Parameter
Max.
Units
I
D
@ T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
30
I
D
@ T
C
= 100°C
Continuous Drain Current, V
GS
@ 10V
21
A
I
DM
Pulsed Drain Current
110
P
D
@T
A
= 25°C
Power Dissipation
3.7
W
P
D
@T
C
= 25°C
Power Dissipation
88
W
Linear Derating Factor
0.59
W/°C
V
GS
Gate-to-Source Voltage
± 10
V
E
AS
Single Pulse Avalanche Energy
220
mJ
dv/dt
Peak Diode Recovery dv/dt
4.5
V/ns
T
J
Operating Junction and
-55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds
300 (1.6mm from case )
°C
IRLZ34S/L
HEXFET
®
Power MOSFET
PD - 9.905A
l
Advanced Process Technology
l
Surface Mount (IRLZ34S)
l
Low-profile through-hole (IRLZ34L)
l
175°C Operating Temperature
l
Fast Switching
l
Fully Avalanche Rated
V
DSS
= 60V
R
DS(on)
= 0.050
I
D
= 30A
2
D P a k
T O - 2 6 2
8/25/97
S
D
G
Parameter
Typ.
Max.
Units
R
JC
Junction-to-Case
1.7
R
JA
Junction-to-Ambient ( PCB Mounted,steady-state)**
40
Thermal Resistance
°C/W
Absolute Maximum Ratings
Description
Third Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The D
2
Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
2
Pak is suitable for high current applications because of
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRLZ34L) is available for low-
profile applications.
°C
IRLZ34S/L
V
DD
= 25V
,
starting T
J
= 25°C, L = 290µH
R
G
= 25
, I
AS
= 30A. (See Figure 12)
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
Notes:
** When mounted on 1" square PCB (FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
I
SD
30A, di/dt
200A/µs, V
DD
V
(BR)DSS
,
T
J
175°C
Pulse width
300µs; duty cycle
2%.
Uses IRLZ34 data and test conditions
Parameter
Min. Typ. Max. Units
Conditions
I
S
Continuous Source Current
MOSFET symbol
(Body Diode)
showing the
I
SM
Pulsed Source Current
integral reverse
(Body Diode)
p-n junction diode.
V
SD
Diode Forward Voltage
1.6
V
T
J
= 25°C, I
S
= 30A, V
GS
= 0V
t
rr
Reverse Recovery Time
120
180
ns
T
J
= 25°C, I
F
= 30A
Q
rr
Reverse Recovery Charge
700 1300
nC
di/dt = 100A/µs
t
on
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Source-Drain Ratings and Characteristics
A
30
110
S
D
G
Parameter
Min. Typ. Max. Units
Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage
60
V
V
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/
T
J
Breakdown Voltage Temp. Coefficient
0.07
V/°C
Reference to 25°C, I
D
= 1mA
0.05
V
GS
= 5.0V, I
D
= 18A
0.07
V
GS
= 4.0V, I
D
= 15A
V
GS(th)
Gate Threshold Voltage
1.0
2.0
V
V
DS
= V
GS
, I
D
= 250µA
g
fs
Forward Transconductance
12
S
V
DS
= 25V, I
D
= 18A
25
µA
V
DS
= 60V, V
GS
= 0V
250
V
DS
= 48V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage
100
V
GS
= 10V
Gate-to-Source Reverse Leakage
-100
nA
V
GS
= -10V
Q
g
Total Gate Charge
35
I
D
= 30A
Q
gs
Gate-to-Source Charge
7.1
nC
V
DS
= 48V
Q
gd
Gate-to-Drain ("Miller") Charge
25
V
GS
= 5.0V, See Fig. 6 and 13
t
d(on)
Turn-On Delay Time
14
V
DD
= 30V
t
r
Rise Time
170
I
D
= 30A
t
d(off)
Turn-Off Delay Time
30
R
G
= 6.0
t
f
Fall Time
56
R
D
= 1.0
,
See Fig. 10
Between lead,
and center of die contact
C
iss
Input Capacitance
1600
V
GS
= 0V
C
oss
Output Capacitance
660
pF
V
DS
= 25V
C
rss
Reverse Transfer Capacitance
170
= 1.0MHz, See Fig. 5
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
R
DS(on)
Static Drain-to-Source On-Resistance
I
GSS
I
DSS
Drain-to-Source Leakage Current
L
S
Internal Source Inductance
7.5
nH
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