www.irf.com
1
09/21/01
IRFR12N25D
IRFU12N25D
SMPS MOSFET
HEXFET
®
Power MOSFET
V
DSS
R
DS(on)
max
I
D
250V
0.26
14A
Parameter
Max.
Units
I
D
@ T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
14
I
D
@ T
C
= 100°C
Continuous Drain Current, V
GS
@ 10V
9.7
A
I
DM
Pulsed Drain Current
56
P
D
@T
C
= 25°C
Power Dissipation
144
W
Linear Derating Factor
0.96
W/°C
V
GS
Gate-to-Source Voltage
± 30
V
dv/dt
Peak Diode Recovery dv/dt
9.3
V/ns
T
J
Operating Junction and
-55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds
300 (1.6mm from case )
°C
Absolute Maximum Ratings
Notes
through
are on page 10
D-Pak
IRFR12N25D
I-Pak
IRFU12N25D
l
High frequency DC-DC converters
Benefits
Applications
l
Low Gate-to-Drain Charge to Reduce
Switching Losses
l
Fully Characterized Capacitance Including
Effective C
OSS
to Simplify Design, (See
App. Note AN1001)
l
Fully Characterized Avalanche Voltage
and Current
Parameter
Typ.
Max.
Units
R
JC
Junction-to-Case
1.04
R
JA
Junction-to-Ambient (PCB mount)*
50
°C/W
R
JA
Junction-to-Ambient
110
Thermal Resistance
PD - 94296A
2
www.irf.com
IRFR12N25D/IRFU12N25D
Parameter
Min. Typ. Max. Units
Conditions
g
fs
Forward Transconductance
6.8
S
V
DS
= 25V, I
D
= 8.4A
Q
g
Total Gate Charge
23 35 I
D
= 8.4A
Q
gs
Gate-to-Source Charge
5.8
8.7
nC
V
DS
= 200V
Q
gd
Gate-to-Drain ("Miller") Charge
12
19
V
GS
= 10V,
t
d(on)
Turn-On Delay Time
9.1
V
DD
= 125V
t
r
Rise Time
25
I
D
= 8.4A
t
d(off)
Turn-Off Delay Time
16
R
G
= 6.8
t
f
Fall Time
9.2
V
GS
= 10V
C
iss
Input Capacitance
810
V
GS
= 0V
C
oss
Output Capacitance
130
V
DS
= 25V
C
rss
Reverse Transfer Capacitance
22
pF
= 1.0MHz
C
oss
Output Capacitance
1100
V
GS
= 0V, V
DS
= 1.0V, = 1.0MHz
C
oss
Output Capacitance
50
V
GS
= 0V, V
DS
= 200V, = 1.0MHz
C
oss
eff.
Effective Output Capacitance
130
V
GS
= 0V, V
DS
= 0V to 200V
Dynamic @ T
J
= 25°C (unless otherwise specified)
ns
Parameter
Typ.
Max.
Units
E
AS
Single Pulse Avalanche Energy
250
mJ
I
AR
Avalanche Current
8.4
A
E
AR
Repetitive Avalanche Energy
14
mJ
Avalanche Characteristics
S
D
G
Parameter
Min. Typ. Max. Units
Conditions
I
S
Continuous Source Current
MOSFET symbol
(Body Diode)
showing the
I
SM
Pulsed Source Current
integral reverse
(Body Diode)
p-n junction diode.
V
SD
Diode Forward Voltage
1.5
V
T
J
= 25°C, I
S
= 8.4A, V
GS
= 0V
t
rr
Reverse Recovery Time
140
ns
T
J
= 25°C, I
F
= 8.4A
Q
rr
Reverse RecoveryCharge
710
nC
di/dt = 100A/µs
t
on
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Diode Characteristics
14
56
A
Static @ T
J
= 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage
250
V
V
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/
T
J
Breakdown Voltage Temp. Coefficient
0.29 V/°C Reference to 25°C, I
D
= 1mA
R
DS(on)
Static Drain-to-Source On-Resistance
0.26
V
GS
= 10V, I
D
= 8.4A
V
GS(th)
Gate Threshold Voltage
3.0
5.0
V
V
DS
= V
GS
, I
D
= 250µA
25
µA
V
DS
= 200V, V
GS
= 0V
250
V
DS
= 160V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage
100
V
GS
= 30V
Gate-to-Source Reverse Leakage
-100
nA
V
GS
= -30V
I
GSS
I
DSS
Drain-to-Source Leakage Current
www.irf.com
3
IRFR12N25D/IRFU12N25D
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
0.1
1
10
100
VDS, Drain-to-Source Voltage (V)
0.001
0.01
0.1
1
10
100
I D
, Drain-to-Source Current (A)
5.0V
20µs PULSE WIDTH
Tj = 25°C
VGS
TOP 15V
12V
10V
8.0V
7.0V
6.0V
5.5V
BOTTOM 5.0V
0.1
1
10
100
VDS, Drain-to-Source Voltage (V)
0.1
1
10
100
I D
, Drain-to-Source Current (A)
5.0V
20µs PULSE WIDTH
Tj = 175°C
VGS
TOP 15V
12V
10V
8.0V
7.0V
6.0V
5.5V
BOTTOM 5.0V
5.0
7.0
9.0
11.0
13.0
15.0
VGS, Gate-to-Source Voltage (V)
0.01
0.10
1.00
10.00
100.00
I D
, Drain-to-Source Current
(
)
TJ = 25°C
TJ = 175°C
VDS = 15V
20µs PULSE WIDTH
-60
-40
-20
0
20
40
60
80
100
120
140
160
180
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
T , Junction Temperature
( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V
=
I
=
GS
D
10V
14A
4
www.irf.com
IRFR12N25D/IRFU12N25D
Fig 8. Maximum Safe Operating Area
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 7. Typical Source-Drain Diode
Forward Voltage
1
10
100
1000
VDS, Drain-to-Source Voltage (V)
10
100
1000
10000
C, Capacitance(pF)
Coss
Crss
Ciss
VGS = 0V, f = 1 MHZ
Ciss = Cgs + Cgd, Cds SHORTED
Crss = Cgd
Coss = Cds + Cgd
0
5
10
15
20
25
0
2
5
7
10
12
Q , Total Gate Charge (nC)
V , Gate-to-Source Voltage (V)
G
GS
I
=
D
8.4A
V
= 50V
DS
V
= 125V
DS
V
= 200V
DS
0.0
1.0
2.0
3.0
VSD, Source-toDrain Voltage (V)
0.10
1.00
10.00
100.00
I SD
, Reverse Drain Current (A)
TJ = 25°C
TJ = 175°C
VGS = 0V
1
10
100
1000
VDS , Drain-toSource Voltage (V)
0.1
1
10
100
1000
I D
, Drain-to-Source Current (A)
Tc = 25°C
Tj = 175°C
Single Pulse
1msec
10msec
OPERATION IN THIS AREA
LIMITED BY R DS(on)
100µsec
www.irf.com
5
IRFR12N25D/IRFU12N25D
Fig 10a. Switching Time Test Circuit
V
DS
90%
10%
V
GS
t
d(on)
t
r
t
d(off)
t
f
Fig 10b. Switching Time Waveforms
V
DS
Pulse Width
1
µs
Duty Factor
0.1 %
R
D
V
GS
R
G
D.U.T.
V
GS
+
-
V
DD
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
Fig 9. Maximum Drain Current Vs.
Case Temperature
25
50
75
100
125
150
175
0
3
6
9
12
15
T , Case Temperature
( C)
I , Drain Current (A)
°
C
D
0.01
0.1
1
10
0.00001
0.0001
0.001
0.01
0.1
1
Notes:
1. Duty factor D =
t / t
2. Peak T
= P
x Z
+ T
1
2
J
DM
thJC
C
P
t
t
DM
1
2
t , Rectangular Pulse Duration (sec)
Thermal Response
(Z )
1
thJC
0.01
0.02
0.05
0.10
0.20
D = 0.50
SINGLE PULSE
(THERMAL RESPONSE)
PDF 
ZIP