junction to case for D.C
1.0
°
C/W
THERMAL RESISTANCES
Symbol
Test Conditions
Type
Value
Unit
I
GT
V
D
= 12V (DC) R
L
= 33
Tj= 25
°
C
MIN
3
mA
MAX
40
V
GT
V
D
= 12V (DC) R
L
= 33
Tj= 25°C
MAX
1.3
V
V
GD
V
D
= V
DRM
R
L
= 3.3k
Tj= 125
°
C
MIN
0.2
V
I
H
I
T
= 200mA Gate open
Tj= 25
°
C
MAX
50
mA
I
L
I
G
= 1.2 I
GT
Tj= 25
°
C
MAX
90
mA
V
TM
I
TM
= 50A tp= 380
µ
s
Tj= 25
°
C
MAX
1.5
V
I
DRM
V
D
= V
DRM
Tj= 25
°
C
MAX
5
µ
A
I
RRM
V
R
= V
RRM
Tj= 125
°
C
MAX
4
mA
dV/dt
V
D
=67%V
DRM
Gate open
Tj= 125
°
C
MIN
500
V/
µ
s
ELECTRICAL CHARACTERISTICS
ORDERING INFORMATION
TN 25 40 - 600 G
SCR
CURRENT
PACKAGES :
G: D
2
PAK
VOLTAGE
SENSITIVITY
Add "-TR" suffix for Tape & Reel shipment
TN2540-G
2/5
0
25
50
75
100
125
0
5
10
15
20
25
30
I
(A)
T(AV)
D.C.
=180°
Tcase(°C)
Fig. 3: Average and D.C. on-state current versus
case temperature.
-40
-20
0
20
40
60
80
100
120
140
0.0
0.5
1.0
1.5
2.0
2.5
I ,I [Tj]/I ,I [Tj=25°C]
GT H
GT H
I
GT
I
H
Tj(°C)
Fig. 5: Relative variation of gate trigger current and
holding current versus junction temperature.
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2 5E+2
0.01
0.10
1.00
K=[Zth/Rth]
Zth(j-c)
Zth(j-a)
tp(s)
Fig. 4: Relative variation of thermal impedance
versus pulse duration.
1
10
100
1000
0
40
80
120
160
200
240
280
320
I
(A)
TSM
Tj initial=25°C
F=50Hz
Number of cycles
Fig. 6: Non repetitive surge peak on-state current
versus number of cycles.
0
5
10
15
20
25
0
5
10
15
20
25
P(W)
=180°
=120°
=90°
=60°
=30°
D.C.
I
(A)
T(AV)
Fig. 1: Maximum average power dissipation ver-
sus average on-state current .
0
20
40
60
80
100
120
140
0
5
10
15
20
25
P(W)
Tcase (°C)
125
=180°
Rth=0°C/W
Rth=1°C/W
Rth=2°C/W
Rth=3°C/W
100
105
110
115
120
Tamb(°C)
Fig. 2 : Correlation between maximum average
power dissipation and maximum allowable tem-
peratures (T
amb
and T
case
) for different thermal
resistances heatsink+contact.
TN2540-G
3/5
0
4
8
12
16
20
24
28
32
36
40
0
10
20
30
40
50
60
70
80
Rth(j-a) (°C/W)
S(Cu) (cm²)
Fig. 9: Thermal resistance junction to ambient ver-
sus copper surface under tab (Epoxy printed circuit
board FR4, copper thickness: 35
µ
m).
1
2
5
10
100
200
500
1000
I
(A),I²t(A²s)
TSM
Tj initial=25°C
I
TSM
I²t
tp(ms)
Fig. 7: Non repetitive surge peak on-state current
for a sinusoidal pulse with width tp<10ms, and cor-
responding value of I
2
t.
0
1
2
3
4
5
1
10
100
300
I (A)
TM
Tj=25°C
Tj=Tj max.
Tj max.:
Vto=0.77V
Rt=14m
V (V)
TM
Fig. 8: On-state characteristics (maximum values).
0
40
80
120
160
200
240
280
320 360
T (°C)
250
200
150
100
50
0
Epoxy FR4
board
Metal-backed
board
245°C
215°C
t (s)
Fig. 10: Typical reflow soldering heat profile, either
for mounting on FR4 or metal-backed boards.
TN2540-G
4/5
PACKAGE MECHANICAL DATA
D
2
PAK
A
C2
D
R
2.0 MIN.
FLAT ZONE
A2
V2
C
A1
G
L
L3
L2
B
B2
E
REF.
DIMENSIONS
Millimeters
Inches
Min.
Typ. Max. Min.
Typ. Max.
A
4.30
4.60 0.169
0.181
A1
2.49
2.69 0.098
0.106
A2
0.03
0.23 0.001
0.009
B
0.70
0.93 0.027
0.037
B2
1.25
1.40
0.048 0.055
C
0.45
0.60 0.017
0.024
C2
1.21
1.36 0.047
0.054
D
8.95
9.35 0.352
0.368
E
10.00
10.28 0.393
0.405
G
4.88
5.28 0.192
0.208
L
15.00
15.85 0.590
0.624
L2
1.27
1.40 0.050
0.055
L3
1.40
1.75 0.055
0.069
R
0.40
0.016
V2
0°
8°
0°
8°
MARKING: TN2540
x00G
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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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8.90
3.70
1.30
5.08
16.90
10.30
FOOT PRINT DIMENSIONS (in millimeters)
TN2540-G
5/5
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