SLE 66CX642P Short Product Information

Ref.: SPI_SLE 66CX642P_1102.doc

This document contains preliminary information on a new product under development.
Details are subject to change without notice.
Revision History:

Current Version 11.02

Previous Releases: 04.02
Page

3,6

Important: Further information is confidential and on request. Please contact:

Infineon Technologies AG in Munich, Germany,
Security & Chip Card ICs,
Tel +49 - (0)89 234-80000
Fax +49 - (0)89 234-81000
E-Mail: security.chipcard.ics@infineon.com

Edition 2002

Published by Infineon Technologies AG, CC Applications Group
St.-Martin-Strasse 53, D-81541 München

Attention please!
The information herein is given to describe certain components and shall not be considered as warranted characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits,
descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.

Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon
Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see address list).

Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in question please

contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of
Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support
device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended
to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is

reasonable to assume that the health of the user or other persons may be endangered.

SLE 66CX642P

Short Product Information

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11.02

16-Bit Security Controller with MMU in 0.22µm CMOS Technology

208-Kbytes ROM, 5052 bytes RAM, 64-Kbytes EEPROM
1100-Bit ACE and 112-Bit / 112-Bit / 192-Bit DDES-EC2 Accelerator

Features

16-bit microcomputer in 0.22 µm CMOS
technology

Instruction set opcode compatible with
standard SAB 8051 processor

Enhanced 16-bit arithmetic

Additional powerful instructions optimized
for chip card applications

Dedicated, non-standard architecture with

execution time 6 times faster (18 times
by PLLmax) than standard SAB 8051
processor at same external clock

206 Kbytes User ROM for application
programs

Additional 2 Kbytes reserved ROM for
Resource Management System

(RMS+ Superslim) with intelligent
EEPROM write/erase routines

64 Kbytes Superslim-EEPROM

4 Kbytes XRAM, 256 (+ 700) Bytes IRAM

Memory Management and Protection
Unit (MMU)

Dual Key Triple DES (DDES) and EC2
GF (2

) Accelerator

Advanced Crypto Engine for up to 2048
bit RSA computation

Certified RSA 2048 library available
(refer to product brief)

CRC Module

Interrupt Module

Two 16-bit Autoreload Timer

PLL up to 15 MHz

Power saving sleep mode

Ext. Clock freq. 1 to 7.5 MHz for int.
Clock

15 MHz @ 2.7V-5.5V

Ext. Clock freq. 1 to 5 MHz for int. Clock

11 MHz @ 1.62V-5.5V

UART for handling serial interface in
accordance with ISO/IEC 7816 part 3

supporting transmission protocols T=1
and T=0

I/O routines realized in software executable

Supply voltage range: 1.62 V to 5.5 V

Current consumption

< 10mA @ 5.5 V
< 6 mA @ 3.3 V
< 4 mA @ 1.98 V

Temperature range: -25 to +85°C

ESD protection larger than 6 kV

Superslim-EEPROM

Reading and programming byte by byte

Flexible page mode for 1 to 64 bytes
write/erase operation

32 bytes security area (OTP)

Fast personalization mode 0.63 ms @15MHz

Erase + Write time < 4.0 ms @15MHz

Minimum of 500.000 write/erase cycles at
25°C

Data retention for a minimum of 10 years

EEPROM programming voltage generated on
chip

Memory Management and Protection Unit

Addressable memory up to 1 Mbyte

Separates OS (system) and application
(user)

System routines called by traps

OS can restrict access to peripherals in
application mode

Code execution from XRAM possible

Security Features

Operation state monitoring mechanism

Low and high voltage sensors

Frequency sensors and filters

Light Sensor

Glitch Sensor

Temperature Sensor

Life Test Function for Sensors

SLE 66CX642P

Short Product Information

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11.02

Testmode

Irreversible Lock - Out of testmode

Anti Snooping

HW-countermeasures against

SPA/DPA-,

Timing- and DFA-attacks (differential fault
analysis DFA)

CRC Module

Non standard dedicated Smart Card CPU
Core

Active Shield with automatic and user

controlled attack detection

Support

HW-& SW-Tools (Emulator, ROM Monitor,
Card Emulator, Simulator, Softmasking)

Application notes

Supported Standards

ISO/IEC 7816

EMV 2000

GSM 11.11, 11.12, 11.18

ETS I TS 102 221

Memory Security

16 bytes security PROM, hardware
protected

Unique chip identification number for each

chip

MED - memory encryption/decryption device
for XRAM, ROM and EEPROM

True Random Number Generator with
Firmware test function

Security optimised layout and layout
scrambling

Document References

Confidential Data Book SLE66CxxxP

Qualification report

Chip delivery specification for wafer with
chip-layout (die size, orientation, ...)

Module specification containing description
of package, etc.

Qualification report module

Development Tools Overview

Short Product Info Software Development
Kit SDK CC

Short Product Info Card Emulator CE66P

Short Product Info ROM Monitor RM66P

Short Product Info Emulator ET66P Hitex or
ET66P KSC

Short Product Info Smart Mask Package

SLE 66CX642P

Short Product Information

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11.02

Performance Advanced Crypto Engine

Calculation Time

Operation

Modulus

Exponent

5MHz

10 MHz

15 MHz

Modular Exponentiation
RSA Encrypt / RSA Signature Verify

1024 bit
2048 bit

17 bit
17 bit

20 ms
630 ms

11 ms
315 ms

7 ms
210 ms

Modular Exponentiation
RSA Decrypt / RSA Signature
Generate

1024 bit

820 ms

410 ms

273 ms

Modular Exponentiation using CRT
RSA Decrypt / RSA Signature
Generate

eq.1024 bit
eq.2048 bit

250 ms
1840 ms

125 ms
920 ms

83 ms
614 ms

DSA Signature Generate

512 bit

160 bit

97ms

49 ms

32 ms

DSA Signature Verify

512 bit

160 bit

117 ms

59 ms

39 ms

DSA Signature Generate

1024 bit

160 bit

438 ms

219 ms

146 ms

DSA Signature Verify

1024 bit

160 bit

711 ms

356 ms

237 ms

Performance DDES-EC2 Accelerator

Encryption Time for an

8-Byte Block incl. Data
Transfer

Operation

Data Block

Length

5 MHz 10 MHz 15 MHz

56-bit Single DES Encryption

64 bit

23 µs

11 µs

8 µs

112-bit Triple DES Encryption

64 bit

35 µs

17 µs

12 µs

Calculation Time

Operand
Length

5 MHz 10MHz 15 MHz

Elliptic Curves GF(2

) EC-DSA Signature Generate

192 bit

285 ms 142 ms 95 ms

Elliptic Curves GF(2

) EC-DSA Signature Verify

192 bit

540 ms 270 ms 180 ms

Part Number SLE66CX642P