Conclusion

The MAX2055 successfully meets the quality and reliability standards required of all Maxim products. In addition,

Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and
reliability standards.

Table of Contents

I. ........Device Description

V. ........Quality Assurance Information

II. ........Manufacturing Information

VI. .......Reliability Evaluation

III. .......Packaging Information

IV. .......Die Information

......Attachments

I. Device Description

A. General

The MAX2055 high-performance, digitally controlled, variable-gain, differential analog-to-digital converter (ADC)
driver/amplifier (DVGA) is designed for use from 30MHz to 300MHz in base-station receivers.

The device integrates a digitally controlled attenuator and a high-linearity single-ended-to-differential output amplifier,
which can either eliminate an external transformer, or can improve the even-order distortion performance of a
transformer-coupled circuit, thus relaxing the requirements of the anti-alias filter preceding an ADC. Targeted for ADC
driver applications to adjust gain either dynamically or as a one-time channel gain setting, the MAX2055 is ideal for
applications requiring high performance. The attenuator provides 23dB of attenuation range with ą0.2dB accuracy.

The MAX2055 is available in a thermally enhanced 20-pin TSSOP-EP package and operates over the -40°C to +85°C
temperature range.

B. Absolute Maximum Ratings

Item

Rating

All Pins to GND

-0.3V to +(VCC + 0.25V)

Input Signal (RF_IN)

20dBm

Output Power (RF_OUT)

24dBm

Operating Temperature Range

-40°C to +85°C

Junction Temperature

+150°C

Storage Temperature Range

-65°C to +165°C

Lead Temperature (soldering, 10s)

+300°C

Continuous Power Dissipation (TA = +85°C)
28-Pin TSSOP

2100mW

Derates above +85°C
28-Pin TSSOP

21.7mW/°C

II. Manufacturing Information

A. Description/Function:

Digitally Controlled, Variable-Gain, Differential ADC Driver/Amplifier

B. Process:

GST4

C. Number of Device Transistors:

325

D. Fabrication Location:

Oregon, USA

E. Assembly Location:

Philippines or Malaysia

F. Date of Initial Production:

April, 2003

III. Packaging Information

A. Package Type:

28-Pin TSSOP

B. Lead Frame:

Copper

C. Lead Finish:

Solder Plate

D. Die Attach:

Silver-filled epoxy

E. Bondwire:

Gold (1.2 mil dia.)

F. Mold Material:

Epoxy with silica filler

G. Assembly Diagram:

Buildsheet # 05-9000-0419

H. Flammability Rating:

Class: UL94-V0

I. Classification of Moisture Sensitivity per

JEDEC standard J-STD-020-A:

Level 1

IV. Die Information

A. Dimensions:

125 x 79 mils

B. Passivation:

(Silicon nitride)

C. Interconnect:

D. Backside Metallization:

None

E. Minimum Metal Width:

Metal1: 1.2; Metal2: 1.2; Metal3: 1.2; Metal4: 5.6 microns (as drawn)

F. Minimum Metal Spacing:

Metal1: 1.6; Metal2: 1.6; Metal3: 1.6; Metal4: 4.2 microns (as drawn)

G. Bondpad Dimensions:

5 mil. Sq.

H. Isolation Dielectric:

SiO

I. Die Separation Method:

Wafer Saw

V. Quality Assurance Information

A. Quality Assurance Contacts: Jim Pedicord

(Manager, Reliability Operations)

Bryan Preeshl

(Executive Director of QA)

Kenneth Huening (Vice President)

B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.

0.1% For all Visual Defects.

C. Observed Outgoing Defect Rate: < 50 ppm

D. Sampling Plan: Mil-Std-105D

VI. Reliability Evaluation

A. Accelerated Life Test

The results of the 150

C biased (static) life test are shown in Table 1. Using these results, the Failure Rate

(

) is calculated as follows:

= 1 = 1.83 (Chi square value for MTTF upper limit)

MTTF

192 x 9823 x 45 x 2

Temperature Acceleration factor assuming an activation energy of 0.8eV

= 10.78 x 10

-8

= 10.78 F.I.T. (60% confidence level @ 25

This low failure rate represents data collected from Maxim's reliability qualification and monitor programs.

Maxim also performs weekly Burn-In on samples from production to assure reliability of its processes. The reliability
required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates to 3 failures
in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level. The Burn-In
Schematic (Spec.# 06-7097) shows the static circuit used for this test. Maxim also performs 1000 hour life test
monitors quarterly for each process. This data is published in the Product Reliability Reports (RR-1M & RR-B3A).

B. Moisture Resistance Tests

Maxim evaluates pressure pot stress from every assembly process during qualification of each new design.

Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85

C/85%RH or HAST

tests are performed quarterly per device/package family.

C. E.S.D. and Latch-Up Testing

The CR17 die type has been found to have all pins able to withstand a transient pulse of +/-200V, per Mil-Std-

883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a
current of

250mA.

Table 1

Reliability Evaluation Test Results

MAX2055EUP

TEST ITEM

TEST CONDITION

FAILURE

SAMPLE

NUMBER OF

IDENTIFICATION

SIZE

FAILURES

Static Life Test (Note 1)

Ta = 150

DC Parameters

Biased

& functionality

Time = 192 hrs.

Moisture Testing (Note 2)

Pressure Pot

Ta = 121

DC Parameters

P = 15 psi.

& functionality

RH= 100%

Time = 168hrs.

85/85

Ta = 85

DC Parameters

RH = 85%

& functionality

Biased

Time = 1000hrs.

Mechanical Stress (Note 2)

Temperature

-65

C/150

DC Parameters

Cycle

1000 Cycles

& functionality

Method 1010

Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic process/package data.

Part Number MAX2055EUP