©
Semiconductor Components Industries, LLC, 2004
March, 2004 - Rev. 8
1
Publication Order Number:
BAS40-04LT1/D
BAS40-04LT1
Preferred Device
Dual Series
Schottky Barrier Diode
These Schottky barrier diodes are designed for high speed switching
applications, circuit protection, and voltage clamping. Extremely low
forward voltage reduces conduction loss. Miniature surface mount
package is excellent for hand held and portable applications where
space is limited.
·
Extremely Fast Switching Speed
·
Low Forward Voltage
Features
·
Pb-Free Package is Available
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Reverse Voltage
V
R
40
V
Forward Power Dissipation
@ T
A
= 25
°
C
Derate above 25
°
C
P
F
225
1.8
mW
mW/
°
C
Operating Junction and Storage Temper-
ature Range
T
J,
T
stg
- 55 to
+150
°
C
Forward Continuous Current
I
FM
120
mA
Single Forward Current
t
v
1 s
t
v
10 ms
I
FSM
200
600
mA
Thermal Resistance
Junction-to-Ambient
R
q
JA
508
(Note 1)
311
(Note 2)
°
C/W
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. FR-4 @ minimum pad.
2. FR-4 @ 1.0 x 1.0 in pad.
http://onsemi.com
Preferred devices are recommended choices for future use
and best overall value.
Device
Package
Shipping
ORDERING INFORMATION
BAS40-04LT1
SOT-23
3000/ Tape &
Reel
SOT-23 (TO-236AB)
CASE 318
Style 11
40 VOLTS
SCHOTTKY BARRIER DIODES
MARKING
DIAGRAM
CB
= Specific Device Code
D
= Date Code
1
2
3
CB D
ANODE
1
CATHODE
2
3
CATHODE/ANODE
BAS40-04LT1G
SOT-23
(Pb-Free)
3000/ Tape &
Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
BAS40-04LT1
http://onsemi.com
3
100
0
0.1
V
F
, FORWARD VOLTAGE (VOLTS)
0.2
0.3
0.4
0.5
10
1.0
0.1
85
°
C
10
0
V
R
, REVERSE VOLTAGE (VOLTS)
1.0
0.1
0.01
0.001
5.0
10
15
20
25
3.5
0
V
R
, REVERSE VOLTAGE (VOLTS)
3.0
1.0
0.5
0
C T
, CAP
ACIT
ANCE (pF)
5.0
10
15
40
I F
, FOR
W
ARD CURRENT
(mA)
Figure 1. Typical Forward Voltage
Figure 2. Reverse Current versus Reverse
Voltage
Figure 3. Typical Capacitance
-40
°
C
25
°
C
T
A
= 150
°
C
25
°
C
I R
, REVERSE CURRENT
(
µ
A)
0.8
-55
°
C
125
°
C
150
°
C
100
25
20
1.5
2.0
2.5
0.6
0.7
125
°
C
85
°
C
30
35
BAS40-04LT1
http://onsemi.com
4
PACKAGE DIMENSIONS
CASE 318-08
ISSUE AH
SOT-23 (TO-236AB)
DIM
A
MIN
MAX
MIN
MAX
MILLIMETERS
0.1102 0.1197
2.80
3.04
INCHES
B 0.0472 0.0551
1.20
1.40
C 0.0385 0.0498
0.99
1.26
D 0.0140 0.0200
0.36
0.50
G 0.0670 0.0826
1.70
2.10
H 0.0040 0.0098
0.10
0.25
J 0.0034 0.0070
0.085
0.177
K 0.0180 0.0236
0.45
0.60
L 0.0350 0.0401
0.89
1.02
S 0.0830 0.0984
2.10
2.50
V 0.0177 0.0236
0.45
0.60
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
4. 318-01, -02, AND -06 OBSOLETE, NEW
STANDARD 318-09.
1
3
2
A
L
B
S
V
G
D
H
C
K
J
STYLE 11:
PIN 1. ANODE
2. CATHODE
3. CATHODE-ANODE
SOT-123
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
mm
inches
SCALE 10:1
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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"Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
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BAS40-04LT1/D
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