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ISP1102

Advanced Universal Serial Bus transceiver

Rev. 03 -- 02 September 2003

Product data

General description

The ISP1102 Universal Serial Bus (USB) transceiver is fully compliant with the
Universal Serial Bus Specification Rev. 2.0. The ISP1102 can transmit and receive
USB data at full-speed (12 Mbit/s).

The transceiver allows USB Application Specific ICs (ASICs) and Programmable
Logic Devices (PLDs) with power supply voltages from 1.65 to 3.6 V to interface with
the physical layer of the USB. The transceiver has an integrated 5 V-to-3.3 V voltage
regulator for direct powering via the USB supply line V

BUS

. The transceiver has an

integrated voltage detector to detect the presence of the V

BUS

voltage (V

CC(5.0)

When V

CC(5.0)

or V

reg(3.3)

is lost, the D+ and D

pins can be shared with other serial

protocols.

The transceiver is a bi-directional differential interface and is available in HBCC16
and HVQFN14 packages.

The transceiver is ideal for use in portable electronic devices, such as mobile phones,
digital still cameras, personal digital assistants and information appliances.

Features

Complies with

Universal Serial Bus Specification Rev. 2.0

Supports data transfer at full-speed (12 Mbit/s)

Integrated 5 V-to-3.3 V voltage regulator for powering via USB line V

BUS

voltage presence indication on pin VBUSDET

VP and VM pins function in bi-directional mode allowing pin count saving for ASIC
interface

Used as USB device transceiver or USB host transceiver

Stable RCV output during single-ended zero (SE0) condition

Two single-ended receivers with hysteresis

Low-power operation

Supports I/O voltage range from 1.65 to 3.6 V

12 kV ESD protection (ISP1102W) at D+, D

, V

CC(5.0)

and GND pins

Full industrial operating temperature range from

40 to +85 C

Available in HBCC16 and HVQFN14 lead-free and halogen-free packages.

Philips Semiconductors

ISP1102

Advanced USB transceiver

Product data

Rev. 03 -- 02 September 2003

2 of 23

9397 750 11228

Applications

Portable electronic devices, such as:

Mobile phone

Digital Still Camera (DSC)

Personal Digital Assistant (PDA)

Information Appliance (IA).

Ordering information

Block diagram

Table 1:

Ordering information

Type number

Package

Name

Description

Version

ISP1102W

HBCC16

plastic thermal enhanced bottom chip carrier; 16 terminals;
body 3

0.65 mm

SOT639-2

ISP1102BS

HVQFN14

plastic thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5

2.5

0.85 mm

SOT773-1

Fig 1.

Block diagram.

004aaa207

VCC(I/O)

VCC(5.0)

VOLTAGE

REGULATOR

3.3 V

1.5 k

(1%)

LEVEL

SHIFTER

ISP1102

SOFTCON

Vreg(3.3)

GND

Vpu(3.3)

RCV

VP/VPO

VM/VMO

VBUSDET

SUSPND

Philips Semiconductors

ISP1102

Advanced USB transceiver

Product data

Rev. 03 -- 02 September 2003

3 of 23

9397 750 11228

Pinning information

6.1 Pinning

6.2 Pin description

Fig 2.

Pin configuration HBCC16.

Fig 3.

Pin configuration HVQFN14.

004aaa209

Bottom view

ISP1102W

SOFTCON

pu(3.3)

RCV

VP/VPO

CC(I/O)

n.c.

VM/VMO

SUSPND

n.c.

CC(5.0)

Vreg(3.3)

n.c.

GND

(exposed diepad)

VBUSDET

004aaa208

Bottom view

ISP1102BS

SOFTCON

pu(3.3)

RCV

VP/VPO

CC(I/O)

VM/VMO

SUSPND

CC(5.0)

reg(3.3)

GND

(exposed diepad)

VBUSDET

n.c.

Table 2:

Pin description

Symbol

[1]

Pin

Type

Description

HBCC16

HVQFN14

input for output enable (CMOS level with respect to V

CC(I/O)

, active LOW);

enables the transceiver to transmit data on the USB bus

input pad; push pull; CMOS

RCV

differential data receiver output (CMOS level with respect to V

CC(I/O)

);

driven LOW when input SUSPND is HIGH; the output state of RCV is
preserved and stable during an SE0 condition

output pad; push pull; 4 mA output drive; CMOS

VP/VPO

I/O

single-ended D+ receiver output VP (CMOS level with respect to V

CC(I/O)

);

for external detection of SE0, error conditions, speed of connected device;
this pin also acts as the drive data input VPO; see

Table 3

and

Table 4

bidirectional pad; push-pull input; three-state output; 4 mA output drive;
CMOS

VM/VMO

I/O

single-ended D

receiver output VM (CMOS level with respect to V

CC(I/O)

);

for external detection of SE0, error conditions, speed of connected device;
this pin also acts as the drive data input VMO; see

Table 3

and

Table 4

bidirectional pad; push-pull input; three-state output; 4 mA output drive;
CMOS

SUSPND

suspend input (CMOS level with respect to V

CC(I/O)

); a HIGH level enables

low-power state while the USB bus is inactive and drives output RCV to a
LOW level

input pad; push pull; CMOS

Philips Semiconductors

ISP1102

Advanced USB transceiver

Product data

Rev. 03 -- 02 September 2003

4 of 23

9397 750 11228

[1]

Symbol names with an overscore (e.g. OE) indicate active LOW signals.

n.c.

not connected

CC(I/O)

supply voltage for digital I/O pins (1.65 to 3.6 V). When V

CC(I/O)

is not

connected, the D+ and D

pins are in three-state. This supply pin is totally

independent of V

CC(5.0)

and V

reg(3.3)

and must never exceed the V

reg(3.3)

voltage.

VBUSDET

BUS

indicator output (CMOS level with respect to V

CC(I/O)

); when

BUS

> 4.1 V, then VBUSDET = HIGH and when V

BUS

< 3.6 V, then

VBUSDET = LOW; when SUSPND = HIGH, then pin VBUSDET is pulled
HIGH

output pad; push pull; 4 mA output drive; CMOS

AI/O

negative USB data bus connection (analog, differential)

D+

AI/O

positive USB data bus connection (analog, differential)

n.c.

not connected

n.c.

not connected

n.c.

not connected

reg(3.3)

internal regulator option: regulated supply voltage output (3.0 to 3.6 V)
during 5 V operation; a decoupling capacitor of at least 0.1

F is required

regulator bypass option: used as a supply voltage input (3.3 V

10%)

for 3.3 V operation

CC(5.0)

internal regulator option: supply voltage input (4.0 to 5.5 V); can be
connected directly to USB line V

BUS

regulator bypass option: connect to V

reg(3.3)

pu(3.3)

pull-up supply voltage (3.3 V

10%); connect an external 1.5 k

resistor

on D+ (full-speed).

Pin function is controlled by input SOFTCON:

SOFTCON = LOW -- V

pu(3.3)

floating (high impedance); ensures zero

pull-up current

SOFTCON = HIGH -- V

pu(3.3)

= 3.3 V; internally connected to V

reg(3.3)

SOFTCON

software controlled USB connection input; a HIGH level applies 3.3 V to
pin V

pu(3.3)

, which is connected to an external 1.5 k

pull-up resistor; this

allows USB connect or disconnect signalling to be controlled by software

input pad; push pull; CMOS

GND

exposed
die pad

ground supply; down bonded to the exposed die pad (heatsink); to be
connected to the PCB ground

Table 2:

Pin description

...continued

Symbol

[1]

Pin

Type

Description

HBCC16

HVQFN14

Philips Semiconductors

ISP1102

Advanced USB transceiver

Product data

Rev. 03 -- 02 September 2003

5 of 23

9397 750 11228

Functional description

7.1 Function selection

[1]

Signal levels on the D+ and D

pins are determined by other USB devices and external pull-up or

pull-down resistors.

[2]

In the suspend mode (SUSPND = HIGH), the differential receiver is inactive and the output RCV is
always LOW. Out-of-suspend (K) signalling is detected via the single-ended receivers VP/VPO and
VM/VMO.

7.2 Operating functions

[1]

RCV* denotes the signal level on output RCV just before the SE0 state occurs. This level is stable
during the SE0 period.

7.3 Power supply configurations

The ISP1102 can be used with different power supply configurations, which can be
changed dynamically.

Table 7

provides an overview of the power supply

configurations.

Normal mode -- V

CC(I/O)

is connected. V

CC(5.0)

is connected only, or V

CC(5.0)

and

reg(3.3)

are connected.

For 5 V operation, V

CC(5.0)

is connected to a 5 V source (4.0 to 5.5 V). The internal

voltage regulator then produces 3.3 V for the USB connections.

Table 3:

Function table

SUSPND OE

D+, D

RCV

VP/VPO

VM/VMO

Function

driving/
receiving

active

VPO input

VMO input normal driving

(differential receiver
active)

receiving

[1]

active

VP output

VM output

receiving

driving

inactive

[2]

VPO input

VMO input driving during suspend

(differential receiver
inactive)

high-Z

[1]

inactive

[2]

VP output

VM output

low-power state

Table 4:

Driving function using differential input data interface (pin OE = L)

VM/VMO

VP/VPO

Data

SE0

differential logic 1

differential logic 0

illegal state

Table 5:

Receiving function (pin OE = H)

D+, D

RCV

VP/VPO

VM/VMO

differential logic 0

differential logic 1

SE0

RCV*

[1]

Philips Semiconductors

ISP1102

Advanced USB transceiver

Product data

Rev. 03 -- 02 September 2003

6 of 23

9397 750 11228

For 3.3 V operation, both V

CC(5.0)

and V

reg(3.3)

are connected to a 3.3 V source

(3.0 to 3.6 V).

CC(I/O)

is independently connected to a voltage source (1.65 to 3.6 V), depending on

the supply voltage of the external circuit.

Sharing mode -- V

CC(I/O)

is connected only; V

CC(5.0)

and V

reg(3.3)

are not connected.

In this mode, the D+ and D

pins are made three-state and the ISP1102 allows

external signals of up to 3.6 V to share the D+ and D

lines. The internal circuits of

the ISP1102 ensure that virtually no current (maximum 10

A) is drawn via the

D+ and D

lines. The power consumption through pin V

CC(I/O)

drops to the low-power

(suspended) state level.

Pins VBUSDET and RCV are driven LOW to indicate this mode. The VBUSDET
function is ignored during the suspend mode of the ISP1102.

Some hysteresis is built into the detection of V

reg(3.3)

lost.

[1]

VP/VPO and VM/VMO are bidirectional pins.

Table 6:

Pin states in the sharing mode

Pin

Sharing mode

CC(5.0)

not present

reg(3.3)

not present

CC(I/O)

1.65 to 3.6 V input

pu(3.3)

high impedance (off)

D+, D

high impedance

VP/VPO, VM/VMO

[1]

RCV

VBUSDET

OE, SUSPND, SOFTCON

high impedance

Table 7:

Power supply configuration overview

CC(5.0)

Configuration

Special characteristics

connected

normal mode

not connected

sharing mode

D+, D

and V

pu(3.3)

high impedance;

VBUSDET driven LOW

Philips Semiconductors

ISP1102

Advanced USB transceiver

Product data

Rev. 03 -- 02 September 2003

7 of 23

9397 750 11228

7.4 Power supply input options

The ISP1102 has two power supply input options.

Internal regulator -- pin V

CC(5.0)

is connected to 4.0 to 5.5 V. The internal regulator

is used to supply the internal circuitry with 3.3 V (nominal). The V

reg(3.3)

pin becomes

a 3.3 V output reference.

Regulator bypass -- pins V

CC(5.0)

and V

reg(3.3)

are connected to the same supply.

The internal regulator is bypassed and the internal circuitry is supplied directly from
pin V

reg(3.3)

. The voltage range is 3.0 to 3.6 V to comply with the USB specification.

The supply voltage range for each input option is specified in

Table 8

Table 8:

Power supply input options

Input option V

CC(5.0)

reg(3.3)

CC(I/O)

Internal
regulator

supply input for internal
regulator (4.0 to 5.5 V)

voltage reference output
(3.3 V, 300

supply input for digital
I/O pins (1.65 V to 3.6 V)

Regulator
bypass

connected to V

reg(3.3)

with maximum voltage
drop of 0.3 V
(2.7 to 3.6 V)

supply input
(3.0 V to 3.6 V)

supply input for digital
I/O pins (1.65 V to 3.6 V)

Philips Semiconductors

ISP1102

Advanced USB transceiver

Product data

Rev. 03 -- 02 September 2003

8 of 23

9397 750 11228

Electrostatic discharge (ESD)

8.1 ESD protection

For HBCC package, the pins that are connected to the USB connector (D+, D

CC(5.0)

and GND) have a minimum of

12 kV ESD protection. The

12 kV

measurement is limited by the test equipment. Capacitors of 4.7

F connected from

reg(3.3)

to GND and V

CC(5.0)

to GND are required to achieve this

12 kV ESD

protection (see

Figure 4

The ISP1102W can withstand

12 kV using the Human Body Model and

5 kV using

the Contact Discharge Method as specified in

IEC 61000-4-2.

Note: For HVQFN package, the pins that are connected to the USB connector (D+,
D

, V

CC(5.0)

and GND) have a minimum of

7 kV ESD protection.

8.2 ESD test conditions

A detailed report on test set-up and results is available on request.

Fig 4.

Human Body ESD test model.

1 M

1500

HIGH VOLTAGE

DC SOURCE

4.7

CC(5.0)

reg(3.3)

DEVICE UNDER

TEST

100 pF

storage

capacitor

charge current

limit resistor

discharge

resistance

GND

004aaa145

Philips Semiconductors

ISP1102

Advanced USB transceiver

Product data

Rev. 03 -- 02 September 2003

9 of 23

9397 750 11228

Limiting values

[1]

Testing equipment limits measurement to only

12 kV. Capacitors needed on V

CC(5.0)

and V

reg(3.3)

(see

Section 8

[2]

Equivalent to discharging a 100 pF capacitor via a 1.5 k

resistor (Human Body Model).

10. Recommended operating conditions

11. Static characteristics

Table 9:

Absolute maximum ratings

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

CC(5.0)

supply voltage

0.5

+6.0

CC(I/O)

I/O supply voltage

0.5

+4.6

DC input voltage

0.5

CC(I/O)

+ 0.5 V

latch-up current

1.8 to +5.4 V

100

esd

electrostatic discharge voltage

pins D+, D

, V

CC(5.0)

and

GND; I

< 3

A for HBCC

package

[1][2]

12000

+12000

pins D+, D

, V

CC(5.0)

and

GND; I

< 3

A for HVQFN

package

[2]

7000

+7000

all other pins; I

< 1

[2]

2000

+2000

stg

storage temperature

+125

Table 10:

Recommended operating conditions

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

CC(5.0)

supply voltage

4.0

5.0

5.5

CC(I/O)

I/O supply voltage

1.65

3.6

input voltage

CC(I/O)

I(AI/O)

input voltage on AI/O pins

pins D+ and D

3.6

amb

ambient temperature

+85

Table 11:

Static characteristics: supply pins

CC(5.0)

= 4.0 to 5.5 V or V

reg(3.3)

= 3.0 to 3.6 V; V

CC(I/O)

= 1.65 to 3.6 V; V

GND

= 0 V; see

Table 8

for valid voltage level

combinations; T

amb

40 to +85

C; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

reg(3.3)

regulated supply voltage output

internal regulator option;
I

load

300

[1][2]

3.0

3.3

3.6

operating supply current

transmitting and receiving at
12 Mbit/s; C

= 50 pF on

pins D+ and D

[3]

CC(I/O)

operating I/O supply current

transmitting and receiving at
12 Mbit/s

[3]

CC(idle)

supply current during full-speed
idle and SE0

idle: V

D+

> 2.7 V, V

< 0.3 V;

SE0: V

D+

< 0.3 V, V

< 0.3 V

[4]

300

CC(I/O)(static)

static I/O supply current

idle, SE0 or suspend

Philips Semiconductors

ISP1102

Advanced USB transceiver

Product data

Rev. 03 -- 02 September 2003

10 of 23

9397 750 11228

[1]

load

includes the pull-up resistor current via pin V

pu(3.3)

[2]

The minimum voltage is 2.7 V in the suspend mode.

[3]

Maximum value characterized only, not tested in production.

[4]

Excluding any load current and V

pu(3.3)

or V

source current to the 1.5 k

and 15 k

pull-up and pull-down resistors (200

A typ.).

[5]

When V

CC(I/O)

< 2.7 V, the minimum value for V

reg(3.3)th

= 2.0 V for supply present condition.

CC(susp)

suspend supply current

SUSPND = HIGH

[4]

CC(I/O)(sharing)

sharing mode I/O supply current V

CC(5.0)

not connected

Dx(sharing)

sharing mode load current on
pins D+ and D

CC(5.0)

not connected;

SOFTCON = LOW;
V

= 3.6 V

CC(5.0)th

supply voltage detection
threshold

1.65 V

CC(I/O)

3.6 V

supply lost

3.6

supply present

4.1

CC(5.0)hys

supply voltage detection
hysteresis

CC(I/O)

= 1.8 V

CC(I/O)th

I/O supply voltage detection
threshold

reg(3.3)

= 2.7 to 3.6 V

supply lost

0.5

supply present

1.4

CC(I/O)hys

I/O supply voltage detection
hysteresis

reg(3.3)

= 3.3 V

0.45

reg(3.3)th

regulated supply voltage
detection threshold

1.65 V

CC(I/O)

reg(3.3)

;

2.7 V

reg(3.3)

3.6 V

supply lost

0.8

supply present

[5]

2.4

reg(3.3)hys

regulated supply voltage
detection hysteresis

CC(I/O)

= 1.8 V

0.45

Table 11:

Static characteristics: supply pins

...continued

CC(5.0)

= 4.0 to 5.5 V or V

reg(3.3)

= 3.0 to 3.6 V; V

CC(I/O)

= 1.65 to 3.6 V; V

GND

= 0 V; see

Table 8

for valid voltage level

combinations; T

amb

40 to +85

C; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Table 12:

Static characteristics: digital pins

CC(I/O)

= 1.65 to 3.6 V; V

GND

= 0 V; T

amb

40 to +85

C; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

CC(I/O)

= 1.65 to 3.6 V

Input levels

LOW-level input voltage

0.3V

CC(I/O)

HIGH-level input voltage

0.6V

CC(I/O)

Output levels

LOW-level output voltage

= 100

0.15

= 2 mA

0.4

HIGH-level output voltage

= 100

CC(I/O)

0.15

= 2 mA

CC(I/O)

0.4

Leakage current

input leakage current

[1]

Philips Semiconductors

ISP1102

Advanced USB transceiver

Product data

Rev. 03 -- 02 September 2003

11 of 23

9397 750 11228

[1]

If V

CC(I/O)

reg(3.3)

, then the leakage current will be higher than the specified value.

Capacitance

input capacitance

pin to GND

Example 1: V

CC(I/O)

= 1.8 V

0.15 V

Input levels

LOW-level input voltage

0.5

HIGH-level input voltage

1.2

Output levels

LOW-level output voltage

= 100

0.15

= 2 mA

0.4

HIGH-level output voltage

= 100

1.5

= 2 mA

1.25

Example 2: V

CC(I/O)

= 2.5 V

0.2 V

Input levels

LOW-level input voltage

0.7

HIGH-level input voltage

1.7

Output levels

LOW-level output voltage

= 100

0.15

= 2 mA

0.4

HIGH-level output voltage

= 100

2.15

= 2 mA

1.9

Example 3: V

CC(I/O)

= 3.3 V

0.3 V

Input levels

LOW-level input voltage

0.9

HIGH-level input voltage

2.15

Output levels

LOW-level output voltage

= 100

0.15

= 2 mA

0.4

HIGH-level output voltage

= 100

2.85

= 2 mA

2.6

Table 12:

Static characteristics: digital pins

...continued

CC(I/O)

= 1.65 to 3.6 V; V

GND

= 0 V; T

amb

40 to +85

C; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Table 13:

Static characteristics: analog I/O pins D+ and D

CC(5.0)

= 4.0 to 5.5 V or V

reg(3.3)

= 3.0 to 3.6 V; V

GND

= 0 V; T

amb

40 to +85

C; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Input levels

Differential receiver

differential input sensitivity

I(D+)

I(D

)

0.2

differential common mode
voltage

includes V

range

0.8

2.5

Philips Semiconductors

ISP1102

Advanced USB transceiver

Product data

Rev. 03 -- 02 September 2003

12 of 23

9397 750 11228

[1]

OH(min)

= V

reg(3.3)

0.2 V.

[2]

Includes external resistors of 33

1% on both pins D+ and D

[3]

This voltage is available at pins V

reg(3.3)

and V

pu(3.3)

[4]

The minimum voltage is 2.7 V in the suspend mode.

12. Dynamic characteristics

Single-ended receiver

LOW-level input voltage

0.8

HIGH-level input voltage

2.0

hys

hysteresis voltage

0.4

0.7

Output levels

LOW-level output voltage

= 1.5 k

to 3.6 V

0.3

HIGH-level output voltage

= 15 k

to GND

[1]

2.8

3.6

Leakage current

OFF-state leakage current

Capacitance

transceiver capacitance

pin to GND

Resistance

DRV

driver output impedance

steady-state drive

[2]

INP

input impedance

internal switch resistance at
pin V

pu(3.3)

Termination

TERM

termination voltage for
upstream port pull-up (R

)

[3][4]

3.0

3.6

Table 13:

Static characteristics: analog I/O pins D+ and D

...continued

CC(5.0)

= 4.0 to 5.5 V or V

reg(3.3)

= 3.0 to 3.6 V; V

GND

= 0 V; T

amb

40 to +85

C; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Table 14:

Dynamic characteristics: analog I/O pins D+ and D

CC(5.0)

= 4.0 to 5.5 V or V

reg(3.3)

= 3.0 to 3.6 V; V

CC(I/O)

= 1.65 to 3.6 V; V

GND

= 0 V; see

Table 8

for valid voltage level

combinations; T

amb

40 to +85

C; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Driver characteristics

rise time

= 50 to 125 pF;

10% to 90% of

;

see

Figure 5

fall time

= 50 to 125 pF;

90% to 10% of

;

see

Figure 5

FRFM

differential rise/fall time
matching (t

)

excluding the first transition
from Idle state

111.1

CRS

output signal crossover
voltage

excluding the first transition
from Idle state; see

Figure 6

[1]

1.3

2.0

Philips Semiconductors

ISP1102

Advanced USB transceiver

Product data

Rev. 03 -- 02 September 2003

13 of 23

9397 750 11228

[1]

Characterized only, not tested. Limits guaranteed by design.

Driver timing

PLH(drv)

driver propagation delay
(VPO, VMO to D+, D

)

LOW-to-HIGH; see

Figure 6

and

Figure 9

PHL(drv)

driver propagation delay
(VPO, VMO to D+, D

)

HIGH-to-LOW; see

Figure 6

and

Figure 9

PHZ

driver disable delay
(OE to D+, D

)

HIGH-to-OFF; see

Figure 7

and

Figure 10

PLZ

driver disable delay
(OE to D+, D

)

LOW-to-OFF; see

Figure 7

and

Figure 10

PZH

driver enable delay
(OE to D+, D

)

OFF-to-HIGH; see

Figure 7

and

Figure 10

PZL

driver enable delay
(OE to D+, D

)

OFF-to-LOW; see

Figure 7

and

Figure 10

Receiver timings

Differential receiver

PLH(rcv)

propagation delay
(D+, D

to RCV)

LOW-to-HIGH; see

Figure 8

and

Figure 11

PHL(rcv)

propagation delay
(D+, D

to RCV)

HIGH-to-LOW; see

Figure 8

and

Figure 11

Single-ended receiver

PLH(se)

propagation delay
(D+, D

to VP/VPO,

VM/VMO)

LOW-to-HIGH; see

Figure 8

and

Figure 11

PHL(se)

propagation delay
(D+, D

to VP/VPO,

VM/VMO)

HIGH-to-LOW; see

Figure 8

and

Figure 11

Table 14:

Dynamic characteristics: analog I/O pins D+ and D

...continued

CC(5.0)

= 4.0 to 5.5 V or V

reg(3.3)

= 3.0 to 3.6 V; V

CC(I/O)

= 1.65 to 3.6 V; V

GND

= 0 V; see

Table 8

for valid voltage level

combinations; T

amb

40 to +85

C; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

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ISP1102

Advanced USB transceiver

Product data

Rev. 03 -- 02 September 2003

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9397 750 11228

Fig 5.

Rise and fall times.

Fig 6.

Timing of VPO and VMO to D+ and D

Fig 7.

Timing of OE to D+ and D

Fig 8.

Timing of D+ and D

to RCV, VP/VPO and

VM/VMO.

MGS963

VOL

tFR, tLR

tFF, tLF

VOH

90 %

10 %

90 %

MGS964

VOL

VOH

tPHL(drv)

tPLH(drv)

VCRS

0.9 V

1.65 V

0 V

logic input

differential

data lines

MGS966

VOL

VOH

tPZH

tPZL

tPHZ

tPLZ

VOH

0.3 V

VOL

0.3 V

VCRS

0.9 V

1.65 V

0 V

logic input

differential

data lines

MGS965

VOL

VOH

tPHL(rcv)

tPHL(se)

tPLH(rcv)

tPLH(se)

VCRS

0.9 V

2.0 V

0.8 V

logic output

differential

data lines

Philips Semiconductors

ISP1102

Advanced USB transceiver

Product data

Rev. 03 -- 02 September 2003

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9397 750 11228

14. Package outline

Fig 12. Package outline HBCC16.

2.5

UNIT

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

01-11-13
03-03-12

IEC

JEDEC

JEITA

0.8

0.10
0.05

0.7
0.6

3.1
2.9

1.45
1.35

3.1
2.9

1.45
1.35

0.33
0.27

DIMENSIONS (mm are the original dimensions)

SOT639-2

MO-217

0.33
0.27

0.38
0.32

2.45

0.23
0.17

0.5

0.1

0.05

0.2

2.5

2.45

0.08

2.5

5 mm

scale

SOT639-2

HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm

max.

detail X

y1 C

1/2 e3

1/2 e4

terminal 1
index area

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Advanced USB transceiver

Product data

Rev. 03 -- 02 September 2003

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9397 750 11228

Fig 13. Package outline HVQFN14.

0.5

UNIT

0.2

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

2.6
2.4

1.45
1.15

2.6
2.4

1.45
1.15

1.5

0.30
0.18

0.05
0.00

0.05

0.1

DIMENSIONS (mm are the original dimensions)

SOT773-1

- - -

0.35
0.25

0.1

0.05

2.5

5 mm

scale

SOT773-1

HVQFN14: plastic thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 2.5 x 0.85 mm

(1)

max.

detail X

y1 C

02-07-05

terminal 1
index area

(1)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

(1)

terminal 1
index area

1/2

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Advanced USB transceiver

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9397 750 11228

15. Packaging

The ISP1102W (HBCC16 package) is delivered on a Type A carrier tape, see

Figure 14

. The tape dimensions are given in

Table 15

The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not
designed for use in a baking process.

The cumulative tolerance of 10 successive sprocket holes is

0.02 mm. The camber

must not exceed 1 mm in 100 mm.

16. Soldering

16.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit

Packages (document order number 9398 652 90011).

Fig 14. Carrier tape dimensions.

Table 15:

Type A carrier tape dimensions for the ISP1102W

Dimension

Value

Unit

3.3

1.1

8.0

12.0

0.3

idth

MLC338

Type B

Type A

elongated
sprocket hole

direction of feed

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Advanced USB transceiver

Product data

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9397 750 11228

There is no soldering method that is ideal for all IC packages. Wave soldering can still
be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In
these situations reflow soldering is recommended. In these situations reflow
soldering is recommended.

16.2 Reflow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215 to 270

C depending on solder

paste material. The top-surface temperature of the packages should preferably be
kept:

below 220

C (SnPb process) or below 245

C (Pb-free process)

for all BGA and SSOP-T packages

for packages with a thickness

2.5 mm

for packages with a thickness < 2.5 mm and a volume

350 mm

so called

thick/large packages.

below 235

C (SnPb process) or below 260

C (Pb-free process) for packages with

a thickness < 2.5 mm and a volume < 350 mm

so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.

16.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically
developed.

If wave soldering is used the following conditions must be observed for optimal
results:

Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

Philips Semiconductors

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Advanced USB transceiver

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9397 750 11228

For packages with leads on four sides, the footprint must be placed at a 45

angle

to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250

C or

265

C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal of corrosive residues in
most applications.

16.4 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300

When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320

16.5 Package related soldering information

[1]

For more detailed information on the BGA packages refer to the

(LF)BGA Application Note

(AN01026); order a copy from your Philips Semiconductors sales office.

[2]

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated

Circuit Packages; Section: Packing Methods.

[3]

These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217

C measured in the atmosphere of the reflow

oven. The package body peak temperature must be kept as low as possible.

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.

Table 16:

Suitability of surface mount IC packages for wave and reflow soldering
methods

Package

[1]

Soldering method

Wave

Reflow

[2]

BGA, LBGA, LFBGA, SQFP, SSOP-T

[3]

TFBGA, VFBGA

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSQFP,
HSOP, HTQFP, HTSSOP, HVQFN, HVSON,
SMS

not suitable

[4]

suitable

PLCC

[5]

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

[5][6]

suitable

SSOP, TSSOP, VSO, VSSOP

not recommended

[7]

suitable

PMFP

[8]

not suitable

Philips Semiconductors

ISP1102

Advanced USB transceiver

Product data

Rev. 03 -- 02 September 2003

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9397 750 11228

[5]

If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8]

Hot bar soldering or manual soldering is suitable for PMFP packages.

17. Revision history

Table 17:

Revision history

Rev Date

CPCN

Description

20030902

Product data (9397 750 11228)

Modifications:

Added HVQFN14 package information

Section 2

: updated

Added pad details to

Table 2

Section 7.3

: updated the first line under Normal mode

Table 6

: added a table note

Section 8.1

: updated the first paragraph and added a note

Table 9

: updated info on V

esd

and added a table note.

20030106

Product data (9397 750 10397)

20000524

Objective data

9397 750 11228

Philips Semiconductors

ISP1102

Advanced USB transceiver

Product data

Rev. 03 -- 02 September 2003

22 of 23

Contact information

For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.

Fax: +31 40 27 24825

18. Data sheet status

[1]

Please consult the most recently issued data sheet before initiating or completing a design.

[2]

The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.

[3]

For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

19. Definitions

Short-form specification -- The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.

Limiting values definition -- Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.

Application information -- Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.

20. Disclaimers

Life support -- These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes -- Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status `Production'),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.

Level

Data sheet status

[1]

Product status

[2][3]

Definition

Objective data

Development

This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.

Preliminary data

Qualification

This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.

III

Product data

Production

This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).

All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.

The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.

Date of release: 02 September 2003

Document order number: 9397 750 11228

Contents

Philips Semiconductors

ISP1102

Advanced USB transceiver

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Pinning information . . . . . . . . . . . . . . . . . . . . . . 3

6.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

Functional description . . . . . . . . . . . . . . . . . . . 5

7.1

Function selection. . . . . . . . . . . . . . . . . . . . . . . 5

7.2

Operating functions. . . . . . . . . . . . . . . . . . . . . . 5

7.3

Power supply configurations . . . . . . . . . . . . . . . 5

7.4

Power supply input options . . . . . . . . . . . . . . . . 7

Electrostatic discharge (ESD). . . . . . . . . . . . . . 8

8.1

ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . 8

8.2

ESD test conditions . . . . . . . . . . . . . . . . . . . . . 8

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9

Recommended operating conditions. . . . . . . . 9

Static characteristics. . . . . . . . . . . . . . . . . . . . . 9

Dynamic characteristics . . . . . . . . . . . . . . . . . 12

Test information . . . . . . . . . . . . . . . . . . . . . . . . 15

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16

Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

16.1

Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

16.2

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 19

16.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 19

16.4

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 20

16.5

Package related soldering information . . . . . . 20

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 22

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Part Number ISP1102

Document Outline