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Part Number MC100E141

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D4
VCCO
D2
D3
Q2
Q7
VCCO
D5
D6
D7
DL
SEL0
Q3
SEL1
CLK
MR
VEE
DR
D0
D1
26
27
28
2
3
4
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
5
6
7
8
9
10
Q6
Q5
VCC
NC
VCCO
Q4
Q0
Q1
1
Pinout: 28-Lead PLCC (Top View)
* All VCC and VCCO pins are tied together on the die.
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
2­1
REV 3
©
Motorola, Inc. 1996
7/96
8 Bit Shift Register
The MC10E/100E141 is an 8-bit full-function shift register. The E141
performs serial/parallel in and serial/parallel out, shifting in either
direction. The eight inputs D0 ­ D7 accept parallel input data, while
DL/DR accept serial input data for left/right shifting. The Qn outputs do
not need to be terminated for the shift operation to function. To minimize
noise and power, any Q output not used should be left unterminated.
·
700MHz Min. Shift Frequency
·
8-Bit
·
Full-Function, Bi-Directional
·
Asynchronous Master Reset
·
Pin-Compatible with E241
·
Extended 100E VEE Range of ­ 4.2V to ­ 5.46V
·
75k
Input Pulldown Resistors
The select pins, SEL0 and SEL1, select one of four modes of
operation: Load, Hold, Shift Left, Shift Right, according to the Function
Table.
Input data is accepted a set-up time before the positive clock edge. A
HIGH on the Master Reset (MR) pin asynchronously resets all the
registers to zero.
FUNCTION TABLE
SEL0
SEL1
Function
L
L
Load
L
H
Shift Right (Dn to Dn+1)
H
L
Shift Left (Dn to Dn ­1)
H
H
Hold
PIN NAMES
Pin
Function
D0 ­ D7
Parallel Data Inputs
DL, DR
Serial Data Inputs
SEL0, SEL1
Mode Select In Inputs
CLK
Clock
Q0 ­ Q7
Data Outputs
MR
Master Reset
EXPANDED FUNCTION TABLE
Function
DL
DR
SEL0
SEL1
MR
CLK
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Load
X
X
L
L
L
Z
D0
D1
D2
D3
D4
D5
D6
D7
Shift Right
X
L
L
H
L
Z
L
Q0
Q1
Q2
Q3
Q4
Q5
Q6
X
H
L
H
L
Z
H
L
Q0
Q1
Q2
Q3
Q4
Q5
Shift Left
L
X
H
L
L
Z
L
Q0
Q1
Q2
Q3
Q4
Q5
L
H
X
H
L
L
Z
Q0
Q1
Q2
Q3
Q4
Q5
L
H
Hold
X
X
H
H
L
Z
Q0
Q1
Q2
Q3
Q4
Q5
L
H
X
X
H
H
L
Z
Q0
Q1
Q2
Q3
Q4
Q5
L
H
Reset
X
X
X
X
H
X
L
L
L
L
L
L
L
L
MC10E141
MC100E141
8-BIT SHIFT
REGISTER
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
MC10E141 MC100E141
MOTOROLA
ECLinPS and ECLinPS Lite
DL140 -- Rev 4
2­2
LOGIC DIAGRAM
BITS 1 ­ 6
DL
Q7
D
Q
R
D
Q
R
D
Q
R
DR
D0
SEL1
SEL0
CLK
MR
Q0
D
Q D7
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0
°
C
25
°
C
85
°
C
Symbol
Characteristic
min
typ
max
min
typ
max
min
typ
max
Unit
Condition
IIH
Input HIGH Current
150
150
150
µ
A
IEE
Power Supply Current
mA
10E
131
181
131
181
131
181
100E
131
181
131
181
151
181
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0
°
C
25
°
C
85
°
C
Symbol
Characteristic
min
typ
max
min
typ
max
min
typ
max
Unit
Condition
fSHIFT
Max. Shift Frequency
700
900
700
900
700
900
MH
z
tPLH
Propagation Delay To Output
ps
tPHL
Clk
625
750
975
625
750
975
625
750
975
MR
600
725
975
600
725
975
600
725
975
ts
Setup Time
ps
D
175
25
175
25
175
25
SEL0
350
200
350
200
350
200
SEL1
300
150
300
150
300
150
th
Hold Time
ps
D
200
­ 25
200
­ 25
200
­ 25
SEL0
100
­ 200
100
­ 200
100
­ 200
SEL1
100
­150
100
­150
100
­150
tRR
Reset Recovery Time
900
700
900
700
900
700
ps
tPW
Minimum Pulse Width
ps
Clk, MR
400
400
400
tSKEW
Within-Device Skew
60
60
60
ps
1
tr
Rise/Fall Times
ps
tf
20 - 80%
300
525
800
300
525
800
300
525
800
1. Within-device skew is defined as identical transitions on similar paths through a device.
MC10E141 MC100E141
2­3
MOTOROLA
ECLinPS and ECLinPS Lite
DL140 -- Rev 4
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776­02
ISSUE D
0.007 (0.180)
T L ­M
S
N
S
M
0.007 (0.180)
T L ­M
S
N
S
M
0.007 (0.180)
T L ­M
S
N
S
M
0.010 (0.250)
T L ­M
S
N
S
S
0.007 (0.180)
T L ­M
S
N
S
M
0.010 (0.250)
T L ­M
S
N
S
S
0.007 (0.180)
T L ­M
S
N
S
M
0.007 (0.180)
T L ­M
S
N
S
M
0.004 (0.100)
SEATING
PLANE
-T-
12.32
12.32
4.20
2.29
0.33
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
--
2
°
10.42
1.02
12.57
12.57
4.57
2.79
0.48
0.81
--
--
11.58
11.58
1.21
1.21
1.42
0.50
10
°
10.92
--
1.27 BSC
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MIN
MIN
MAX
MAX
INCHES
MILLIMETERS
DIM
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
VIEW S
B
U
Z
G1
X
VIEW D-D
H
K
F
VIEW S
G
C
Z
A
R
E
J
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
--
2
°
0.410
0.040
0.495
0.495
0.180
0.110
0.019
0.032
--
--
0.456
0.456
0.048
0.048
0.056
0.020
10
°
0.430
--
0.050 BSC
-N-
Y BRK
D
D
W
-M-
-L-
28
1
V
G1
K1
MC10E141 MC100E141
MOTOROLA
ECLinPS and ECLinPS Lite
DL140 -- Rev 4
2­4
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MC10E141/D
*MC10E141/D*