First Release
Copyright © IXYS CORPORATION 2002
Features
· Built using the advantages and compatibility
of CMOS and IXYS HDMOS
TM
processes
· Latch-Up Protected Over Entire
Operating Range
· High Peak Output Current: 2A Peak
· Wide Operating Range: 4.5V to 25V
· High Capacitive Load
Drive Capability: 1000pF in <10ns
· Matched Rise And Fall Times
· Low Propagation Delay Time
· Low Output Impedance
· Low Supply Current
· Two Drivers in Single Chip
Applications
· Driving MOSFETs and IGBTs
· Motor Controls
· Line Drivers
· Pulse Generators
· Local Power ON/OFF Switch
· Switch Mode Power Supplies (SMPS)
· DC to DC Converters
· Pulse Transformer Driver
· Class D Switching Amplifiers
General Description
The IXDN402/IXDI402/IXDF402 consists of two 2 Amp
CMOS high speed MOSFET drivers. Each output can
source and sink 2A of peak current while producing voltage
rise and fall times of less than 15ns to drive the latest IXYS
MOSFETs & IGBTs. The input of the driver is TTL or CMOS
compatible and is fully immune to latch up over the entire
operating range. A patent-pending circuit virtually eliminates
cross conduction and current shoot-through. Improved
speed and drive capabilities are further enhanced by very
low and matched rise and fall times.
The IXDN402 is configured as a dual non-inverting gate
driver, the IXDI402 as a dual inverting gate driver, and the
IXDF402 as a dual inverting + non-inverting gate driver.
The IXDN402/IXDI402/IXDF402 family are available in the
standard 8 pin P-DIP (PI), SOP-8 (SIA) and SOP-16 (SIA-
16) packages. For enhanced thermal performance, the
SOP-8 and SOP-16 are also available with an exposed
grounded backmetal package as the SI and SI-16 respec-
tively.
IXDN402 / IXDI402 / IXDF402
2 Ampere Dual Low-Side Ultrafast MOSFET Drivers
Ordering Information
NOTE: Mounting or solder tabs on all packages are connected to ground
Part Number
Package Type
Temp. Range
Configuration
IXDN402PI 8-Pin
PDIP
IXDN402SI
8-Pin SOIC with Grounded Backmetal
IXDN402SIA
8-Pin SOIC
IXDN402SI-16
16-Pin SOIC with Grounded Backmetal
IXDN402SIA-16 16-Pin
SOIC
-55
°
C to
+125
°
C
Dual Non
Inverting
IXDI402PI 8-Pin
PDIP
IXDI402SI
8-Pin SOIC with Grounded Backmetal
IXDI402SIA 8-Pin
SOIC
IXDI402SI-16
16-Pin SOIC with Grounded Backmetal
IXDI402SIA-16 16-Pin
SOIC
-55
°
C to
+125
°
C
Dual Inverting
IXDF402PI 8-Pin
PDIP
IXDF402SI
8-Pin SOIC with Grounded Backmetal
IXDF402SIA 8-Pin
SOIC
IXDF402SI-16
16-Pin SOIC with Grounded Backmetal
IXDF402SIA-16 16-Pin
SOIC
-55
°
C to
+125
°
C
Inverting + Non
Inverting
2
IXDN402 / IXDI402 / IXDF402
N
P
N
P
OUT A
Vcc
OUT B
IN A
IN B
GND
ANTI-CROSS
CONDUCTION
CIRCUIT *
ANTI-CROSS
CONDUCTION
CIRCUIT *
Figure 1 - IXDN402 Dual 2A Non-Inverting Gate Driver Functional Block Diagram
Figure 2 - IXDI402 Dual Inverting 2A Gate Driver Functional Block Diagram
N
P
N
P
OUT A
Vcc
OUT B
IN A
IN B
GND
ANTI-CROSS
CONDUCTION
CIRCUIT *
ANTI-CROSS
CONDUCTION
CIRCUIT *
Figure 3 - IXDF402 Inverting + Non-Inverting 2A Gate Driver Functional Block Diagram
N
P
N
P
OUT A
Vcc
OUT B
IN A
IN B
GND
ANTI-CROSS
CONDUCTION
CIRCUIT *
ANTI-CROSS
CONDUCTION
CIRCUIT *
* Patent Pending
3
IXDN402 / IXDI402 / IXDF402
Unless otherwise noted, T
A
= 25
o
C, 4.5V
V
CC
25V
.
All voltage measurements with respect to GND. IXDD402 configured as described in Test Conditions. All specifications are for one channel.
Electrical Characteristics
Symbol Parameter
Test
Conditions
Min
Typ
Max Units
V
IH
High input voltage
3
V
V
IL
Low input voltage
2.4
V
V
IN
Input voltage range
-5
V
CC
+ 0.3
V
I
IN
Input
current
0V
V
IN
V
CC
-10 10
µ
A
V
OH
High
output
voltage
V
CC
- 0.025
V
V
OL
Low
output
voltage
0.025
V
R
OH
Output
resistance
@ Output high
V
CC
= 18V
3.7 4
R
OL
Output
resistance
@ Output Low
V
CC
= 18V
2.5
3
I
PEAK
Peak
output
current V
CC
is 18V
2 A
I
DC
Continuous
output
current
1
A
t
R
Rise
time
C
L
=1000pF Vcc=18V
7
8
10
ns
t
F
Fall
time
C
L
=1000pF Vcc=18V
7
8
9
ns
t
ONDLY
On-time
propagation
delay
C
L
=1000pF Vcc=18V
27
28
32
ns
t
OFFDLY
Off-time
propagation
delay
C
L
=1000pF Vcc=18V
25
26
30
ns
V
CC
Power
supply
voltage
4.5 18 25 V
I
CC
Power supply current
V
IN
= 3.5V
V
IN
= 0V
V
IN
= + V
CC
1
0
3
10
10
mA
µ
A
µ
A
Absolute Maximum Ratings
(Note 1)
Parameter Value
Supply Voltage
25 V
All Other Pins
-0.3 V to VCC + 0.3 V
Junction Temperature
150 oC
Storage Temperature
-65 oC to 150 oC
Lead Temperature (10 sec)
300 oC
Operating Ratings
Parameter Value
Operating Temperature Range
-55 oC to 125 oC
Thermal Impedance (To Ambient)
8 Pin PDIP (PI) (
JA
)
130 oC/W
8 Pin SOIC (SIA) (
JA
)
120 oC/W
16 Pin SOIC (SIA-16) (
JA
)
120 oC/W
Specifications Subject To Change Without Notice
4
IXDN402 / IXDI402 / IXDF402
Pin Description
Figure 4 - Characteristics Test Diagram
Note 1: Operating the device beyond the parameters listed as "Absolute Maximum Ratings" may cause permanent
damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not
guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed.
Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures when
handling and assembling this component.
1
2
3
4
5
6
7
8
NC
NC
In A
Gnd
In B
Out B
Vcc
Out A
10uF
25V
Vcc
1000 pF
1000 pF
Agilent 1147A
Current Probe
Agilent 1147A
Current Probe
SYMBOL FUNCTION
DESCRIPTION
IN A
A Channel Input
A Channel Input signal-TTL or CMOS compatible.
GND Ground
The system ground pin. Internally connected to all circuitry, this pin provides
ground reference for the entire chip. This pin should be connected to a low
noise analog ground plane for optimum performance.
IN B
B Channel Input
B Channel Input signal-TTL or CMOS compatible.
OUT B
B Channel Output
B Channel Driver output. For application purposes, this pin is connected via
a resistor to a gate of a MOSFET/IGBT.
VCC Supply
Voltage
Positive power-supply voltage input. This pin provides power to the entire
chip. The range for this voltage is from 4.5V to 25V.
OUT A
A Channel Output
A Channel Driver output. For application purposes, this pin is connected via
a resistor to a gate of a MOSFET/IGBT.
5
IXDN402 / IXDI402 / IXDF402
Output Fall Times vs. Load Capacitance
0
5
10
15
20
25
30
35
40
45
50
0
1000
2000
3000
4000
5000
6000
7000
Load Capacitance (pF)
Fall Times (ns)
8V
10V
12V
14V
16V
18V
Output Rise Times vs. Load Capacitance
0
10
20
30
40
50
60
70
80
90
0
1000
2000
3000
4000
5000
6000
7000
Load Capacitance (pF)
Rise Time (ns)
8V
10V
12V
14V
16V
18V
Output Rise Time vs. Supply Voltage
CL = 100pF to 6800pF
0
10
20
30
40
50
60
70
80
90
8
10
12
14
16
18
Supply Voltage (V)
Rise Time (ns
)
100 pF
470 pF
1000 pF
2200 pF
3900 pF
6800 pF
Output Rise And Fall Times vs. Case Temperature
CL = 1000pF, Vcc = 18V
0
2
4
6
8
10
12
-60
-40
-20
0
20
40
60
80
100
120
140
Temperature (C)
Time (ns)
t
R
t
F
Output Fall Time vs. Supply Voltage
CL = 100pF to 6800pF
0
10
20
30
40
50
60
8
10
12
14
16
18
Supply Voltage (V)
Fall Time (ns
)
100 pF
470 pF
1000 pF
2200 pF
3900 pF
6800 pF
Fig. 3
Typical Performance Characteristics
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Max / Min Input vs. Temperature
CL = 1000 pF Vcc = 18V
1.5
1.7
1.9
2.1
2.3
2.5
2.7
2.9
3.1
3.3
3.5
-60
-40
-20
0
20
40
60
80
100
120
140
Temperature (C)
Max / Min Input Voltage
Minimum Input High
Maximum Input Low
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