SPEC NO: DSAD1356
REV NO: V.1
DATE:MAR/29/2003
PAGE: 1 OF 4
APPROVED: J.LU
CHECKED: Allen Liu
DRAWN:Y.H.LI
Package Dimensions
1.6x0.8mm SMD CHIP LED LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
±
0.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
Features
l
1.6mmx0.8mm SMT LED, 1.1mm THICKNESS.
l
LOW POWER CONSUMPTION.
l
WIDE VIEWING ANGLE.
l
IDEAL FOR BACKLIGHT AND INDICATOR.
l
VARIOUS COLORS AND LENS TYPES AVAILABLE.
l
PACKAGE : 2000PCS / REEL.
AP1608F3C
Description
F3 Made with Gallium Arsenide Infrared Emitting diodes.
SPEC NO: DSAD1356
REV NO: V.1
DATE:MAR/29/2003
PAGE: 2 OF 4
APPROVED: J.LU
CHECKED: Allen Liu
DRAWN:Y.H.LI
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at T
A
=25
°°
°°
°
C
Absolute Maximum Ratings at T
A
=25
°°
°°
°
C
Note:
1. 1/100 Duty Cycle, 10us Pluse Width.
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
N/
P N/
P N/
P N/
P N/
P
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
.p
yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
tin
U tin
U tin
U tin
U tin
U
no
iti
dn
o
C
no
iti
dn
o
C
no
iti
dn
o
C
no
iti
dn
o
C
no
iti
dn
o
C
eg
atl
oV
dr
a
wr
oF
3F
V
F
2.
1
6.
1
V
I
F
A
m
02
=
tn
err
u
C
es
re
ve
R
3F
I
R
-
01
A
u
V
R
V
5=
ec
na
tic
ap
a
C
3F
C
09
-
F
p
V
F
z
H
M
1=
f;
V
0=
ht
gn
el
ev
a
W
lar
tc
ep
S
ka
e
P
3F
P
04
9
-
m
n
I
F
A
m
02
=
ht
di
w
dn
a
Bl
art
ce
p
S
3F
2/
1
05
-
m
n
I
F
A
m
02
=
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
3F
3F
3F
3F
3F
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
iD
re
w
o
P
P
T
00
1
W
m
tn
err
u
C
dr
a
wr
oF
I
F
05
A
m
]1[
tn
err
u
C
dr
a
wr
oF
ka
e
P
i
S
F
2.
1
A
eg
atl
oV
es
re
ve
R
V
R
5
V
er
ut
ar
ep
m
eT
gn
ita
re
p
O
T
A
58
+
~0
4-
°
C
er
ut
ar
ep
m
eT
eg
ar
ot
S
T
G
T
S
58
+
~0
4-
°
C
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
)r
s/
W
m(
o
P
)r
s/
W
m(
o
P
)r
s/
W
m(
o
P
)r
s/
W
m(
o
P
)r
s/
W
m(
o
P
A
m
02
@
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V elg
n
A
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
C
3F
80
61
P
A
sA
a
G
R
A
EL
C
R
ET
A
W
4.
0
2.
1
°0
21
SPEC NO: DSAD1356
REV NO: V.1
DATE:MAR/29/2003
PAGE: 4 OF 4
APPROVED: J.LU
CHECKED: Allen Liu
DRAWN:Y.H.LI
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AP1608F3C
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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