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MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

REV 6

Motorola, Inc. 1995

10/95

Octal 3-State

Noninverting D Flip-Flop

HighPerformance SiliconGate CMOS

The MC54/74HC374A is identical in pinout to the LS374. The device

inputs are compatible with standard CMOS outputs; with pullup resistors,
they are compatible with LSTTL outputs.

Data meeting the setup time is clocked to the outputs with the rising edge

of the clock. The Output Enable input does not affect the states of the
flipflops, but when Output Enable is high, the outputs are forced to the
highimpedance state; thus, data may be stored even when the outputs are
not enabled.

The HC374A is identical in function to the HC574A which has the input

pins on the opposite side of the package from the output. This device is
similar in function to the HC534A which has inverting outputs.

Output Drive Capability: 15 LSTTL Loads

Outputs Directly Interface to CMOS, NMOS, and TTL

Operating Voltage Range: 2.0 to 6.0 V

Low Input Current: 1.0

High Noise Immunity Characteristic of CMOS Devices

In Compliance with the Requirements Defined by JEDEC Standard
No. 7A

Chip Complexity: 266 FETs or 66.5 Equivalent Gates

LOGIC DIAGRAM

DATA

INPUTS

CLOCK

OUTPUT ENABLE

PIN 20 = VCC
PIN 10 = GND

NONINVERTING

OUTPUTS

FUNCTION TABLE

Inputs

Output

Output
Enable

Clock

L,H,

No Change

X = don't care
Z = high impedance

MC54/74HC374A

PIN ASSIGNMENT

OUTPUT

ENABLE

GND

VCC

CLOCK

DW SUFFIX

SOIC PACKAGE

CASE 751D04

N SUFFIX

PLASTIC PACKAGE

CASE 73803

ORDERING INFORMATION

MC54HCXXXAJ
MC74HCXXXAN
MC74HCXXXADW
MC74HCXXXASD
MC74HCXXXADT

Ceramic
Plastic
SOIC
SSOP
TSSOP

DT SUFFIX

TSSOP PACKAGE

CASE 948E02

J SUFFIX

CERAMIC PACKAGE

CASE 73203

SD SUFFIX

SSOP PACKAGE

CASE 940C03

MC54/74HC374A

MOTOROLA

HighSpeed CMOS Logic Data

DL129 -- Rev 6

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

MAXIMUM RATINGS*

ÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎÎÎ

Value

ÎÎÎ

Unit

ÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply Voltage (Referenced to GND)

ÎÎÎÎÎÎ

0.5 to + 7.0

ÎÎÎ

Vin

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Input Voltage (Referenced to GND)

ÎÎÎÎÎÎ

1.5 to VCC + 1.5

ÎÎÎ

Vout

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Output Voltage (Referenced to GND)

ÎÎÎÎÎÎ

0.5 to VCC + 0.5

ÎÎÎ

Iin

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Input Current, per Pin

ÎÎÎÎÎÎ

ÎÎÎ

Iout

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Output Current, per Pin

ÎÎÎÎÎÎ

ÎÎÎ

ICC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply Current, VCC and GND Pins

ÎÎÎÎÎÎ

ÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Power Dissipation in Still Air, Plastic or Ceramic DIP

SOIC Package

SSOP or TSSOP Package

ÎÎÎÎÎÎ

750
500
450

ÎÎÎ

Tstg

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Storage Temperature

ÎÎÎÎÎÎ

65 to + 150

ÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Lead Temperature, 1 mm from Case for 10 Seconds

(Plastic DIP, SOIC, SSOP or TSSOP Package)

(Ceramic DIP)

ÎÎÎÎÎÎ

260
300

ÎÎÎ

* Maximum Ratings are those values beyond which damage to the device may occur.

Functional operation should be restricted to the Recommended Operating Conditions.

Derating -- Plastic DIP: 10 mW/

C from 65

to 125

Ceramic DIP: 10 mW/

C from 100

to 125

SOIC Package: 7 mW/

C from 65

to 125

SSOP or TSSOP Package: 6.1 mW/

C from 65

to 125

For high frequency or heavy load considerations, see Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎ

Min

ÎÎÎ

Max

ÎÎÎ

Unit

ÎÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply Voltage (Referenced to GND)

ÎÎÎ

2.0

ÎÎÎ

6.0

ÎÎÎ

ÎÎÎÎ

Vin, Vout

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Input Voltage, Output Voltage (Referenced to GND)

ÎÎÎ

VCC

ÎÎÎ

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Operating Temperature, All Package Types

ÎÎÎ

+ 125

ÎÎÎ

ÎÎÎÎ

tr, tf

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Input Rise and Fall Time

VCC = 2.0 V

(Figure 1)

VCC = 4.5 V
VCC = 6.0 V

ÎÎÎ

0
0
0

ÎÎÎ

1000

500
400

ÎÎÎ

DC ELECTRICAL CHARACTERISTICS

(Voltages Referenced to GND)

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎÎÎÎÎÎ

Test Conditions

ÎÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎ

Guaranteed Limit

ÎÎÎ

Unit

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎÎÎÎÎÎ

Test Conditions

ÎÎÎÎ

VCC

ÎÎÎ

 55 to

ÎÎÎÎ

125

ÎÎÎ

Unit

ÎÎÎÎ

VIH

ÎÎÎÎÎÎÎÎÎ

Minimum HighLevel Input
Voltage

ÎÎÎÎÎÎÎÎÎ

Vout = 0.1 V or VCC 0.1 V
|Iout|

ÎÎÎÎ

2.0
4.5
6.0

ÎÎÎ

1.50
3.15
4.20

ÎÎÎÎ

1.50
3.15
4.20

ÎÎÎÎ

1.50
3.15
4.20

ÎÎÎ

ÎÎÎÎ

VIL

ÎÎÎÎÎÎÎÎÎ

Maximum LowLevel Input
Voltage

ÎÎÎÎÎÎÎÎÎ

Vout = 0.1 V or VCC 0.1 V
|Iout|

ÎÎÎÎ

2.0
4.5
6.0

ÎÎÎ

0.50
1.35
1.80

ÎÎÎÎ

0.50
1.35
1.80

ÎÎÎÎ

0.50
1.35
1.80

ÎÎÎ

ÎÎÎÎ

VOH

ÎÎÎÎÎÎÎÎÎ

Minimum HighLevel Output
Voltage

ÎÎÎÎÎÎÎÎÎ

Vin = VIH or VIL
|Iout|

ÎÎÎÎ

2.0
4.5
6.0

ÎÎÎ

1.90
4.40
5.90

ÎÎÎÎ

1.90
4.40
5.90

ÎÎÎÎ

1.90
4.40
5.90

ÎÎÎ

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

Vin = VIH or VIL
|Iout|

6.0 mA

|Iout|

7.8 mA

ÎÎÎÎ

4.5
6.0

ÎÎÎ

3.98
5.48

ÎÎÎÎ

3.84
5.34

ÎÎÎÎ

3.70
5.20

ÎÎÎ

This device contains protection

circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this highimpedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND

(Vin or Vout)

VCC.

Unused inputs must always be

tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.

MC54/74HC374A

HighSpeed CMOS Logic Data
DL129 -- Rev 6

MOTOROLA

DC ELECTRICAL CHARACTERISTICS

(Voltages Referenced to GND)

ÎÎÎ

Unit

ÎÎÎÎÎÎÎÎÎ

Guaranteed Limit

ÎÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎ

Test Conditions

ÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎ

Symbol

ÎÎÎ

Unit

ÎÎÎÎ

125

ÎÎÎÎ

ÎÎÎ

 55 to

ÎÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎ

Test Conditions

ÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎ

Symbol

ÎÎÎÎ

VOL

ÎÎÎÎÎÎÎÎÎ

Maximum LowLevel Output
Voltage

ÎÎÎÎÎÎÎÎÎ

Vin = VIH or VIL
|Iout|

ÎÎÎÎ

2.0
4.5
6.0

ÎÎÎ

0.10
0.10
0.10

ÎÎÎÎ

0.10
0.10
0.10

ÎÎÎÎ

0.10
0.10
0.10

ÎÎÎ

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

Vin = VIH or VIL
|Iout|

6.0 mA

|Iout|

7.8 mA

ÎÎÎÎ

4.5
6.0

ÎÎÎ

0.26
0.26

ÎÎÎÎ

0.33
0.33

ÎÎÎÎ

0.40
0.40

ÎÎÎ

ÎÎÎÎ

Iin

ÎÎÎÎÎÎÎÎÎ

Maximum Input Leakage Current

ÎÎÎÎÎÎÎÎÎ

Vin = VCC or GND

ÎÎÎÎ

6.0

ÎÎÎ

0.1

ÎÎÎÎ

1.0

ÎÎÎÎ

1.0

ÎÎÎ

ÎÎÎÎ

IOZ

ÎÎÎÎÎÎÎÎÎ

Maximum ThreeState
Leakage Current

ÎÎÎÎÎÎÎÎÎ

Output in HighImpedance State
Vin = VIL or VIH
Vout = VCC or GND

ÎÎÎÎ

6.0

ÎÎÎ

0.5

ÎÎÎÎ

5.0

ÎÎÎÎ

ÎÎÎ

ÎÎÎÎ

ICC

ÎÎÎÎÎÎÎÎÎ

Maximum Quiescent Supply
Current (per Package)

ÎÎÎÎÎÎÎÎÎ

Vin = VCC or GND
Iout = 0

ÎÎÎÎ

6.0

ÎÎÎ

ÎÎÎÎ

160

ÎÎÎ

NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).

SWITCHING WAVEFORMS

Figure 1.

VCC

GND

tTHL

tTLH

90%

50%

10%

90%

50%

10%

CLOCK

tPLH

tPHL

1/fmax

50%

OUTPUT

ENABLE

tPZL

tPLZ

tPZH tPHZ

10%

90%

VCC

GND

HIGH
IMPEDANCE

VOL

VOH

HIGH
IMPEDANCE

50%

DATA

CLOCK

VCC

GND

VALID

tsu

50%

Figure 2.

Figure 3.

MC54/74HC374A

HighSpeed CMOS Logic Data
DL129 -- Rev 6

MOTOROLA

OUTLINE DIMENSIONS

J SUFFIX

CERAMIC PACKAGE

CASE 73203

ISSUE E

N SUFFIX

PLASTIC PACKAGE

CASE 73803

ISSUE E

DW SUFFIX

PLASTIC SOIC PACKAGE

CASE 751D04

ISSUE E

NOTES:

1. LEADS WITHIN 0.25 (0.010) DIAMETER, TRUE

POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

3. DIMENSIONS A AND B INCLUDE MENISCUS.

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

23.88

25.15

0.940

0.990

6.60

7.49

0.260

0.295

3.81

5.08

0.150

0.200

0.38

0.56

0.015

0.022

1.40

1.65

0.055

0.065

2.54 BSC

0.100 BSC

0.51

1.27

0.020

0.050

0.20

0.30

0.008

0.012

3.18

4.06

0.125

0.160

7.62 BSC

0.300 BSC

0.25

1.02

0.010

0.040

SEATING
PLANE

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD

FLASH.

20 PL

0.25 (0.010)

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

25.66

27.17

1.010

1.070

6.10

6.60

0.240

0.260

3.81

4.57

0.150

0.180

0.39

0.55

0.015

0.022

2.54 BSC

0.100 BSC

0.21

0.38

0.008

0.015

2.80

3.55

0.110

0.140

7.62 BSC

0.300 BSC

0.51

1.01

0.020

0.040

1.27

1.77

0.050

0.070

A

SEATING
PLANE

20 PL

T

0.25 (0.010)

1.27 BSC

0.050 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.150

(0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.

A

B

0.010 (0.25)

20X

0.010 (0.25)

10X

18X

T

SEATING
PLANE

X 45

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

12.65

12.95

0.499

0.510

7.40

7.60

0.292

0.299

2.35

2.65

0.093

0.104

0.35

0.49

0.014

0.019

0.50

0.90

0.020

0.035

1.27 BSC

0.050 BSC

0.25

0.32

0.010

0.012

0.10

0.25

0.004

0.009

10.05

10.55

0.395

0.415

0.25

0.75

0.010

0.029

MC54/74HC374A

MOTOROLA

HighSpeed CMOS Logic Data

DL129 -- Rev 6

OUTLINE DIMENSIONS

DT SUFFIX

PLASTIC TSSOP PACKAGE

CASE 948E02

ISSUE A

DIM

MIN

MAX

MIN

MAX

INCHES

6.60

0.260

MILLIMETERS

4.30

4.50

0.169

0.177

1.20

0.047

0.05

0.15

0.002

0.006

0.50

0.75

0.020

0.030

0.65 BSC

0.026 BSC

0.27

0.37

0.011

0.015

0.09

0.20

0.004

0.008

0.09

0.16

0.004

0.006

0.19

0.30

0.007

0.012

0.19

0.25

0.007

0.010

6.40 BSC

0.252 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE W.

ÍÍÍÍ

PIN 1
IDENT

T

0.100 (0.004)

SECTION NN

J J1

W

SEATING
PLANE

V

U

0.10 (0.004)

20X REF

L/2

0.15 (0.006) T

DETAIL E

0.25 (0.010)

DETAIL E

6.40

0.252

0.15 (0.006) T

SD SUFFIX

PLASTIC SSOP PACKAGE

CASE 940C03

ISSUE B

20X REF

0.12 (0.005)

L/2

PIN 1
IDENT

0.20 (0.008)

V

U

0.076 (0.003)

T

SEATING
PLANE

DETAIL E

0.25 (0.010)

ÇÇÇ

ÉÉÉ

SECTION NN

DIM

MIN

MAX

MIN

MAX

INCHES

7.07

7.33

0.278

0.288

MILLIMETERS

5.20

5.38

0.205

0.212

1.73

1.99

0.068

0.078

0.05

0.21

0.002

0.008

0.63

0.95

0.024

0.037

0.65 BSC

0.026 BSC

0.59

0.75

0.023

0.030

0.09

0.20

0.003

0.008

0.09

0.16

0.003

0.006

0.25

0.38

0.010

0.015

0.25

0.33

0.010

0.013

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM MATERIAL
CONDITION. DAMBAR INTRUSION SHALL NOT
REDUCE DIMENSION K BY MORE THAN 0.07 (0.002)
AT LEAST MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE

ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINED AT

DATUM PLANE W.

7.65

7.90

0.301

0.311

DETAIL E

W

MC54/74HC374A

HighSpeed CMOS Logic Data
DL129 -- Rev 6

MOTOROLA

How to reach us:
USA/EUROPE: Motorola Literature Distribution;

JAPAN: Nippon Motorola Ltd.; TatsumiSPDJLDC, Toshikatsu Otsuki,

P.O. Box 20912; Phoenix, Arizona 85036. 18004412447

6F SeibuButsuryuCenter, 3142 Tatsumi KotoKu, Tokyo 135, Japan. 0335218315

MFAX: RMFAX0@email.sps.mot.com TOUCHTONE (602) 2446609

HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,

INTERNET: http://DesignNET.com

51 Ting Kok Road, Tai Po, N.T., Hong Kong. 85226629298

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different
applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does
not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in
systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of
the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such
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against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
Motorola and

are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

MC54/74HC374A/D

*MC54/74HC374A/D*

CODELINE

Part Number MC54/74HC374A