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Motorola SmallSignal Transistors, FETs and Diodes Device Data

Preliminary Information

NPN Silicon General Purpose

Amplifier Transistor

This NPN transistor is designed for general purpose amplifier applications.

This device is housed in the SOT-416/SC90 package which is designed for
low power surface mount applications, where board space is at a premium.

Reduces Board Space

High hFE, 210460 (typical)

Low VCE(sat), < 0.5 V

Available in 8 mm, 7-inch/3000 Unit Tape and Reel

MAXIMUM RATINGS

(TA = 25

Rating

Symbol

Value

Unit

Collector-Base Voltage

V(BR)CBO

Vdc

Collector-Emitter Voltage

V(BR)CEO

Vdc

Emitter-Base Voltage

V(BR)EBO

5.0

Vdc

Collector Current -- Continuous

100

mAdc

DEVICE MARKING

2SC4617 = B9

THERMAL CHARACTERISTICS

Rating

Symbol

Max

Unit

Power Dissipation(1)

125

Junction Temperature

150

Storage Temperature Range

Tstg

55 ~ + 150

ELECTRICAL CHARACTERISTICS

(TA = 25

Characteristic

Symbol

Min

Typ

Max

Unit

Collector-Base Breakdown Voltage (IC = 50

Adc, IE = 0)

V(BR)CBO

Vdc

Collector-Emitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0)

V(BR)CEO

Vdc

Emitter-Base Breakdown Voltage (IE = 50

Adc, IE = 0)

V(BR)EBO

5.0

Vdc

Collector-Base Cutoff Current (VCB = 30 Vdc, IE = 0)

ICBO

0.5

Emitter-Base Cutoff Current (VEB = 4.0 Vdc, IB = 0)

IEBO

0.5

Collector-Emitter Saturation Voltage(2)

(IC = 60 mAdc, IB = 5.0 mAdc)

VCE(sat)

0.4

Vdc

DC Current Gain(2)

(VCE = 6.0 Vdc, IC = 1.0 mAdc)

hFE

120

560

Transition Frequency (VCE = 12 Vdc, IC = 2.0 mAdc, f = 30 MHz)

180

MHz

Output Capacitance (VCB = 12 Vdc, IC = 0 Adc, f = 1 MHz)

COB

2.0

1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. Pulse Test: Pulse Width

300

s, D.C.

2%.

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.

Thermal Clad is a trademark of the Bergquist Company

Order this document

by 2SC4617/D

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

2SC4617

NPN GENERAL

PURPOSE AMPLIFIER

TRANSISTORS

SURFACE MOUNT

CASE 46301, STYLE 1

SOT416/SC90

COLLECTOR

BASE

EMITTER

Motorola, Inc. 1996

2SC4617

Motorola SmallSignal Transistors, FETs and Diodes Device Data

TYPICAL ELECTRICAL CHARACTERISTICS

Figure 1. IC VCE

VCE, COLLECTOR VOLTAGE (V)

Figure 2. DC Current Gain

IC, COLLECTOR CURRENT (mA)

Figure 3. Collector Saturation Region

IB, BASE CURRENT (mA)

Figure 4. On Voltage

IC, COLLECTOR CURRENT (mA)

I C

, COLLECT

CURRENT

(mA)

TA = 25

160

140

120

100

IB = 20

DC CURRENT

GAIN

1000

0.1

100

TA = 25

TA = 75

VCE = 10 V

, COLLECT

OR-EMITTER

VOL

T
AGE (V)

0.01

1.5

0.5

0.1

100

TA = 25

COLLECT

OR VOL

T
AGE

(mV)

900

0.2

800

700

600

500

400

300

200

100

0.5

100

150

200

TA = 25

VCE = 5 V

Figure 5. Capacitance

VCB (V)

Figure 6. Capacitance

VEB (V)

, INPUT

CAP

ACIT

ANCE

(pF)

, CAP

ACIT

ANCE

(pF)

2SC4617

Motorola SmallSignal Transistors, FETs and Diodes Device Data

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection

interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.

ÉÉÉ

1.4

0.5 min. (3x)

TYPICAL

0.5

SOLDERING PATTERN

Unit: mm

SOT416/SC90 POWER DISSIPATION

The power dissipation of the SOT416/SC90 is a function

of the pad size. This can vary from the minimum pad size for
soldering to the pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by TJ(max), the maximum rated junction tempera-
ture of the die, R

JA, the thermal resistance from the device

junction to ambient; and the operating temperature, TA.
Using the values provided on the data sheet, PD can be
calculated as follows.

PD =

TJ(max) TA

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values into

the equation for an ambient temperature TA of 25

C, one can

calculate the power dissipation of the device which in this
case is 125 milliwatts.

PD =

150

C 25

1000

C/W

= 125 milliwatts

The 1000

C/W assumes the use of the recommended

footprint on a glass epoxy printed circuit board to achieve a
power dissipation of 125 milliwatts. Another alternative would
be to use a ceramic substrate or an aluminum core board
such as Thermal Clad

. Using a board material such as

Thermal Clad, a higher power dissipation can be achieved
using the same footprint.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.

Always preheat the device.

The delta temperature between the preheat and
soldering should be 100

C or less.*

When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10

The soldering temperature and time should not exceed
260

C for more than 10 seconds.

When shifting from preheating to soldering, the
maximum temperature gradient should be 5

C or less.

After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.

Mechanical stress or shock should not be applied during
cooling

* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.

2SC4617

Motorola SmallSignal Transistors, FETs and Diodes Device Data

SOLDER STENCIL GUIDELINES

Prior to placing surface mount components onto a printed

circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.

The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.

TYPICAL SOLDER HEATING PROFILE

For any given circuit board, there will be a group of control

settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a
figure for belt speed. Taken together, these control settings
make up a heating "profile" for that particular circuit board.
On machines controlled by a computer, the computer
remembers these profiles from one operating session to the
next. Figure 7 shows a typical heating profile for use when
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems but it is a good
starting point. Factors that can affect the profile include the
type of soldering system in use, density and types of
components on the board, type of solder used, and the type
of board or substrate material being used. This profile shows
temperature versus time. The line on the graph shows the

actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density board.
The Vitronics SMD310 convection/infrared reflow soldering
system was used to generate this profile. The type of solder
used was 62/36/2 Tin Lead Silver with a melting point
between 177 189

C. When this type of furnace is used for

solder reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.

STEP 1

PREHEAT

ZONE 1
"RAMP"

STEP 2

VENT

"SOAK"

STEP 3

HEATING

ZONES 2 & 5

"RAMP"

STEP 4

HEATING

ZONES 3 & 6

"SOAK"

STEP 5

HEATING

ZONES 4 & 7

"SPIKE"

STEP 6

VENT

STEP 7

COOLING

200

150

100

TIME (3 TO 7 MINUTES TOTAL)

TMAX

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

MASS OF ASSEMBLY)

205

TO 219

PEAK AT

SOLDER JOINT

DESIRED CURVE FOR LOW

MASS ASSEMBLIES

100

150

160

140

Figure 7. Typical Solder Heating Profile

DESIRED CURVE FOR HIGH

MASS ASSEMBLIES

170

2SC4617

Motorola SmallSignal Transistors, FETs and Diodes Device Data

PACKAGE DIMENSIONS

CASE 46301

ISSUE A

SOT416/SC90

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

0.70

0.80

0.028

0.031

1.40

1.80

0.055

0.071

0.60

0.90

0.024

0.035

0.15

0.30

0.006

0.012

1.00 BSC

0.039 BSC

0.10

0.004

0.10

0.25

0.004

0.010

1.45

1.75

0.057

0.069

0.10

0.20

0.004

0.008

0.50 BSC

0.020 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

0.20 (0.008)

A

B

3 PL

0.20 (0.008) A

STYLE 1:

PIN 1. BASE

2. EMITTER
3. COLLECTOR

Part Number 2SC4617