© 2000 IXYS All rights reserved
1 - 2
HiPerFRED
TM
Epitaxial Diode
with soft recovery
Pulse test:
x
Pulse Width = 5 ms, Duty Cycle < 2.0 %
y
Pulse Width = 300
m
s, Duty Cycle < 2.0 %
Data according to IEC 60747 and per diode unless otherwise specified
IXYS reserves the right to change limits, test conditions and dimensions.
Features
q
International standard package
q
Planar passivated chips
q
Very short recovery time
q
Extremely low switching losses
q
Low I
RM
-values
q
Soft recovery behaviour
q
Epoxy meets UL 94V-0
q
Version ..R isolated and
UL registered E153432
Applications
q
Antiparallel diode for high frequency
switching devices
q
Antisaturation diode
q
Snubber diode
q
Free wheeling diode in converters
and motor control circuits
q
Rectifiers in switch mode power
supplies (SMPS)
q
Inductive heating
q
Uninterruptible power supplies (UPS)
q
Ultrasonic cleaners and welders
Advantages
q
Avalanche voltage rated for reliable
operation
q
Soft reverse recovery for low
EMI/RFI
q
Low I
RM
reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating
switch
Dimensions see outlines.pdf
C
A
A = Anode, C = Cathode
TO-247 AD
ISOPLUS 247
TM
Version A
Version AR
A
C
C (TAB)
A
C
TAB
I
FAV
= 30 A
V
RRM
= 1200 V
t
rr
= 40 ns
V
RSM
V
RRM
Type
V
V
1200
1200
DSEP 30-12A
1200
1200
DSEP 30-12AR
Symbol
Conditions
Maximum Ratings
I
FRMS
70
A
I
FAVM
rectangular, d = 0.5; T
C
(Vers. A) = 115°C
30
A
T
C
(Vers. AR)= 105°C
I
FSM
T
VJ
= 45°C; t
p
= 10 ms (50 Hz), sine
200
A
E
AS
T
VJ
= 25°C; non-repetitive
14
mJ
I
AS
= 11.5 A; L = 180 µH
I
AR
V
A
= 1.25·V
R
typ.; f = 10 kHz; repetitive
1.2
A
T
VJ
-55...+175
°C
T
VJM
175
°C
T
stg
-55...+150
°C
P
tot
T
C
= 25°C;
Version A
165
W
Version AR
135
W
M
d
*
mounting torque
0.8...1.2
Nm
F
C
mounting force with clip
20...120
N
V
ISOL
**
50/60 Hz RMS; I
ISOL
£
1 mA; leads-to-tab
2500
V~
Weight
typical
6
g
* Version A only; ** Version AR only
Symbol
Conditions
Characteristic Values
typ.
max.
I
R
x
T
VJ
= 25°C; V
R
= V
RRM
250
µA
T
VJ
= 150°C; V
R
= V
RRM
1
mA
V
F
y
I
F
= 30 A;
T
VJ
= 150°C
1.78
V
T
VJ
= 25°C
2.74
V
R
thJC
Version A
0.9
K/W
Version AR
1.1
K/W
R
thCH
0.25
K/W
t
rr
I
F
= 1 A; -di/dt = 200 A/µs;
40
ns
V
R
= 30 V; T
VJ
= 25°C
I
RM
V
R
= 100 V; I
F
= 50 A; -di
F
/dt = 100 A/µs
5.5
11.4
A
T
VJ
= 100°C
DSEP 30-12A
DSEP 30-12AR
018
© 2000 IXYS All rights reserved
2 - 2
200
600
1000
0
400
800
120
140
160
180
200
220
0.00001
0.0001
0.001
0.01
0.1
1
0.001
0.01
0.1
1
0
40
80
120
160
0.0
0.5
1.0
1.5
2.0
K
f
T
VJ
°C
-di
F
/dt
t
s
K/W
0
200
400
600
800
1000
0
40
80
120
0.0
0.4
0.8
1.2
V
FR
di
F
/dt
V
200
600
1000
0
400
800
0
10
20
30
40
50
60
100
1000
0
1
2
3
4
5
0
1
2
3
4
0
10
20
30
40
50
60
70
I
RM
Q
r
I
F
A
V
F
-di
F
/dt
-di
F
/dt
A/
m
s
A
V
m
C
A/
m
s
A/
m
s
t
rr
ns
t
fr
Z
thJC
A/
m
s
µ
s
2
DSEP 30-12A
DSEP 30-12AR
I
F
= 60A
I
F
= 30A
I
F
= 15A
T
VJ
= 100°C
V
R
= 600V
T
VJ
= 100°C
I
F
= 30A
Fig. 3 Peak reverse current I
RM
versus -di
F
/dt
Fig. 2 Reverse recovery charge Q
r
versus -di
F
/dt
Fig. 1 Forward current I
F
versus V
F
T
VJ
= 100°C
V
R
= 600V
T
VJ
= 100°C
V
R
= 600V
I
F
= 60A
I
F
= 30A
I
F
= 15A
Q
r
I
RM
Fig. 4 Dynamic parameters Q
r
, I
RM
versus T
VJ
Fig. 5 Recovery time t
rr
versus -di
F
/dt
Fig. 6 Peak forward voltage V
FR
and t
fr
versus di
F
/dt
I
F
= 60A
I
F
= 30A
I
F
= 15A
t
fr
V
FR
Fig. 7 Transient thermal resistance junction to case
T
VJ
=150°C
T
VJ
=100°C
T
VJ
= 25°C
Constants for Z
thJC
calculation ..A:
i
R
thi
(K/W)
t
i
(s)
1
0.465
0.0052
2
0.179
0.0003
3
0.256
0.0397
NOTE: Fig. 2 to Fig. 6 shows typical values
DSEP 30-12A
DSEP 30-12AR
Constants for Z
thJC
calculation ..AR:
i
R
thi
(K/W)
t
i
(s)
1
0.368
0.0052
2
0.1417
0.0003
3
0.0295
0.0004
4
0.5604
0.0092
018
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