MOTOROLA

SEMICONDUCTOR

TECHNICAL DATA

Motorola TVS/Zener Device Data

7-1

500 mW Leadless (SOD-123) Data Sheet

Designer's

Data Sheet

Surface Mount Silicon Zener Diodes

Plastic SOD 123 Package

Three complete series of Zener Diodes are offered in the convenient, surface mount

plastic SOD-123 package. These devices provide a convenient alternative to the leadless
34 package style.

500 mW Rating on FR-4 or FR-5 Board

Package Designed for Optimal Automated Board Assembly

Corrosion Resistant Finish, Easily Solderable

ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model

Small Package Size for High Density Applications

Available in 8 mm Tape and Reel

Add "T1" to the device number to order the 7 inch / 3000 unit reel.
Add "T3" to the device number to order the 13 inch / 10,000 unit reel.

Wafer Fab Location: Phoenix, Arizona

Assembly/Test Location: Seremban, Malaysia

MMSZ2V4T1 thru MMSZ75T1

Specified Similar to European BZV55C Series

Wide Voltage Range -- 2.4 to 75 Volts

DEVICE RATING

(TA = 25

C unless otherwise noted)

Rating

Symbol

Value

Unit

Power Dissipation on FR-4 or FR-5 Board [1]
Derate above TL = 75

500

6.7

mW/

Thermal Resistance Junction to Lead [2]
Thermal Resistance Junction to Ambient [2]

150
340

C/W

Junction Temperature Range

55 to +150

Storage Temperature Range

Tstg

55 to +150

Lead Solder Temperature Maximum (10 sec. duration)

260

[1] FR-4 or FR-5 = 3.5 x 1.5 inches, using the Motorola minimum recommended footprint as shown in Figure 11.
[2] Thermal Resistance measurement obtained via Infrared Scan Method

Designer's Data for "Worst Case'' Conditions -- The Designer's Data Sheet permits the design of most circuits entirely from the information presented. Limit curves -- representing
boundaries on device characteristics -- are given to facilitate "worst case'' design.

Designer's is a trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company.

Preferred devices are Motorola recommended choices for future use and best overall value.

MMSZ2V4T1

SERIES

PLASTIC SURFACE

MOUNT

ZENER DIODES

500 MILLIWATTS

1.8 91 VOLTS

CASE 425, STYLE 1

PLASTIC

1: CATHODE
2: ANODE

MMSZ2V4T1 Series

Motorola TVS/Zener Device Data

7-2

500 mW Leadless (SOD-123) Data Sheet

ELECTRICAL CHARACTERISTICS

(TA = 25

C unless otherwise noted), (VF = 0.9 V Max. @ IF = 10 mA for all types)

Zener Voltage

VZ1 (Volts)

@ IZT1 = 5 mA

[1][2]

Max Zener

Impedance

ZZT1

@ IZT1 = 5 mA

Max

Reverse

Leakage

Current

Zener Voltage

VZ2 (Volts)

@ IZT2 = 1 mA

[1]

Max Zener

Impedance

ZZT2

@ IZT1 = 1 mA

Type

Number

Marking

Nom

Min

Max

@ IZT1 = 5 mA

[3]

IR @ VR

A Volts

Min

Max

@ IZT1 = 1 mA

[3]

MMSZ2V4T1

2.4

2.28

2.52

100

1.7

2.1

600

MMSZ2V7T1

2.7

2.57

2.84

100

1.9

2.4

600

MMSZ3V0T1

3.0

2.85

3.15

2.1

2.7

600

MMSZ3V3T1

3.3

3.14

3.47

2.3

2.9

600

MMSZ3V6T1

3.6

3.42

3.78

2.7

3.3

600

MMSZ3V9T1

3.9

3.71

4.10

2.9

3.5

600

MMSZ4V3T1

4.3

4.09

4.52

3.3

4.0

600

MMSZ4V7T1

4.7

4.47

4.94

3.7

4.7

500

MMSZ5V1T1

5.1

4.85

5.36

4.2

5.3

480

MMSZ5V6T1

5.6

5.32

5.88

4.8

6.0

400

MMSZ6V2T1

6.2

5.89

6.51

5.6

6.6

150

MMSZ6V8T1

6.8

6.46

7.14

6.3

7.2

MMSZ7V5T1

7.5

7.13

7.88

6.9

7.9

MMSZ8V2T1

8.2

7.79

8.61

0.7

7.6

8.7

MMSZ9V1T1

9.1

8.65

9.56

0.5

8.4

9.6

100

MMSZ10T1

9.50

10.50

0.2

9.3

10.6

150

MMSZ11T1

10.45

11.55

0.1

10.2

11.6

150

MMSZ12T1

11.40

12.60

0.1

11.2

12.7

150

MMSZ13T1

12.35

13.65

0.1

12.3

14.0

170

MMSZ15T1

14.25

15.75

0.05

10.5

13.7

15.5

200

MMSZ16T1

15.20

16.80

0.05

11.2

15.2

17.0

200

MMSZ18T1

17.10

18.90

0.05

12.6

16.7

19.0

225

MMSZ20T1

19.00

21.00

0.05

18.7

21.1

225

MMSZ22T1

20.80

23.10

0.05

15.4

20.7

23.2

250

MMSZ24T1

22.80

25.20

0.05

16.8

22.7

25.5

250

MMSZ27T1

25.65

28.35

0.05

18.9

28.9

300

MMSZ30T1

28.50

31.50

0.05

27.8

300

MMSZ33T1

31.35

34.65

0.05

23.1

30.8

325

MMSZ36T1

34.20

37.80

0.05

25.2

33.8

350

MMSZ39T1

37.05

40.95

130

0.05

27.3

36.7

350

MMSZ43T1

40.85

45.15

150

0.05

30.1

39.7

375

MMSZ47T1

44.65

49.35

170

0.05

32.9

43.7

375

MMSZ51T1

48.45

53.55

180

0.05

35.7

47.6

400

MMSZ56T1

53.20

58.80

200

0.05

39.2

51.5

425

MMSZ62T1

58.90

65.10

215

0.05

43.4

57.4

450

MMSZ68T1

64.60

71.40

240

0.05

47.6

63.4

475

MMSZ75T1

71.25

78.75

255

0.05

52.5

69.4

500

[1] Zener voltage is measured with the zener current applied for PW = 1.0 ms.
[2] All part numbers shown indicate a V

Z tolerance of

5%.

[3] Z

ZT1 and ZZT2 are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for IZ(AC) = 0.1 IZ(DC),

[3]

with the AC frequency = 1 kHz.

[4] The zener impedance, Z

ZT2, for the 27 through 75 volt types is tested at 0.5 mA rather than the test current of 0.1 mA used for VZ2.

MMSZ2V4T1 Series

Motorola TVS/Zener Device Data

7-3

500 mW Leadless (SOD-123) Data Sheet

TYPICAL CHARACTERISTICS

, TEMPERA

TURE COEFFICIENT

(mV/

VZ, NOMINAL ZENER VOLTAGE (V)

Figure 1. Temperature Coefficients

(Temperature Range 55

C to +150

TYPICAL TC VALUES
FOR MMSZ5221BT1 SERIES

VZ @ IZT

, TEMPERA

TURE COEFFICIENT

(mV/

100

VZ, NOMINAL ZENER VOLTAGE (V)

Figure 2. Temperature Coefficients

(Temperature Range 55

C to +150

VZ @ IZT

, POWER DISSIP

TION (W

TTS)

1.2

1.0

0.8

0.6

0.4

0.2

150

125

100

T, TEMPERATURE (

Figure 3. Steady State Power Derating

PD versus TA

PD versus TL

, PEAK SURGE POWER (W

TTS)

0.1

PW, PULSE WIDTH (ms)

Figure 4. Maximum Nonrepetitive Surge Power

100

1000

100

RECTANGULAR
WAVEFORM, TA = 25

100

VZ, NOMINAL ZENER VOLTAGE

Figure 5. Effect of Zener Voltage on

Zener Impedance

, DYNAMIC IMPEDANCE (

)

1000

100

TJ = 25

IZ(AC) = 0.1 IZ(DC)
f = 1 kHz

IZ = 1 mA

5 mA

20 mA

VF, FORWARD VOLTAGE (V)

Figure 6. Typical Forward Voltage

1.2

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

I F

, FOR

ARD

CURRENT

(mA)

1000

100

75 V (MMSZ5267BT1)
91 V (MMSZ5270BT1)

150

C 25

TYPICAL TC VALUES
FOR MMSZ5221BT1 SERIES

MMSZ2V4T1 Series

Motorola TVS/Zener Device Data

7-4

500 mW Leadless (SOD-123) Data Sheet

TYPICAL CHARACTERISTICS

C, CAP

ACIT

ANCE

(pF)

100

VZ, NOMINAL ZENER VOLTAGE (V)

Figure 7. Typical Capacitance

1000

100

BIAS AT
50% OF VZ NOM

TA = 25

0 V BIAS
1 V BIAS

VZ, ZENER VOLTAGE (V)

Figure 9. Zener Voltage versus Zener Current

(VZ Up to 12 V)

100

0.1

0.01

TA = 25

I Z

, ZENER CURRENT

(mA)

VZ, ZENER VOLTAGE (V)

Figure 10. Zener Voltage versus Zener Current

(12 V to 91 V)

100

0.1

0.01

TA = 25

I R

, LEAKAGE CURRENT

(

)

VZ, NOMINAL ZENER VOLTAGE (V)

Figure 8. Typical Leakage Current

1000

100

0.1

0.01

0.001

0.0001

0.00001

+150

+ 25

I Z

, ZENER CURRENT

(mA)

MMSZ2V4T1 Series

Motorola TVS/Zener Device Data

7-5

500 mW Leadless (SOD-123) Data Sheet

INFORMATION FOR USING THE SOD-123 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINTS FOR

SURFACE MOUNT APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must be
the correct size to ensure proper solder connection interface
between the board and the package.

The minimum recommended footprint for the SOD-123 is

shown at the right.

The SOD-123 package can be used on existing surface

mount boards which have been designed for the leadless 34
package style. The footprint compatibility makes conversion
from leadless 34 to SOD-123 straightforward.

ÉÉÉÉ

inches

0.91

0.036

1.22

0.048

2.36

0.093

4.19

0.165

Figure 11. Minimum Recommended Footprint

SOD-123 POWER DISSIPATION

The power dissipation of the SOD-123 is a function of the

pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation.
Power dissipation for a surface mount device is determined by
TJ(max), the maximum rated junction temperature of the die,
R

JA, the thermal resistance from the device junction to

ambient; and the operating temperature, TA. Using the values
provided on the data sheet for the SOD-123 package, PD can
be calculated as follows:

PD =

TJ(max) TA

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25

C, one can

calculate the power dissipation of the device which in this case
is 0.37 watts.

PD =

150

C 25

340

C/W

= 0.37 watts

The 340

C/W for the SOD-123 package assumes using

recommended footprint shown on FR-4 glass epoxy printed
circuit board. Another alternative is to use a ceramic substrate
or an aluminum core board such as Thermal Clad

. By using

an aluminum core board material such as Thermal Clad, the
power dissipation can be doubled using the same footprint.

GENERAL SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.

Always preheat the device.

The delta temperature between the preheat and soldering

should be 100

C or less.*

When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10

The soldering temperature and time shall not exceed

260

C for more than 10 seconds.

When shifting from preheating to soldering, the maximum

temperature gradient shall be 5

C or less.

After soldering has been completed, the device should be

allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.

Mechanical stress or shock should not be applied during

cooling

* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.

Part Number MMSZ2V4T1