May 1992

Philips Semiconductors

Product specification

FM radio circuit for MTS

TDA7021T

GENERAL DESCRIPTION

The TDA7021T integrated radio receiver circuit is for portable radios, stereo as well as mono, where a minimum of
periphery is important in terms of small dimensions and low cost. It is fully compatible for applications using the
low-voltage micro tuning system (MTS). The IC has a frequency locked loop (FLL) system with an intermediate frequency
of 76 kHz. The selectivity is obtained by active RC filters. The only function to be tuned is the resonant frequency of the
oscillator. Interstation noise as well as noise from receiving weak signals is reduced by a correlation mute system.

Special precautions have been taken to meet local oscillator radiation requirements. Because of the low intermediate
frequency, low pass filtering of the MUX signal is required to avoid noise when receiving stereo. 50 kHz roll-off
compensation, needed because of the low pass characteristic of the FLL, is performed by the integrated LF amplifier.
For mono application this amplifier can be used to directly drive an earphone. The field-strength detector enables
field-strength dependent channel separation control.

Features

RF input stage

Mixer

Local oscillator

IF amplifier/limiter

Frequency detector

Mute circuit

MTS compatible

Loop amplifier

Internal reference circuit

LF amplifier for

mono earphone amplifier or

MUX filter

Field-strength dependent channel separation control
facility

QUICK REFERENCE DATA

PACKAGE OUTLINE

16-lead mini-pack; plastic (SO 16; SOT109A); SOT109-1; 1996 July 24.

PARAMETER

CONDITIONS

SYMBOL

MIN.

TYP.

MAX.

UNIT

Supply voltage (pin 4)

= V

4-3

1,8

6,0

Supply current

= 3 V

6,3

RF input frequency

1,5

110

MHz

Sensitivity (e.m.f.) for

source impedance = 75

;

3 dB limiting

mute disabled

EMF

Signal handling (e.m.f.)

source impedance = 75

EMF

200

AF output voltage

May

1992

Philips Semiconductors

Product specification

FM radio circuit for MTS

TDA7021T

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Fig.1 Block diagram.

May 1992

Philips Semiconductors

Product specification

FM radio circuit for MTS

TDA7021T

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

THERMAL RESISTANCE

DC CHARACTERISTICS

= 3 V, T

amb

= 25

C, measured in circuit of Fig.4, unless otherwise specified

PARAMETER

CONDITIONS

SYMBOL

MIN.

MAX.

UNIT

Supply voltage (pin 4)

= V

4-3

7,0

Oscillator voltage

5-4

0,5

Storage temperature range

stg

150

Operating ambient temperature range

amb

From junction to ambient

th j-a

300

K/W

PARAMETER

CONDITIONS

SYMBOL

MIN.

TYP.

MAX.

UNIT

Supply voltage (pin 4)

= V

4-3

1,8

3,0

6,0

Supply current

= 3 V

6,3

Oscillator current

250

Voltage at pin 13

13-3

0,9

Output voltage (pin 14)

14-3

1,3

Fig.2 Supply current as a function of the supply voltage.

May 1992

Philips Semiconductors

Product specification

FM radio circuit for MTS

TDA7021T

AC CHARACTERISTICS (MONO OPERATION)

= 3 V; T

amb

= 25

C; measured in Fig.5; f

= 96 MHz modulated with

f =

22,5 kHz; f

= 1 kHz; EMF = 0,3 mV

(e.m.f. at a source impedance of 75

); r.m.s. noise voltage measured unweighted (f = 300 Hz to 20 kHz); unless

otherwise specified

PARAMETER

CONDITIONS

SYMBOL

MIN.

TYP.

MAX.

UNIT

Sensitivity (e.m.f.)

see Fig.3

for

3 dB limiting

muting disabled

EMF

4,0

for

3 dB muting

EMF

5,0

for (S

N)/N = 26 dB

EMF

7,0

Signal handling (e.m.f.)

THD < 10%;

f =

75 kHz

EMF

200

Signal-to-noise ratio

(S+N)/N

Total harmonic distortion

f =

22,5 kHz

THD

0,7

f =

75 kHz

THD

2,3

AM suppression of output

voltage

ratio of AM signal

= 1 kHz; m = 80%)

to FM signal (f

1 kHz;

f = 75 kHz)

AMS

Ripple rejection

= 100 mV;

f = 1 kHz

Oscillator voltage (r.m.s. value)

5-4(rms)

250

Variation of oscillator frequency

with temperature

= 1 V

kHz/

Selectivity

see Fig.9;

no modulation

300

AFC range

160

kHz

Mute range

120

kHz

Audio bandwidth

= 3 dB;

measured with 50

pre-emphasis

kHz

AF output voltage

(r.m.s. value)

(pin 14) = 100

o(rms)

AF output current

max. d.c. load

o(dc)

100

max. a.c. load (peak value)

THD = 10%

o(ac)

osc

amb

-----------------

May 1992

Philips Semiconductors

Product specification

FM radio circuit for MTS

TDA7021T

Fig.3 Field strength voltage (V

9-3

) at R

source

= 1 k

; f = 96,75 MHz; V

= 3 V.

Fig.4

Mono operation: AF output voltage (V

) and total harmonic distortion (THD) as functions of input e.m.f.

(EMF); R

source

= 75

; f

= 96 MHz; 0 dB = 90 mV. For S+N and noise curves (1) is with muting enabled

and (2) is with muting disabled; signal

f =

22,5 kHz and f

= 1 kHz. For THD curve,

f =

75 kHz and

= 1 kHz.

May 1992

Philips Semiconductors

Product specification

FM radio circuit for MTS

TDA7021T

1) The AF output can be decreased by disconnecting the 100 nF capacitor from pin 16.

Fig.5 Test circuit for mono operation.

AC CHARACTERISTICS (STEREO OPERATION)

= 3 V; T

amb

= 25

C; measured in Fig.8; f

= 96 MHz modulated with pilot

f =

6,75 kHz and AF signal

f =

22,5 kHz; f

= 1 kHz; EMF = 1 mV (e.m.f. at a source impedance of 75

); r.m.s. noise voltage measured

unweighted (f = 300 Hz to 20 kHz); unless otherwise specified

PARAMETER

CONDITIONS

SYMBOL

MIN.

TYP.

MAX.

UNIT

Sensitivity (e.m.f.)

for (S

N)/N = 26 dB

see Fig.8; pilot off

EMF

Selectivity

see Fig.9; no modulation

+300

300

Signal-to-noise ratio

(S+N)/N

Channel separation

= L-signal; f

= 1 kHz; pilot on:

at f

= 97 MHz

at f

= 87,5 MHz and 108 MHz

May 1992

Philips Semiconductors

Product specification

FM radio circuit for MTS

TDA7021T

Note to Fig. 9

This test set-up is to incorporate the circuit of Fig.5 for mono operation or the circuit of Fig.8 for stereo operation.
For either circuit, replace the 100 nF capacitor at pin 6 with R6 (100 k

) as shown above.

Selectivity

+300

= 20 log

| (300 kHz

)

300

= 20 log

| (300 kHz + f

)

| f

Fig.9 Test set-up; V

= 30 mV; f

= 76 kHz; selective voltmeter at output has R

1 M

and C

8 pF; f

= f

May 1992

Philips Semiconductors

Product specification

FM radio circuit for MTS

TDA7021T

PACKAGE OUTLINE

detail X

(A )

pin 1 index

UNIT

max.

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

inches

1.75

0.25
0.10

1.45
1.25

0.25

0.49
0.36

0.25
0.19

10.0

9.8

4.0
3.8

1.27

6.2
5.8

0.7
0.6

0.7
0.3

8
0

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.0
0.4

SOT109-1

95-01-23
97-05-22

076E07S

MS-012AC

0.069

0.010
0.004

0.057
0.049

0.01

0.019
0.014

0.0100
0.0075

0.39
0.38

0.16
0.15

0.050

1.05

0.041

0.244
0.228

0.028
0.020

0.028
0.012

0.01

0.25

0.01

0.004

0.039
0.016

2.5

5 mm

scale

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

May 1992

Philips Semiconductors

Product specification

FM radio circuit for MTS

TDA7021T

SOLDERING

Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"IC Package Databook" (order code 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45

Wave soldering

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

The longitudinal axis of the package footprint must be
parallel to the solder flow.

The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260

C, and

maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150

C within

6 seconds. Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300

C. When

using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320

May 1992

Philips Semiconductors

Product specification

FM radio circuit for MTS

TDA7021T

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Part Number TDA7021T