Semiconductor Components Industries, LLC, 1999

December, 1999 Rev. 3

Publication Order Number:

MC74VHC1G08/D

MC74VHC1G08

2-Input AND Gate

The MC74VHC1G08 is an advanced high speed CMOS 2input

AND gate fabricated with silicon gate CMOS technology. It achieves
high speed operation similar to equivalent Bipolar Schottky TTL
while maintaining CMOS low power dissipation.

The internal circuit is composed of three stages, including a buffer

output which provides high noise immunity and stable output.

The MC74VHC1G08 input structure provides protection when

voltages up to 7V are applied, regardless of the supply voltage. This
allows the MC74VHC1G08 to be used to interface 5V circuits to 3V
circuits.

High Speed: tPD = 3.5ns (Typ) at VCC = 5V

Low Power Dissipation: ICC = 2

A (Max) at TA = 25

Power Down Protection Provided on Inputs

Balanced Propagation Delays

Pin and Function Compatible with Other Standard Logic Families

Latchup Performance Exceeds 300mA

ESD Performance: HBM > 2000V; MM > 200V, CDM > 1500V

Figure 1. 5Lead SOT353 Pinout (Top View)

VCC

IN B

IN A

OUT Y

GND

LOGIC SYMBOL

IN A

IN B

OUT Y

SC88A / SOT353

DF SUFFIX

CASE 419A

PIN ASSIGNMENT

GND

IN B

IN A

http://onsemi.com

Pin 1

d = Date Code

V2d

VCC

OUT Y

FUNCTION TABLE

Inputs

Output

MARKING DIAGRAM

See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.

ORDERING INFORMATION

MC74VHC1G08

http://onsemi.com

MAXIMUM RATINGS*

Characteristics

Symbol

Value

Unit

DC Supply Voltage

VCC

0.5 to +7.0

DC Input Voltage

VIN

0.5 to +7.0

DC Output Voltage

VCC = 0
High or Low State

VOUT

0.5 to 7.0

0.5 to VCC + 0.5

Input Diode Current

IIK

Output Diode Current

(VOUT < GND; VOUT > VCC)

IOK

+20

DC Output Current, per Pin

IOUT

+25

DC Supply Current, VCC and GND

ICC

+50

Power dissipation in still air, SC88A

200

Lead temperature, 1 mm from case for 10 s

260

Storage temperature

Tstg

65 to +150

* Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those

indicated may adversely affect device reliability. Functional operation under absolutemaximumrated conditions is not implied. Functional
operation should be restricted to the Recommended Operating Conditions.

Derating -- SC88A Package: 3 mW/

C from 65

to 125

RECOMMENDED OPERATING CONDITIONS

Characteristics

Symbol

Min

Max

Unit

DC Supply Voltage

VCC

2.0

5.5

DC Input Voltage

VIN

0.0

5.5

DC Output Voltage

VOUT

0.0

VCC

Operating Temperature Range

+85

Input Rise and Fall Time

VCC = 3.3V

0.3V

VCC = 5.0V

0.5V

tr , tf

0
0

100

ns/V

MC74VHC1G08

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DC ELECTRICAL CHARACTERISTICS

VCC

TA = 25

125

Symbol

Parameter

Test Conditions

(V)

Min

Typ

Max

Min

Max

Min

Max

Unit

VIH

Minimum HighLevel
Input Voltage

2.0
3.0
4.5
5.5

1.5
2.1

3.15
3.85

1.5
2.1

3.15
3.85

1.5
2.1

3.15
3.85

VIL

Maximum LowLevel
Input Voltage

2.0
3.0
4.5
5.5

0.5
0.9

1.35
1.65

0.5
0.9

1.35
1.65

0.5
0.9

1.35
1.65

VOH

Minimum HighLevel
Output Voltage
VIN = VIH or VIL

VIN = VIH or VIL
IOH = 50

2.0
3.0
4.5

1.9
2.9
4.4

2.0
3.0
4.5

1.9
2.9
4.4

VIN = VIH or VIL
IOH = 4mA
IOH = 8mA

3.0
4.5

2.58
3.94

2.48
3.80

2.34
3.66

VOL

Maximum LowLevel
Output Voltage
VIN = VIH or VIL

VIN = VIH or VIL
IOL = 50

2.0
3.0
4.5

0.0
0.0
0.0

0.1
0.1
0.1

VIN = VIH or VIL
IOL = 4mA
IOL = 8mA

3.0
4.5

0.36
0.36

0.44
0.44

0.52
0.52

IIN

Maximum Input
Leakage Current

VIN = 5.5V or GND

0 to

5.5

0.1

1.0

ICC

Maximum Quiescent
Supply Current

VIN = VCC or GND

5.5

2.0

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

AC ELECTRICAL CHARACTERISTICS

(Cload = 50 pF, Input tr = tf = 3.0ns)

ÎÎÎÎ

ÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎ

TA = 25

ÎÎÎÎÎ

125

ÎÎ

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎÎÎÎÎÎ

Test Conditions

ÎÎÎ

Min

ÎÎÎ

Typ

ÎÎÎ

Max

ÎÎÎ

Min

ÎÎÎ

Max

ÎÎÎ

Min

ÎÎÎ

Max

ÎÎ

Unit

ÎÎÎÎ

ÎÎ

ÎÎÎÎ

tPLH,
tPHL

ÎÎÎÎÎÎÎ

ÎÎÎÎÎ

ÎÎÎÎÎÎÎ

Maximum
Propogation Delay,
Input A or B to Y

ÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

VCC = 3.0

0.3V

CL = 15 pF
CL = 50 pF

ÎÎÎ

4.1
5.9

ÎÎÎ

8.8

12.3

ÎÎÎ

10.5
14.0

ÎÎÎ

12.5
16.5

ÎÎ

ÎÎÎÎ

ÎÎ

ÎÎÎÎ

ÎÎÎÎÎÎÎ

ÎÎÎÎÎ

ÎÎÎÎÎÎÎ

Input A or B to Y

ÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

VCC = 5.0

0.5V

CL = 15 pF
CL = 50 pF

ÎÎÎ

3.5
4.2

ÎÎÎ

5.9
7.9

ÎÎÎ

7.0
9.0

ÎÎÎ

9.0

11.0

ÎÎ

ÎÎÎÎ

CIN

ÎÎÎÎÎÎÎ

Maximum Input
Capacitance

ÎÎÎÎÎÎÎÎÎ

ÎÎÎ

5.5

ÎÎÎ

ÎÎ

Typical @ 25

C, VCC = 5.0V

CPD

Power Dissipation Capacitance (Note 1.)

1. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.

Average operating current can be obtained by the equation: ICC(OPR

)

= CPD

VCC

fin + ICC. CPD is used to determine the noload dynamic

power consumption; PD = CPD

VCC2

fin + ICC

VCC.

MC74VHC1G08

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*Includes all probe and jig capacitance

CL*

TEST POINT

DEVICE

UNDER

TEST

OUTPUT

Figure 2. Switching Waveforms

Figure 3. Test Circuit

GND

50%

50% VCC

Input A or B

Output Y

tPHL

tPLH

50% VCC

VOL

VOH

DEVICE ORDERING INFORMATION

Device Nomenclature

Device Order Number

Circuit

Indicator

Temp

Range

Identifier

Technology

Device

Function

Package

Suffix

Tape &

Reel

Suffix

Package

Type

Tape and Reel

Size

MC74VHC1G08DFT1

VHC1G

SC88A /
SOT353

7Inch/3000 Unit

PACKAGE DIMENSIONS

SC88A / SOT353

DF SUFFIX

5LEAD PACKAGE

CASE 419A01

ISSUE B

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MM.

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

1.80

2.20

0.071

0.087

INCHES

1.15

1.35

0.045

0.053

0.80

1.10

0.031

0.043

0.10

0.30

0.004

0.012

0.65 BSC

0.026 BSC

0.10

0.004

0.10

0.25

0.004

0.010

0.10

0.30

0.004

0.012

0.20 REF

0.008 REF

2.00

2.20

0.079

0.087

0.30

0.40

0.012

0.016

0.2 (0.008)

5 PL

B

ÉÉ

0.5 mm (min)

0.4 mm (min)

0.65 mm

1.9 mm

MC74VHC1G08

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Figure 4. Carrier Tape Specifications

D1
FOR COMPONENTS

10 PITCHES
CUMULATIVE
TOLERANCE ON
TAPE

0.2 mm

(

0.008")

2.0 mm

1.2 mm

AND LARGER

CENTER LINES
OF CAVITY

EMBOSSMENT

USER DIRECTION OF FEED

SEE

NOTE 2

TOP

COVER

TAPE

SEE NOTE 2

FOR MACHINE REFERENCE

ONLY

INCLUDING DRAFT AND RADII

CONCENTRIC AROUND B0

R MIN.

TAPE AND COMPONENTS
SHALL PASS AROUND RADIUS "R"
WITHOUT DAMAGE

BENDING RADIUS

*TOP COVER
TAPE THICKNESS (t1)
0.10 mm
(0.004") MAX.

EMBOSSED
CARRIER

EMBOSSMENT

TYPICAL
COMPONENT CAVITY
CENTER LINE

TYPICAL
COMPONENT
CENTER LINE

MAXIMUM COMPONENT ROTATION

CAMBER (TOP VIEW)

ALLOWABLE CAMBER TO BE 1 mm/100 mm NONACCUMULATIVE OVER 250

100 mm

(3.937")

1 mm

(0.039") MAX

250 mm

(9.843")

1 mm MAX

TAPE

EMBOSSED CARRIER DIMENSIONS (See Notes 1 and 2)

Tape

Size

Max

8 mm

4.35 mm

(0.171")

1.5 +0.1/
0.0 mm

(0.059

+0.004/

0.0")

1.0 mm

Min

(0.039")

1.75

0.1 mm

(0.069

0.004")

3.5

0.5 mm

(1.38

0.002")

2.4 mm

(0.094")

4.0

0.10 mm

(0.157

0.004")

4.0

0.1 mm

(0.156

0.004")

2.0

0.1 mm

(0.079

0.002")

25 mm

(0.98")

0.3

0.05 mm

(0.01

+0.0038/

0.0002")

8.0

0.3 mm

(0.315

0.012")

1. Metric Dimensions GovernEnglish are in parentheses for reference only.
2. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to

0.50 mm max. The component cannot rotate more than 10

within the determined cavity

Part Number MC74VHC1G08

Document Outline