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Part Number MAX2410E/D

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________________General Description
The MAX2410 performs the RF front-end transmit/receive
function in time-division-duplex (TDD) communication
systems. It operates over a wide frequency range and
is optimized for RF frequencies around 1.9GHz.
Applications include most popular cordless and PCS
standards.
The MAX2410 contains a low-noise amplifier (LNA), a
downconverter mixer, a local-oscillator (LO) buffer, an
upconverter mixer, and a variable-gain power-amplifier
(PA) driver in a low-cost, plastic surface-mount package.
The LNA has a 2.4dB (typical) noise figure and a
-10dBm input third-order intercept point (IP3). The down-
converter mixer has a low 9.8dB noise figure and a
3.3dBm IP3. Image and LO filtering are implemented off-
chip for maximum flexibility. The PA driver has 15dB of
gain, which can be reduced over a 35dB (typical) range.
Power consumption is only 60mW in receive mode or
90mW in transmit mode and drops to less than 0.3µW in
shutdown mode.
A similar part, the MAX2411A, features the same func-
tionality as the MAX2410 but offers a differential
bidirectional (transmit and receive) IF port. This allows
the use of a single IF filter for transmit (TX) and receive
(RX). For applications requiring a receive function only,
consult the data sheet for the MAX2406, a low-cost
downconverter with low-noise amplifier.
________________________Applications
PWT1900
DECT
DCS1800/PCS1900
ISM-Band Transceiver
PHS/PACS
Iridium Handsets
____________________________Features
o
Low-Cost Silicon Bipolar Design
o
Integrated Upconvert/Downconvert Function
o
Operates from Single +2.7V to +5.5V Supply
o
3.2dB Combined Receiver Noise Figure:
2.4dB (LNA)
9.8dB (Mixer)
o
Flexible Power-Amplifier Driver:
18dBm Output Third-Order Intercept (OIP3)
35dB Gain Control Range
o
LO Buffer for Low LO Drive Level
o
Low Power Consumption:
60mW Receive
90mW Full-Power Transmit
o
0.3µW Shutdown Mode
o
Flexible Power-Down Modes Compatible with
MAX2510/MAX2511 IF Transceivers
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
________________________________________________________________
Maxim Integrated Products
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25
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20
19
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17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
GND
LNAOUT
GND
GND
RXMXIN
GND
GND
IFIN
IFOUT
GND
TXMXOUT
GND
GND
PADRIN
GND
PADROUT
GND
GC
V
CC
TXEN
LO
LO
RXEN
V
CC
GND
GND
LNAIN
GND
QSOP
TOP VIEW
MAX2410
___________________Pin Configuration
MAX2410
LNAIN
LNAOUT
RXMXIN
PADRIN
GC
TXMXOUT
TX MIXER
RX MIXER
RXEN
TXEN
PADROUT
IFOUT
LNA
PA DRIVER
LO
LO
IFIN
POWER
MANAGEMENT
19-1320; Rev 1; 3/98
PART
MAX2410EEI
-40°C to +85°C
TEMP. RANGE
PIN-PACKAGE
28 QSOP
EVALUATION KIT MANUAL
FOLLOWS DATA SHEET
_______________Ordering Information
Functional Diagram
MAX2410E/D
-40°C to +85°C
Dice*
*
Dice are specified at T
A
= +25°C, DC parameters only.
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(V
CC
= 2.7V to 5.5V, V
GC
= 3.0V, RXEN = TXEN = 0.6V, IFOUT and PADROUT pulled up to V
CC
with 50
resistors, TXMXOUT pulled
up to V
CC
with 125
resistor, LNAOUT pulled up to V
CC
with 100
resistor, all other RF and IF inputs open, T
A
= -40°C to +85°C,
unless otherwise noted. Typical values are at T
A
= +25°C and V
CC
= 3.0V.)
AC ELECTRICAL CHARACTERISTICS
(MAX2410 EV kit, V
CC
= 3.0V, V
GC
= 2.15V, RXEN = TXEN = low, f
LO
= 1.5GHz, P
LO
= -10dBm, f
LNAIN
= f
PADRIN
= f
RXMXIN
=
1.9GHz, P
LNAIN
= -32dBm, P
PADRIN
= P
RXMXIN
= -22dBm, f
IFIN
= 400MHz, P
IFIN
= -32dBm. All measurements performed in 50
environment. T
A
= +25°C, unless otherwise noted.)
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC
to GND ..............................................................-0.3V to +6V
LNAIN Input Power.........................................................+15dBm
LO, LO Input Power........................................................+10dBm
PADRIN Input Power ......................................................+10dBm
RXMXIN Input Power ......................................................+10dBm
IFIN Input Power.............................................................+10dBm
RXEN, TXEN, GC Voltage...........................-0.3V to (V
CC
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C)
QSOP (derate 11mW/°C above +70°C) .......................909mW
Junction Temperature ......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +165°C
Lead Temperature (soldering, 10sec) .............................+300°C
RXEN, TXEN pins
RXEN, TXEN pins
V
CC
= 3V
RXEN = 2V, TXEN = 2V
RXEN = 2V
TXEN = 2V
RXEN = 2V
TXEN = 2V
CONDITIONS
V
0.6
Digital Input Voltage Low
V
2.0
V
2.7
5.5
Supply Voltage Range
Digital Input Voltage High
µA
0.1
10
Supply Current, Shutdown Mode
µA
160
520
Supply Current, Standby Mode
µA
0.1
1
RXEN Input Bias Current (Note 1)
µA
0.1
1
TXEN Input Bias Current (Note 1)
mA
20
29.5
Supply Current, Receive Mode
mA
30
44.5
Supply Current, Transmit Mode
UNITS
MIN
TYP
MAX
PARAMETER
T
A
= T
MIN
to T
MAX
T
A
= +25°C
T
A
= +25°C
(Note 2)
RXEN = high or low
CONDITIONS
dB
12.6
19.1
Gain (Note 1)
14.2
16.2
17.4
6.6
8.3
9.8
dB
2.4
Noise Figure
dBm
-10
Input IP3
dBm
-5
Output 1dB Compression
dBm
-49
LO to LNAIN Leakage
UNITS
MIN
TYP
MAX
PARAMETER
T
A
= T
MIN
to T
MAX
dB
5.4
10.8
Conversion Gain (Note 1)
(Note 3)
dBm
3.3
Input IP3
Single sideband
dB
9.8
Noise Figure
dBm
-8
Input 1dB Compression
(Note 5)
dBm
-17
Minimum LO Drive Level
(Notes 1, 4)
MHz
450
IFOUT Frequency
LOW-NOISE AMPLIFIER
(RXEN = High)
RECEIVE MIXER
(RXEN = High)
GC = 3V, TXEN = 2V
µA
35
46
GC Input Bias Current
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
_______________________________________________________________________________________
3
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX2410 EV kit, V
CC
= 3.0V, V
GC
= 2.15V, RXEN = TXEN = low, f
LO
= 1.5GHz, P
LO
= -10dBm, f
LNAIN
= f
PADRIN
= f
RXMXIN
=
1.9GHz, P
LNAIN
= -32dBm, P
PADRIN
= P
RXMXIN
= -22dBm, f
IFIN
= 400MHz, P
IFIN
= -32dBm. All measurements performed in 50
environment. T
A
= +25°C, unless otherwise noted.)
Note 1:
Guaranteed by design and characterization.
Note 2:
Two tones at 1.9GHz and 1.901GHz at -32dBm per tone
Note 3:
Two tones at 1.9GHz and 1.901GHz at -22dBm per tone
Note 4:
Mixer operation guaranteed to this frequency. For optimum gain, adjust output match. See the
Typical Operating
Characteristics for graphs of IFIN and IFOUT Impedance vs. IF Frequency.
Note 5:
At this LO drive level the mixer conversion gain is typically 1dB lower than with -10dBm LO drive.
Note 6:
Two tones at 400MHz and 401MHz at -32dBm per tone.
Note 7:
Transmit mixer output at -17dBm.
Note 8:
Calculated from measurements taken at V
GC
= 1.0V and V
GC
= 1.5V.
Note 9:
Time from RXEN = low to RXEN = high transition until the combined receive gain is within 1dB of its final value. Measured
with 47pF blocking capacitors on LNAIN and LNAOUT.
Note 10:
Time from TXEN = low to TXEN = high transition until the combined transmit gain is within 1dB of its final value. Measured
with 47pF blocking capacitors on PADRIN and PADROUT.
(Notes 1, 10)
(Notes 1, 9)
(Note 6)
Transmit (RXEN = Low)
Receive (TXEN = Low)
(Note 8)
f
OUT
= 2LO-2IF = 2.2GHz
(Note 3)
Single sideband
T
A
= T
MIN
to T
MAX
(Notes 1, 4)
T
A
= +25°C
CONDITIONS
µs
0.3
2.5
Transmitter Turn-On Time
µs
0.5
2.5
Receiver Turn-On Time
1.02
Input Relative VSWR Normalized to
Standby-Mode Impedance
1.10
dB/V
12
Gain-Control Sensitivity
dB
35
Gain-Control Range
dBm
6.3
Output 1dB Compression Point
dBm
18
Output IP3
12.3
17
Gain (Note 1)
dB
13
15
16.4
dBm
-0.3
Output IP3
dBc
-90
Intermod Spurious Response
(Note 7)
dBc
-74
dBc
-44
dBm
-11.4
Output 1dB Compression Point
dBm
-52
LO Leakage
dB
8.2
Noise Figure
MHz
450
IFIN Frequency
UNITS
MIN
TYP
MAX
PARAMETER
f
OUT
= 3LO-6IF = 2.1GHz
f
OUT
= 2LO-3IF = 1.8GHz
T
A
= T
MIN
to T
MAX
T
A
= +25°C
7.3
11.8
dB
8.6
10
11.1
Conversion Gain (Note 1)
TRANSMIT MIXER
(TXEN = high)
POWER AMPLIFIER DRIVER
(TXEN = high)
LOCAL OSCILLATOR INPUTS
(RXEN = TXEN = high)
POWER MANAGEMENT
(RXEN = TXEN = low)
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
4
_______________________________________________________________________________________
__________________________________________Typical Operating Characteristics
(MAX2410 EV kit, V
CC
= 3.0V, V
GC
= 2.15V, RXEN = TXEN = low, f
LO
= 1.5GHz, P
LO
= -10dBm, f
LNAIN
= f
PADRIN
= f
RXMXIN
=
1.9GHz, P
LNAIN
= -32dBm, P
PADRIN
= P
RXMXIN
= -22dBm, f
IFIN
= 400MHz, P
IFIN
= -32dBm. All measurements performed in 50
environment. T
A
= +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).)
26
30
28
34
32
36
38
-40
10
-15
35
60
85
TRANSMIT-MODE SUPPLY CURRENT
vs. TEMPERATURE
MAX2410-01
TEMPERATURE (°C)
TRANSMIT-MODE SUPPLY CURRENT (mA)
V
CC
= 5.5V
TXEN = V
CC
V
CC
= 4.0V
V
CC
= 2.7V
V
CC
= 3.0V
17
19
18
21
20
23
22
24
-40
10
-15
35
60
85
RECEIVE-MODE SUPPLY CURRENT
vs. TEMPERATURE
MAX2410-02
TEMPERATURE (°C)
RECEIVE-MODE SUPPLY CURRENT (mA)
V
CC
= 5.5V
RXEN = V
CC
V
CC
= 4.0V
V
CC
= 2.7V
V
CC
= 3.0V
0
0.03
0.02
0.01
0.04
0.05
0.06
0.07
0.08
0.09
0.10
-40
10
-15
35
60
85
SHUTDOWN SUPPLY CURRENT
vs. TEMPERATURE
MAX2410-03
TEMPERATURE (°C)
SHUTDOWN SUPPLY CURRENT (
µ
A)
V
CC
= 5.5V
RXEN = TXEN = GND
V
CC
= 4.0V
V
CC
= 2.7V
V
CC
= 3.0V
0
100
300
200
400
500
-40
10
-15
35
60
85
STANDBY SUPPLY CURRENT
vs. TEMPERATURE
MAX2410-04
TEMPERATURE (°C)
STANDBY SUPPLY CURRENT (
µ
A)
V
CC
= 5.5V
RXEN = TXEN = 2.0V
V
CC
= 4.0V
V
CC
= 2.7V
V
CC
= 3.0V
0
10
5
20
15
25
30
0
1.0
1.5
0.5
2.0
2.5
3.0
LNA GAIN vs. FREQUENCY
MAX2410-07
FREQUENCY (GHz)
LNA GAIN (dB)
1pF SHUNT CAPACITOR AT LNA INPUT
USING EV KIT MATCHING CIRCUIT (OPTIMIZED
FOR 1.9GHz)
RXEN = V
CC
0
40
20
80
60
100
120
0
1.0
1.5
0.5
2.0
2.5
3.0
LNA INPUT IMPEDANCE
vs. FREQUENCY
MAX2410-05
FREQUENCY (GHz)
REAL IMPEDANCE (
)
-200
-120
-160
-40
-80
0
40
IMAGINARY IMPEDANCE (
)
IMAGINARY
RXEN = V
CC
REAL
0
50
150
100
200
250
0
1.0
0.5
1.5
2.0
2.5
3.0
LNA OUTPUT IMPEDANCE
vs. FREQUENCY
MAX2410-06
FREQUENCY (GHz)
REAL IMPEDANCE (
)
-125
-100
-50
-75
-25
0
IMAGINARY IMPEDANCE (
)
IMAGINARY
REAL
RXEN = V
CC
13
15
14
17
16
19
18
20
-40
10
-15
35
60
85
LNA GAIN vs. TEMPERATURE
MAX2410-08
TEMPERATURE (°C)
LNA GAIN (dB)
V
CC
= 5.5V
V
CC
= 4.0V
V
CC
= 2.7V
V
CC
= 3.0V
RXEN = V
CC
-15
-12
-13
-14
-10
-11
-6
-7
-8
-9
-5
-40
-20
0
20
40
60
100
80
LNA INPUT IP3 vs. TEMPERATURE
MAX2410-09
TEMPERATURE (°C)
INPUT IP3 (dBm)
V
CC
= 5.5V
V
CC
= 4.0V
V
CC
= 2.7V
V
CC
= 3.0V
RXEN = V
CC
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
_______________________________________________________________________________________
5
0
1.0
0.5
2.0
1.5
3.0
2.5
3.5
4.5
4.0
5.0
100
480
860
1240
1620
2000
LNA NOISE FIGURE vs. FREQUENCY
MAX2410-10
FREQUENCY (MHz)
NOISE FIGURE (dB)
RXEN = V
CC
-6
-4
-5
-2
-3
-1
0
2.7
3.7
4.2
3.2
4.7
5.2
LNA OUTPUT 1dB COMPRESSION POINT
vs. SUPPLY VOLTAGE
MAX2410-11
SUPPLY VOLTAGE (V)
OUTPUT 1dB COMPRESSION POINT (dBm)
RXEN = V
CC
0
20
40
60
80
100
120
140
-250
-210
-170
-130
-90
-50
-10
30
160
70
0
1.0
0.5
1.5
2.0
2.5
3.0
PA DRIVER INPUT IMPEDANCE
vs. FREQUENCY
MAX2410-12
FREQUENCY (GHz)
REAL IMPEDANCE (
)
IMAGINARY IMPEDANCE (
)
IMAGINARY
REAL
TXEN = V
CC
0
25
50
75
100
125
150
175
200
-350
-300
-250
-200
-150
-100
-50
0
50
0
1.0
0.5
1.5
2.0
2.5
3.0
PA DRIVER OUTPUT IMPEDANCE
vs. FREQUENCY
MAX2410-13
FREQUENCY (GHz)
REAL IMPEDANCE (
)
IMAGINARY IMPEDANCE (
)
IMAGINARY
REAL
TXEN = V
CC
14
16
15
18
17
20
19
21
-40
0
20
-20
40
60
100
80
PA DRIVER OUTPUT IP3
vs. TEMPERATURE
MAX2410-16
TEMPERATURE (°C)
OUTPUT IP3 (dBm)
V
CC
= 5.5V
V
CC
= 4.0V
V
CC
= 2.7V
V
CC
= 3.0V
TXEN = V
CC
0
10
5
20
15
25
30
0
1.0
1.5
0.5
2.0
2.5
3.0
PA DRIVER GAIN vs. FREQUENCY
MAX2410-14
FREQUENCY (GHz)
GAIN (dB)
USING EV KIT MATCHING NETWORK
(OPTIMIZED FOR 1.9GHz)
TXEN = V
CC
-30
-20
-25
-5
-10
-15
0
5
15
10
20
0
0.4 0.6
0.2
0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
PA DRIVER GAIN AND OUTPUT IP3
vs. GAIN-CONTROL VOLTAGE
MAX2410-15
GAIN-CONTROL VOLTAGE (V)
GAIN (dB) OR OUTPUT IP3 (dBm)
IP3
GAIN
TXEN = V
CC
12
14
13
16
15
17
18
-40
10
-15
35
60
85
PA DRIVER GAIN vs. TEMPERATURE
MAX2410-17
TEMPERATURE (°C)
PA DRIVER GAIN (dB)
V
CC
= 5.5V
V
CC
= 4.0V
V
CC
= 2.7V
V
CC
= 3.0V
TXEN = V
CC
-4
0
-2
4
2
6
8
2.7
3.7
4.2
3.2
4.7
5.7
5.2
PA DRIVER OUTPUT 1dB COMPRESSION
POINT vs. SUPPLY VOLTAGE
MAX2410-18
SUPPLY VOLTAGE (V)
OUTPUT 1dB COMPRESSION POINT (dBm)
V
GC
= 2.15V
V
GC
= 1.0V
TXEN = V
CC
_____________________________Typical Operating Characteristics (continued)
(MAX2410 EV kit, V
CC
= 3.0V, V
GC
= 2.15V, RXEN = TXEN = low, f
LO
= 1.5GHz, P
LO
= -10dBm, f
LNAIN
= f
PADRIN
= f
RXMXIN
=
1.9GHz, P
LNAIN
= -32dBm, P
PADRIN
= P
RXMXIN
= -22dBm, f
IFIN
= 400MHz, P
IFIN
= -32dBm. All measurements performed in 50
environment. T
A
= +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).)