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MC74HCU04

MOTOROLA

HighSpeed CMOS Logic Data

DL129 -- Rev 6

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

MAXIMUM RATINGS*

ÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎÎÎ

Value

ÎÎÎ

Unit

ÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply Voltage (Referenced to GND)

ÎÎÎÎÎÎ

0.5 to + 7.0

ÎÎÎ

Vin

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Input Voltage (Referenced to GND)

ÎÎÎÎÎÎ

1.5 to VCC + 1.5

ÎÎÎ

Vout

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Output Voltage (Referenced to GND)

ÎÎÎÎÎÎ

0.5 to VCC + 0.5

ÎÎÎ

Iin

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Input Current, per Pin

ÎÎÎÎÎÎ

ÎÎÎ

Iout

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Output Current, per Pin

ÎÎÎÎÎÎ

ÎÎÎ

ICC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply Current, VCC and GND Pins

ÎÎÎÎÎÎ

ÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Power Dissipation in Still Air

Plastic DIP

SOIC Package

ÎÎÎÎÎÎ

750
500

ÎÎÎ

Tstg

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Storage Temperature

ÎÎÎÎÎÎ

65 to + 150

ÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Lead Temperature, 1 mm from case for 10 Seconds

(Plastic DIP or SOIC Package)

ÎÎÎÎÎÎ

260

ÎÎÎ

* Maximum Ratings are those values beyond which damage to the device may occur.

Functional operation should be restricted to the Recommended Operating Conditions.

Derating -- Plastic DIP: 10mW/

C from 65

to 125

SOIC Package: 7mW/

C from 65

to 125

For high frequency or heavy load considerations, see Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎ

Min

ÎÎÎ

Max

ÎÎÎ

Unit

ÎÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply Voltage (Referenced to GND)

ÎÎÎ

2.0

ÎÎÎ

6.0

ÎÎÎ

ÎÎÎÎ

Vin, Vout

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Input Voltage, Output Voltage (Referenced to GND)

ÎÎÎ

VCC

ÎÎÎ

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Operating Temperature, All Package Types

ÎÎÎ

+ 125

ÎÎÎ

ÎÎÎÎ

tr, tf

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Input Rise and Fall Time (Figure 1)

ÎÎÎ

Limit

ÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC ELECTRICAL CHARACTERISTICS

(Voltages Referenced to GND)

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

Guaranteed Limit

ÎÎÎ

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎÎÎÎÎÎ

Test Conditions

ÎÎÎÎ

VCC

ÎÎÎ

 55 to

ÎÎÎÎ

125

ÎÎÎ

Unit

ÎÎÎÎ

VIH

ÎÎÎÎÎÎÎÎÎ

Minimum HighLevel Input
Voltage

ÎÎÎÎÎÎÎÎÎ

Vout = 0.5 V*
|Iout|

ÎÎÎÎ

2.0
4.5
6.0

ÎÎÎ

1.7
3.6
4.8

ÎÎÎÎ

1.7
3.6
4.8

ÎÎÎÎ

l.7

3.6
4.8

ÎÎÎ

ÎÎÎÎ

VIL

ÎÎÎÎÎÎÎÎÎ

Maximum LowLevel Input
Voltage

ÎÎÎÎÎÎÎÎÎ

Vout = VCC 0.5 V*
|Iout|

ÎÎÎÎ

2.0
4.5
6.0

ÎÎÎ

0.3
0.8
1.1

ÎÎÎÎ

0.3
0.8
1.1

ÎÎÎÎ

0.3
0.8
1.1

ÎÎÎ

ÎÎÎÎ

VOH

ÎÎÎÎÎÎÎÎÎ

Minimum HighLevel Output
Voltage

ÎÎÎÎÎÎÎÎÎ

Vin = GND
|Iout|

ÎÎÎÎ

2.0
4.5
6.0

ÎÎÎ

1.8
4.0
5.5

ÎÎÎÎ

1.8
4.0
5.5

ÎÎÎÎ

1.8
4.0
5.5

ÎÎÎ

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

Vin = GND

|Iout|

4.0 mA

|Iout|

5.2 mA

ÎÎÎÎ

4.5
6.0

ÎÎÎ

3.86
5.36

ÎÎÎÎ

3.76
5.26

ÎÎÎÎ

3.70
5.20

ÎÎÎ

ÎÎÎÎ

VOL

ÎÎÎÎÎÎÎÎÎ

Maximum LowLevel Output
Voltage

ÎÎÎÎÎÎÎÎÎ

Vin = VCC
|Iout|

ÎÎÎÎ

2.0
4.5
6.0

ÎÎÎ

0.2
0.5
0.5

ÎÎÎÎ

0.2
0.5
0.5

ÎÎÎÎ

0.2
0.5
0.5

ÎÎÎ

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

Vin = VCC

|Iout|

4.0 mA

|Iout|

5.2 mA

ÎÎÎÎ

4.5
6.0

ÎÎÎ

0.32
0.32

ÎÎÎÎ

0.37
0.37

ÎÎÎÎ

0.40
0.40

ÎÎÎ

ÎÎÎÎ

Iin

ÎÎÎÎÎÎÎÎÎ

Maximum Input Leakage Current

ÎÎÎÎÎÎÎÎÎ

Vin = VCC or GND

ÎÎÎÎ

6.0

ÎÎÎ

0.1

ÎÎÎÎ

1.0

ÎÎÎÎ

1.0

ÎÎÎ

ÎÎÎÎ

ICC

ÎÎÎÎÎÎÎÎÎ

Maximum Quiescent Supply
Current (per Package)

ÎÎÎÎÎÎÎÎÎ

Vin = VCC or GND
Iout = 0

ÎÎÎÎ

6.0

ÎÎÎ

ÎÎÎÎ

ÎÎÎ

NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).
* For VCC = 2.0 V, Vout = 0.2 V or VCC 0.2 V.

This device contains protection

circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this highimpedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND

(Vin or Vout)

VCC.

Unused inputs must always be

tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.

MC74HCU04

HighSpeed CMOS Logic Data
DL129 -- Rev 6

MOTOROLA

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

AC ELECTRICAL CHARACTERISTICS

(CL = 50 pF, Input tr = tf = 6 ns)

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

Guaranteed Limit

ÎÎÎ

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎ

VCC

ÎÎÎ

 55 to

ÎÎÎÎ

125

ÎÎÎ

Unit

ÎÎÎÎ

tPLH,

tPHL

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Propagation Delay, Input A to Output Y

(Figures 1 and 2)

ÎÎÎÎ

2.0
4.5
6.0

ÎÎÎ

80
16
14

ÎÎÎÎ

100

20
17

ÎÎÎÎ

120

24
20

ÎÎÎ

ÎÎÎÎ

tTLH,

tTHL

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Output Transition Time, Any Output

(Figures 1 and 2)

ÎÎÎÎ

2.0
4.5
6.0

ÎÎÎ

75
15
13

ÎÎÎÎ

95
19
16

ÎÎÎÎ

110

22
19

ÎÎÎ

ÎÎÎÎ

Cin

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Input Capacitance

ÎÎÎÎ

ÎÎÎ

ÎÎÎÎ

ÎÎÎ

NOTES:

1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).

CPD

Power Dissipation Capacitance (Per Inverter)*

Typical @ 25

C, VCC = 5.0 V

CPD

Power Dissipation Capacitance (Per Inverter)*

* Used to determine the noload dynamic power consumption: PD = CPD VCC2f + ICC VCC. For load considerations, see Chapter 2 of the

Motorola HighSpeed CMOS Data Book (DL129/D).

Figure 1. Switching Waveforms

VCC

GND

90%

50%

10%

90%

50%

10%

INPUT A

OUTPUT Y

tPHL

tPLH

tTHL

tTLH

* Includes all probe and jig capacitance

Figure 2. Test Circuit

CL*

TEST POINT

DEVICE

UNDER

TEST

OUTPUT

LOGIC DETAIL

(1/6 of Device Shown)

VCC

MC74HCU04

HighSpeed CMOS Logic Data
DL129 -- Rev 6

MOTOROLA

OUTLINE DIMENSIONS

N SUFFIX

PLASTIC DIP PACKAGE

CASE 64606

ISSUE L

NOTES:

1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE

POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLD

FLASH.

4. ROUNDED CORNERS OPTIONAL.

SEATING
PLANE

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

0.715

0.770

18.16

19.56

0.240

0.260

6.10

6.60

0.145

0.185

3.69

4.69

0.015

0.021

0.38

0.53

0.040

0.070

1.02

1.78

0.100 BSC

2.54 BSC

0.052

0.095

1.32

2.41

0.008

0.015

0.20

0.38

0.115

0.135

2.92

3.43

0.300 BSC

7.62 BSC

0.015

0.039

0.39

1.01

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751A03

ISSUE F

MIN

MAX

MILLIMETERS

INCHES

DIM

A
B
C
D

K
M
P
R

8.55
3.80
1.35
0.35
0.40

0.19
0.10

5.80
0.25

8.75
4.00
1.75
0.49
1.25

0.25
0.25

6.20
0.50

0.337
0.150
0.054
0.014
0.016

0.008
0.004

0.228
0.010

0.344
0.157
0.068
0.019
0.049

0.009
0.009

0.244
0.019

1.27 BSC

0.050 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.

A

B

7 PL

SEATING
PLANE

14 PL

X 45

0.25 (0.010)

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Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
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MC74HCU04/D

*MC74HCU04/D*

CODELINE

Part Number MC74HCU04