Semiconductor Components Industries, LLC, 2003

February, 2003 - Rev. 0

Publication Order Number:

BAS16DXV6T1/D

BAS16DXV6T1,
BAS16DXV6T5

Preferred Device

Dual Switching Diode

MAXIMUM RATINGS

= 25

Rating

Symbol

Max

Unit

Continuous Reverse Voltage

Recurrent Peak Forward Current

200

Peak Forward Surge Current
Pulse Width = 10

FM(surge)

500

THERMAL CHARACTERISTICS

Characteristic

(One Junction Heated)

Symbol

Max

Unit

Total Device Dissipation

= 25

Derate above 25

357

(Note 1)

2.9

(Note 1)

mW/

Thermal Resistance Junction-to-Ambient

350

(Note 1)

C/W

Characteristic

(Both Junctions Heated)

Symbol

Max

Unit

Total Device Dissipation

= 25

Derate above 25

500

(Note 1)

4.0

(Note 1)

mW/

Thermal Resistance Junction-to-Ambient

250

(Note 1)

C/W

Junction and Storage Temperature

, T

stg

- 55 to

+150

1. FR-4 @ Minimum Pad

http://onsemi.com

Preferred devices are recommended choices for future use
and best overall value.

SOT-563

CASE 463A

PLASTIC

5 4

A6 = Specific Device Code
D

= Date Code

MARKING DIAGRAM

A6 D

Device

Package

Shipping

ORDERING INFORMATION

BAS16DXV6T1

SOT-563

4 mm pitch

4000/Tape & Reel

BAS16DXV6T5

SOT-563

2 mm pitch

8000/Tape & Reel

BAS16DXV6T1, BAS16DXV6T5

http://onsemi.com

ELECTRICAL CHARACTERISTICS

= 25

C unless otherwise noted)

Characteristic

Symbol

Min

Max

Unit

Forward Voltage

= 1.0 mA)

= 10 mA)

= 50 mA)

= 150 mA)

-
-
-
-

715
866

1000
1250

Reverse Current

= 75 V)

= 75 V, T

= 150

= 25 V, T

= 150

-
-
-

1.0

50
30

Capacitance

= 0, f = 1.0 MHz)

2.0

Reverse Recovery Time

= I

= 10 mA, R

= 50

) (Figure 1)

6.0

Stored Charge

= 10 mA to V

= 6.0 V, R

= 500

) (Figure 2)

Forward Recovery Voltage

= 10 mA, t

= 20 ns) (Figure 3)

1.75

BAS16DXV6T1, BAS16DXV6T5

http://onsemi.com

100

0.2

0.4

, FORWARD VOLTAGE (VOLTS)

0.6

0.8

1.0

1.2

1.0

0.1

= 85

, REVERSE VOLTAGE (VOLTS)

1.0

0.1

0.01

0.001

0.68

, REVERSE VOLTAGE (VOLTS)

0.64

0.60

0.56

0.52

C D

, DIODE CAP

ACIT

ANCE (pF)

I F

, FOR

ARD CURRENT

(mA)

Figure 4. Forward Voltage

Figure 5. Leakage Current

Figure 6. Capacitance

= -40

= 25

= 150

= 125

= 85

= 55

= 25

I R

, REVERSE CURRENT

(

Figure 7. Normalized Thermal Response

0.00001

0.0001

0.001

0.01

0.1

1.0

100

1000

0.001

0.01

0.1

1.0

r(t), NORMALIZED

TRANSIENT

THERMAL

RESIST

ANCE

t, TIME (s)

SINGLE PULSE

0.01

0.02

0.05

0.1

0.2

D = 0.5

BAS16DXV6T1, BAS16DXV6T5

http://onsemi.com

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature T

of 25

one can calculate the power dissipation of the device which
in this case is 150 milliwatts.

INFORMATION FOR USING THE SOT-563 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the to-

tal design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection

interface between the board and the package. With the cor-
rect pad geometry, the packages will self align when sub-
jected to a solder reflow process.

SOT-563 POWER DISSIPATION

J(max)

- T

150

C - 25

833

C/W

= 150 milliwatts

The power dissipation of the SOT-563 is a function of

the pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipa-
tion. Power dissipation for a surface mount device is deter-
mined by T

J(max)

, the maximum rated junction temperature

of the die, R

qJA

, the thermal resistance from the device

junction to ambient, and the operating temperature, T

. Us-

ing the values provided on the data sheet for the SOT-563
package, P

can be calculated as follows:

The 833

C/W for the SOT-563 package assumes the use

of the recommended footprint on a glass epoxy printed cir-
cuit board to achieve a power dissipation of 150 milliwatts.
There are other alternatives to achieving higher power dis-
sipation from the SOT-563 package. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad

. Using a board material such

as Thermal Clad, an aluminum core board, the power dis-
sipation can be doubled using the same footprint.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the

rated temperature of the device. When the entire device is
heated to a high temperature, failure to complete soldering
within a short time could result in device failure. There-
fore, the following items should always be observed in or-
der to minimize the thermal stress to which the devices are
subjected.

Always preheat the device.

The delta temperature between the preheat and solder-

ing should be 100

C or less.*

When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum tem-
perature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering meth-
od, the difference shall be a maximum of 10

The soldering temperature and time shall not exceed

260

C for more than 10 seconds.

When shifting from preheating to soldering, the maxi-

mum temperature gradient shall be 5

C or less.

After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.

Mechanical stress or shock should not be applied dur-

ing cooling.

* Soldering a device without preheating can cause exces-
sive thermal shock and stress which can result in damage
to the device.

1.35

0.0531

0.5

0.0197

inches

SCALE 20:1

0.5

0.0197

1.0

0.0394

0.45

0.0177

0.3

0.0118

SOT-563

BAS16DXV6T1, BAS16DXV6T5

http://onsemi.com

PACKAGE DIMENSIONS

SOT-563, 6 LEAD

CASE 463A-01

ISSUE O

0.08 (0.003)

5 PL

-X-

-Y-

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD THICKNESS

IS THE MINIMUM THICKNESS OF BASE

MATERIAL.

DIM

MIN

MAX

MIN

MAX

INCHES

1.50

1.70

0.059

0.067

MILLIMETERS

1.10

1.30

0.043

0.051

0.50

0.60

0.020

0.024

0.17

0.27

0.007

0.011

0.50 BSC

0.020 BSC

0.08

0.18

0.003

0.007

STYLE 1:

PIN 1. EMITTER 1

2. BASE 1

3. COLLECTOR 2

4. EMITTER 2

5. BASE 2

6. COLLECTOR 1

STYLE 2:

PIN 1. EMITTER 1

2. EMITTER2

3. BASE 2

4. COLLECTOR 2

5. BASE 1

6. COLLECTOR 1

0.004

0.012

0.059

0.067

0.10

0.30

1.50

1.70

STYLE 3:

PIN 1. CATHODE 1

2. CATHODE 1

3. ANODE/ANODE 2

4. CATHODE 2

5. CATHODE 2

6. ANODE/ANODE 1

STYLE 4:

PIN 1. COLLECTOR

2. COLLECTOR

3. BASE

4. EMITTER

5. COLLECTOR

6. COLLECTOR

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changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be
validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
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PUBLICATION ORDERING INFORMATION

JAPAN: ON Semiconductor, Japan Customer Focus Center

2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051
Phone: 81-3-5773-3850

ON Semiconductor Website: http://onsemi.com

For additional information, please contact your local
Sales Representative.

BAS16DXV6T1/D

Thermal Clad is a trademark of the Bergquist Company.

Literature Fulfillment:

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P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
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Part Number BAS16DXV6T5