SLE 66CX1360PE Short Product Information

Ref.: SPI_SLE 66CX1360PE_0204

This document contains preliminary information on a new product under development.
Details are subject to change without notice.
Revision History:

Current Version 02.04

Previous Releases:03.03
Page

Important: Further information is confidential and on request. Please contact:

Infineon Technologies AG in Munich, Germany,
Security & Chip Card ICs,
Tel +49 - (0)89 234-80000

Fax +49 - (0)89 234-81000
E-Mail: security.chipcard.ics@infineon.com

Edition 2004

Published by Infineon Technologies AG, CC Applications Group
St.-Martin-Strasse 53, D-81541 München
© Infineon Technologies AG 2002
All Rights Reserved.

Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.

Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon
Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see address list).

Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of
that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices
or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect
human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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02.04

8/16-Bit Security Controller with enhanced instruction set for large
memories in 0.22µm CMOS Technology
308 Kbyte ROM, 7100 bytes RAM, 136-Kbyte EEPROM
1100-Bit ACE and Dual Key Triple DES Accelerator

Features

8/16-bit microcomputer in 0.22 µm CMOS technology

Instruction set opcode compatible with standard
SAB 8051 processor

Downward compatibility to existing SLE 66CxxxP
products for existing masks (without using the
new features)

Addressable memory up to 16 Mbyte

Additional enhanced instructions for direct
physical memory access of >64kByte

Typically saves up to 90 % code space and
increases execution speed up to 80%.

Dedicated, non-standard architecture with execution
time 6 times faster than standard SAB 8051
processor at same external clock. (Up to 18 times
faster using internal frequency PLL x 3 compared to
external clock).

308 Kbytes User ROM for application programs

136 Kbytes MicroSlim-EEPROM for increased
memory requirements in mobile applications

6 Kbytes XRAM, 256 bytes internal RAM, 700 bytes
Crypto RAM.

Enhanced Memory Management and Protection
Unit (MMU) with application and user defined
segments

Dual Key Triple DES (DDES)

Advanced Crypto Engine:

Up to 1100 bit RSA calculation in Hardware

Up to 2048 bit RSA calculation via fast and
secure RSA 2048 crypto library (CC EAL
5+ certified within SLE66CX322P, refer to
product brief)

Supports Elliptic Curves over GF[p]

CC EAL5+ certification according to BSI-PP-0002
planned

True Random Number Generator with Firmware test
function

CRC Module

16-bit Interrupt Module

Code executions during E²-programming for faster
personalization

EEPROM programming voltage generated on chip

Internal Clock with up to 33 MHz:
Programmable internal frequency (PLL x1, x2, x3, x4
and free running mode(s)).

Adjustable internal frequency according to
available power or required performance

Increased internal frequency for maximum
performance

Internal frequency is automatically adjusted to
guarantee a given limited power consumption

Two 16-bit Autoreload Timer

Power saving sleep mode

Ext. Clock freq. 1 up to 7.5 MHz

UART for handling serial interface in accordance
with ISO/IEC 7816 part 3 supporting transmission
protocols T=1 and T=0

Supply voltage range:1.8 V, 3.0 V, 5.0 V

Support of current consumption limits by GSM / UICC
applications

< 10 mA @ 5.5 V
< 6 mA @ 3.3 V
< 4 mA @ 1.98 V

Operating Temperature range: -25 to +85°C

Storing temperature range: 40° to +125°C

ESD protection larger than 6 kV (HBM)

MicroSlim-EEPROM

Typical Erase + Write time

2.9 ms

Enhanced ECC module controlled by OS

Reading and programming byte by byte

Platform prepared for flash-like erasing of E²-segments
up to 2 kB

Flexible page mode for 1 to 64 bytes write/erase
operation

32 bytes security area (OTP)

Fast personalization mode

1.0 ms

Minimum of 500.000 write/erase cycles @ 25°C per
page. Maximum of 16.500.000 write/erase cycles per
sector

Typical data retention 10 years @ 25°C

New

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Memory Management and Protection Unit

Addressable memory of up to 16 Mbyte

Separates OS (system mode) and application (user
mode)

System routines called by interrupts

OS can restrict access to peripherals in application
mode

Variable application orientated segments defined
and controlled by OS

Code execution from XRAM possible

Enhanced multi-application support by 16
descriptors for system / application mode.

Security Features

Enhanced sensor concept:

Low and high voltage sensors

Frequency sensors and filters

Light Sensor

Glitch Sensors

Temperature Sensor

Life Test Function for Sensors (UMSLC)

Bus confusion

Security reset detection

Current control oscillator (ICO)

Memory Security

Sparkling SFR encryption for DDES and ACE, CRC
module and RNG

32 bytes security PROM, hardware protected for
batch-, wafer-, die-individual security data. Unique
chip identification number for each chip

Additional memory for customer-defined security
FabKey on request

MED memory encryption/decryption device for
XRAM, ROM and EEPROM

Security optimized layout and layout scrambling

Fast IRAM erase

Enhanced Error correction unit (ECU)

Testmode

Irreversible Lock - Out of test-mode

Anti Snooping

Automatic randomization smoothing of power profile

Effective HW-countermeasures against SEMA/DEMA,
SPA/DPA, DFA and Timing-Attacks

Non standard dedicated Smart Card CPU Core

Active Shield with automatic and user controlled attack
detection

Hardware countermeasures controlled by True
Random Number Generator

Targeted Certifications

CC EAL5+

VISA level 3

MULTOS

CAST

Support

HW-& SW-Tools (Emulator, ROM Monitor, Card
Emulator, Simulator, Softmasking)

Application notes

Supported Standards

ISO/IEC 7816

EMV 2000

GSM 11.11, 11.12, 11.18

ETSI TS 102 221

Document References

Confidential Data Book SLE66CxxxPE

Qualification report

Chip delivery specification for wafer with chip-layout
(die size, orientation,...)

Module specification containing description of
package, etc.

Qualification report module

Development Tools Overview

Short Product Information Software Development Kit
SDK CC

Short Product Information Card Emulator CE66EP

Short Product Information ROM Monitor RM66PE

Short Product Information Emulator ET66PE Hitex or
ET66PE KSC

Short Product Information Smart Mask Package

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02.04

Performance Advanced Crypto Engine (typical values based on internal test results)

Calculation Time

Operation

Modulus

Exponent

5MHz

15 MHz

33 MHz*

Modular Exponentiation
RSA Encrypt / RSA Signature Verify

1024 bit
2048 bit

17 bit
17 bit

20 ms
630 ms

7 ms
210 ms

3 ms
96 ms

Modular Exponentiation
RSA Decrypt / RSA Signature
Generate

1024 bit

820 ms

273 ms

124 ms

Modular Exponentiation using CRT
RSA Decrypt / RSA Signature
Generate

eq.1024 bit
eq.2048 bit

250 ms
1840 ms

83 ms
614 ms

38 ms
279 ms

DSA Signature Generate

512 bit

160 bit

97ms

32 ms

15 ms

DSA Signature Verify

512 bit

160 bit

117 ms

39 ms

18 ms

DSA Signature Generate

1024 bit

160 bit

438 ms

146 ms

66 ms

DSA Signature Verify

1024 bit

160 bit

711 ms

237 ms

108 ms

* preliminary values

Performance DDES- Accelerator (typical values, based on internal test results)

Encryption Time for an
8-Byte Block incl. Data
Transfer

Operation

Data Block
Length

5 MHz 15 MHz 33 MHz*

56-bit Single DES Encryption

64 bit

23 µs 8 µs

3.5 µs

112-bit Triple DES Encryption

64 bit

35 µs 12 µs

5.3 µs

* preliminary values

New

Part Number SLE66CX1360PE