1999 Aug 05

Philips Semiconductors

Product specification

Remote 16-bit I/O expander for I

C-bus

PCF8575C

FEATURES

Operating supply voltage from 4.5 to 5.5 V

Low standby current consumption of 10

A maximum

C-bus to parallel port expander

400 kbits/s FAST I

C-bus

Open-drain interrupt output

16-bit remote I/O port for the I

C-bus

Compatible with most microcontrollers

Latched outputs with high current drive capability for
directly driving LEDs

Address by 3 hardware address pins for use of up to
8 devices

SSOP24 package.

GENERAL DESCRIPTION

The device is a silicon CMOS circuit. It provides general
purpose remote I/O expansion for most microcontroller
families via the two-line bidirectional bus (I

C-bus).

The device consists of a 16-bit quasi-bidirectional port and
an I

C-bus interface. The PCF8575C has a low current

consumption and includes latched outputs with high
current drive capability for directly driving LEDs. It also
possesses an interrupt line (INT) which can be connected
to the interrupt logic of the microcontroller. By sending an
interrupt signal on this line, the remote I/O can inform the
microcontroller if there is incoming data on its ports without
having to communicate via the I

C-bus. This means that

the device is an I

C-bus slave transmitter/receiver.

Every data transmission from the PCF8575C must consist
of an even number of bytes, the first byte will be referred
to as P07 to P00 and the second byte as P17 to P10. The
third will be referred to as P07 to P00 and so on.

ORDERING INFORMATION

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

PCF8575CTS

SSOP24

plastic shrink small outline package; 24 leads; body width 5.3 mm

SOT340-1

1999 Aug 05

Philips Semiconductors

Product specification

Remote 16-bit I/O expander for I

C-bus

PCF8575C

PINNING

SYMBOL

PIN

DESCRIPTION

INT

interrupt output (active LOW)

address input 1

address input 2

P00

quasi-bidirectional I/O 00

P01

quasi-bidirectional I/O 01

P02

quasi-bidirectional I/O 02

P03

quasi-bidirectional I/O 03

P04

quasi-bidirectional I/O 04

P05

quasi-bidirectional I/O 05

P06

quasi-bidirectional I/O 06

P07

quasi-bidirectional I/O 07

supply ground

P10

quasi-bidirectional I/O 10

P11

quasi-bidirectional I/O 11

P12

quasi-bidirectional I/O 12

P13

quasi-bidirectional I/O 13

P14

quasi-bidirectional I/O 14

P15

quasi-bidirectional I/O 15

P16

quasi-bidirectional I/O 16

P17

quasi-bidirectional I/O 17

address input 0

SCL

serial clock line input

SDA

serial data line input/output

supply voltage

handbook, halfpage

PCF8575C

MGS631

INT

P00

P01

P02

P03

P04

P05

P06

P07

VSS

VDD

SDA

SCL

P17

P16

P15

P14

P13

P12

P11

P10

Fig.2 Pin configuration.

1999 Aug 05

Philips Semiconductors

Product specification

Remote 16-bit I/O expander for I

C-bus

PCF8575C

FUNCTIONAL DESCRIPTION

6.1

Quasi-bidirectional I/Os

The 16 ports (see Fig.3) are entirely independent and can be used either as input or output ports. Input data is transferred
from the ports to the microcontroller in the READ mode (see Fig.6). Output data is transmitted to the ports in the WRITE
mode (see Fig.5).

This quasi-bidirectional I/O can be used as an input or output without the use of a control signal for data direction.
At power-on all the I/Os are in 3-state mode. The strong pull-up to V

OHt

) allows a fast rising edge into a heavily

loaded output. This strong pull-up turns on when the output is written HIGH, and is switched off by the negative edge of
SCL. After this short period the output is in 3-state mode. The I/O should be written HIGH before being used as an input.
After power-on as all the I/Os are set to 3-state all of them can be used as inputs. Any change in setting of the I/Os as
either inputs or outputs can be done with the write mode. Warning: If a HIGH is applied to an I/O which has been written
earlier to LOW, a large current (I

) will flow to V

(see Chapter 10; note 3).

6.2

Addressing

Figures 4, 5 and 6 show the address and timing diagrams. Before any data is transmitted or received the master must
send the address of the receiver via the SDA line. The first byte transmitted after the START condition carries the address
of the slave device and the read/write bit. The address of the slave device must not be changed between the START and
the STOP conditions. The PCF8575C acts as a slave receiver or a slave transmitter.

handbook, full pagewidth

MGS632

IOL

IOHt

to interrupt
logic

VSS

VDD

P00 to P07

P10 to 17

write pulse

data from
shift register

power-on
reset

read pulse

data to
shift register

Fig.3 Simplified schematic diagram of each I/O.

MGL541

handbook, halfpage

A0 R/W

slave address

Fig.4 Byte containing the slave address and the R/W bits.

1999

Aug

Philips Semiconductors

Product specification

Remote 16-bit I/O e

xpander f

or I

C-b

PCF8575C

This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in

white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in

white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...

ook, full pagewidth

MGL543

P07 P06 P05 P04

P07 to P00

P17 to P10

P07 to P00

P17 to P10

P07 to P00

P17 to P10

P03 P02 P01 P00

P17

P10

R/W

acknowledge
from slave

P07

P00

P17

P10

SDA

SCL

READ FROM PORT

DATA INTO PORT

INT

acknowledge
from receiver

non acknowledge
from receiver

tsu

tir

tiv

Fig.6 READ mode (input).

A LOW-to-HIGH transition of SDA, while SCL is HIGH is defined as the STOP condition (P). Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present
at the latest acknowledge phase is valid (output mode). Input data is lost.

1999 Aug 05

Philips Semiconductors

Product specification

Remote 16-bit I/O expander for I

C-bus

PCF8575C

6.3

Reading from a port (input mode)

All ports programmed as input should be set to logic 1.
To read, the master (microcontroller) first addresses the
slave device after it receives the interrupt. By setting the
last bit of the byte containing the slave address to logic 1
the read mode is entered. The data bytes that follow on the
SDA are the values on the ports.

If the data on the input port changes faster than the master
can read, this data may be lost.

6.4

Writing to the port (output mode)

To write, the master (microcontroller) first addresses the
slave device. By setting the last bit of the byte containing
the slave address to logic 0 the write mode is entered. The
PCF8575C acknowledges and the master sends the first
data byte for P07 to P00. After the first data byte is
acknowledged by the PCF8575C, the second data byte
P17 to P10 is sent by the master. Once again the
PCF8575C acknowledges the receipt of the data after
which this 16-bit data is presented on the port lines.

The number of data bytes that can be sent successively is
not limited. After every two bytes the previous data is
overwritten.

The first data byte in every pair refers to Port 0
(P07 to P00), whereas the second data byte in every pair
refers to Port 1 (P17 to P10), see Fig.7.

6.5

Interrupt

The PCF8575C provides an open-drain interrupt (INT)
which can be fed to a corresponding input of the
microcontroller (see Figs 5, 6 and 8). This gives these
chips a kind of a master function which can initiate an
action elsewhere in the system.

An interrupt is generated by any rising or falling edge of the
port inputs. After time t

the signal INT is valid.

The interrupt disappears when data on the port is changed
to the original setting or data is read from or written to the
device which has generated the interrupt.

In the write mode the interrupt may become deactivated
(HIGH) on the rising edge of the write to port pulse. On the
falling edge of the write to port pulse the interrupt is
definitely deactivated (HIGH).

The interrupt is reset in the read mode on the rising edge
of the read from port pulse.

During the resetting of the interrupt itself any changes on
the I/Os may not generate an interrupt. After the interrupt
is reset any change in I/Os will be detected and transmitted
as an INT.

handbook, full pagewidth

MGL545

P07 P06 P05 P04 P03 P02 P01 P00

First Byte

P17 P16 P15 P14 P13 P12 P11 P10

Second Byte

Fig.7 Correlation between bits and ports.

1999 Aug 05

Philips Semiconductors

Product specification

Remote 16-bit I/O expander for I

C-bus

PCF8575C

CHARACTERISTICS OF THE I

C-BUS

The I

C-bus is for bidirectional, 2-line communication

between different ICs or modules. The two lines are a
serial data line (SDA) and a serial clock line (SCL). Both
lines must be connected to a positive supply via a pull-up
resistor when connected to the output stages of a device.
Data transfer may be initiated only when the bus is not
busy.

7.1

Bit transfer

One data bit is transferred during each clock pulse. The
data on the SDA line must remain stable during the HIGH
period of the clock pulse as changes in the data line at this
time will be interpreted as control signals (see Fig.9).

7.2

START and STOP conditions

Both data and clock lines remain HIGH when the bus is not
busy. A HIGH-to-LOW transition of the data line, while the
clock is HIGH is defined as the START condition (S).

A LOW-to-HIGH transition of the data line while the clock
is HIGH is defined as the STOP condition P (see Fig.10).

7.3

System configuration

A device generating a message is a `transmitter', a device
receiving the message is the `receiver'. The device that
controls the message is the `master' and the devices which
are controlled by the master are the `slaves' (see Fig.11).

7.4

Acknowledge

The number of data bytes transferred between the START
and the STOP conditions from transmitter to receiver is not
limited. Each byte of eight bits is followed by one
acknowledge bit. The transmitter must release the SDA
line before the receiver can send an acknowledge bit.

A slave receiver which is addressed must generate an
acknowledge after the reception of each byte. Also a
master must generate an acknowledge after the reception
of each byte that has been clocked out of the slave
transmitter. The device that acknowledges has to pull
down the SDA line during the acknowledge clock pulse, so
that the SDA line is stable LOW during the HIGH period of
the acknowledge related clock pulse, set-up and hold
times must be taken into account.

A master receiver must signal an end of data to the
transmitter by not generating an acknowledge after the
last byte that has been clocked out of the slave. This is
done by the master receiver by holding the SDA line HIGH.
In this event the transmitter must release the data line to
enable the master to generate a STOP condition.

handbook, full pagewidth

MBC621

data line

stable;

data valid

change

of data

allowed

SDA

SCL

Fig.9 Bit transfer.

1999 Aug 05

Philips Semiconductors

Product specification

Remote 16-bit I/O expander for I

C-bus

PCF8575C

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); note 1.

Note

1. Stress above those listed under `Absolute Maximum Ratings' may cause permanent damage to the device. This is

a stress ratings only and functional operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under
"Handling MOS Devices".

10 CHARACTERISTICS
V

= 4.5 to 5.5 V; V

= 0 V; T

amb

40 to +85

C; unless otherwise specified.

SYMBOL

PARAMETER

MIN.

MAX.

UNIT

supply voltage

0.5

+6.5

supply current

100

supply current

100

input voltage

0.5

+ 0.5

DC input current

DC output current

tot

total power dissipation

400

power dissipation per output

100

stg

storage temperature

+150

amb

ambient temperature

+85

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supplies

supply voltage

4.5

5.5

supply current

operating mode; no
load; V

= V

or V

;

SCL

= 400 kHz

100

200

DD(stb)

standby current

standby mode; no load;
V

= V

or V

2.5

POR

Power-on reset voltage

note 1

1.2

1.8

IL1

LOW-level input voltage
pins A0, A1, A2, SDA and SCL

0.8

0.3V

IL2

LOW-level input voltage
pins P00 to P17

0.8

0.6V

IH1

HIGH-level input voltage
pins A0, A1, A2, SDA and SCL

0.7V

+ 0.8 V

IH2

HIGH-level input voltage
pins P00 to P17

0.8V

+ 0.8 V

1999 Aug 05

Philips Semiconductors

Product specification

Remote 16-bit I/O expander for I

C-bus

PCF8575C

Notes

1. The Power-on reset circuit resets the I

C-bus logic with V

< V

POR

and sets all I/Os to logic 1 (with current source

to V

2. The value is not tested, but verified on sampling basis.

3. A single LOW-level output current (I

) must not exceed 20 mA for an extended time. The sum of all I

OLs

at any point

in time must not exceed 100 mA.

leakage current at all pins

= V

or V

IHL

current through protection diode

> V

or V

< V

;

note 2

Input SCL; input/output SDA

LOW-level output current

= 0.4 V; note 3

input capacitance

= V

; note 2

I/Os; P00 to P07 and P10 to P17

LOW-level output current

= 1 V; note 3

OHt

transient pull-up current

= V

; see Fig.5

0.5

1.0

input capacitance

note 2

output capacitance

note 2

Port timing; C

100 pF (see Figs 5 and 6)

output data valid

input data set-up time

input data hold time

Interrupt INT (see Fig.13)

LOW-level output current

= 0.4 V

1.6

IMING

; C

100

F (see Figs 5 and 6)

input data valid time

reset delay time

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1999 Aug 05

Philips Semiconductors

Product specification

Remote 16-bit I/O expander for I

C-bus

PCF8575C

11 I

C-BUS TIMING CHARACTERISTICS

See Fig.13 and note 1.

Notes

1. All the timing values are valid within the operating supply voltage and ambient temperature range and refer to V

and V

with an input voltage swing of V

to V

2. The device inputs SDA and SCL are filtered and will reject spikes on the bus lines of widths less than t

SW(max)

3. The rise and fall times specified here refer to the driver device (PCF8575C) and are part of the general fast I

C-bus

specification when PCF8575C asserts an acknowledge on SDA, the minimum fall time is 20 ns + 0.1C

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

SCL

SCL clock frequency

400

kHz

tolerable spike width on bus

note 2

BUF

BUS free time between a STOP
and START condition

1.3

SU;STA

START condition set-up time

0.6

HD;STA

START condition hold time

0.6

LOW

SCL LOW time

1.3

HIGH

SCL HIGH time

0.6

SCL and SDA rise time

note 3

20 + 0.1C

300

SCL and SDA fall time

note 3

20 + 0.1C

300

SU;DAT

data set-up time

100

HD;DAT

data hold time

SU;STO

STOP condition set-up time

0.6

capacitive load represented by
each bus line

400

handbook, full pagewidth

PROTOCOL

SCL

SDA

MGL546

BIT 0

LSB

(R/W)

tSU;STA

tSU;DAT

tSU;STO

tHD;STA

tHD;DAT

tBUF

tLOW

tHIGH

1/fSCL

START

CONDITION

(S)

BIT 7

MSB

(A7)

BIT 6

(A6)

ACKNOWLEDGE

(A)

STOP

CONDITION

(P)

Fig.13 I

C-bus timing diagram.

1999 Aug 05

Philips Semiconductors

Product specification

Remote 16-bit I/O expander for I

C-bus

PCF8575C

14 SOLDERING

14.1

Introduction to soldering surface mount
packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

14.2

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250

C. The top-surface temperature of the

packages should preferable be kept below 230

14.3

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

14.4

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

1999 Aug 05

Philips Semiconductors

Product specification

Remote 16-bit I/O expander for I

C-bus

PCF8575C

14.5

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

PACKAGE

SOLDERING METHOD

WAVE

REFLOW

(1)

BGA, SQFP

not suitable

suitable

HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS

not suitable

(2)

suitable

PLCC

(3)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(3)(4)

suitable

SSOP, TSSOP, VSO

not recommended

(5)

suitable

1999 Aug 05

Philips Semiconductors

Product specification

Remote 16-bit I/O expander for I

C-bus

PCF8575C

15 DEFINITIONS

16 LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

17 PURCHASE OF PHILIPS I

C COMPONENTS

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

C components conveys a license under the Philips' I

C patent to use the

components in the I

C system provided the system conforms to the I

C specification defined by

Philips. This specification can be ordered using the code 9398 393 40011.

Š Philips Electronics N.V.

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999

Philips Semiconductors a worldwide company

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

Argentina: see South America

Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America

Czech Republic: see Austria

Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905

Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920

France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300

Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341

Pakistan: see Singapore

Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327

Portugal: see Spain

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SĂO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777

Printed in The Netherlands

465006/01/pp

Date of release:

1999 Aug 05

Document order number:

9397 750 06117

Part Number PCF8575C