2001 Oct 02

Philips Semiconductors

Product specification

High-voltage car ignition diode

BYX135GPL

FEATURES

Plastic package

Glass passivated

High maximum operating temperature

Low leakage current

Excellent stability

Guaranteed avalanche energy absorption capability.

APPLICATIONS

Car ignition systems

Automotive applications with extreme temperature
requirements.

DESCRIPTION

Plastic package, using glass passivation and a high
temperature alloyed construction.

This package is hermetically sealed and fatigue free as
coefficients of expansion of all used parts are matched.

The package is designed to be used in an insulating
medium such as resin, oil or SF6 gas.

MBL155

Fig.1 Simplified outline (SOD125A) and symbol.

Cathode indicated by a green band.

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).

CHARACTERISTICS
T

= 25

C unless otherwise specified.

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

RRM

repetitive peak reverse voltage

RWM

crest working reverse voltage

F(AV)

average forward current

FRM

repetitive peak forward current

500

RSM

non-repetitive peak reverse current

t = 100

s triangular pulse;

j(max)

prior to surge

stg

storage temperature

+175

junction temperature

continuous

175

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

forward voltage

= 10 mA

6.25

8.75

(BR)R

reverse avalanche breakdown voltage

= 100

7.0

9.5

reverse current

= V

RWMmax

; T

= 175

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th j-a

thermal resistance from junction to ambient T

amb

= T

leads

; lead length = 10 mm

K/W

2001 Oct 02

Philips Semiconductors

Product specification

High-voltage car ignition diode

BYX135GPL

DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DATA SHEET STATUS

(1)

PRODUCT

STATUS

(2)

DEFINITIONS

Objective data

Development

This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Preliminary data

Qualification

This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

Product data

Production

This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.

DEFINITIONS

Short-form specification

The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition

Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information

Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

DISCLAIMERS

Life support applications

These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes

Philips Semiconductors

reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

Š Koninklijke Philips Electronics N.V. 2001

SCA73

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Philips Semiconductors a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com.

Fax: +31 40 27 24825

For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

Printed in The Netherlands

613510/02/pp

Date of release:

2001 Oct 02

Document order number:

9397 750 08892

Part Number BYX135GPL

Document Outline