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Part Number SLE66CLX640P

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Security & Chip Card ICs
SLE 66CLX640P
16-Bit High Security Dual Interface Controller
ISO/IEC 7816 and 14443 Type A & B Compliant Interfaces
For Contact and Contactless Operation

with Memory Management and Protection Unit
in 0.22 µm CMOS Technology
136-Kbyte ROM, 5-Kbyte RAM, 64-Kbyte EEPROM
1100-Bit Advanced Crypto Engine
supporting RSA and Elliptic Curve GF(p)
112-Bit / 192-Bit DDES-EC2 Accelerator
supporting DES, 3DES and Elliptic Curve GF(2
n
)

Short Product Information
April 2004

SLE 66CLX640P Short Product Information
Ref.: SPI_SLE66CLX640P_0404.doc
This document contains preliminary information on a new product under development.
Details are subject to change without notice.
Revision History:
Current Version 2004-04-27
Previous Releases:
Page






Important: Further information is confidential and on request. Please contact:
Infineon Technologies AG in Munich, Germany,
Security & Chip Card ICs,
Tel +49 - (0)89 234-80000
Fax +49 - (0)89 234-81000
E-Mail: security.chipcard.ics@infineon.com




Published by Infineon Technologies AG, SMS Security Applications Group
St.-Martin-Strasse 53, D-81541 München
© Infineon Technologies AG 2004
All Rights Reserved.
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Due to technical requirements components may contain dangerous substances. For information on the types in
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µµ
SLE 66CLX640P
Short Product Information
3 / 12
2004-04-27
16-Bit High Security Dual Interface Controller
ISO/IEC 7816 and 14443 Type A &B Compliant Interfaces
For Contact and Contactless Operation with MMU in 0.22 µm CMOS Technology
136-Kbyte ROM, 5-Kbyte RAM, 64-Kbyte EEPROM
1100-Bit Advanced Crypto Engine supporting RSA and Elliptic Curve GF (p) and
112-Bit / 192-Bit DDES-EC2 Accelerator
supporting DES, 3DES and Elliptic Curve GF (2n)

Features
·
Enhanced low power 8051 CPU with
extended addressing modes for dual
interface smart card applications
·
Instruction set opcode compatible with
standard 8051 processor with additional
powerful instructions optimized for smart
card application
·
Enhanced architecture with execution
time
6 times faster (18 times using
PLLmax)
than standard 8051 processor at
same external clock
·
134 Kbytes User ROM for operating
system and application (programs & data)
·
2 Kbytes reserved ROM for Resource
Management System (RMS_E) with
Contactless Optimized EEPROM
write/erase routines
·
64 Kbytes Secure EEPROM in
SuperSlim technology for application
program and data
·
4k bytes XRAM, 700 bytes Crypto-RAM
and 256 bytes internal RAM for fast data
processing
·
Memory Management Unit
·
Certified True Random Number
Generator
·
Dual Key Triple DES (DDES) &
GF
(2
n
) Elliptic Curve (EC2) Accelerator
·
Advanced Crypto Engine for Elliptic
Curve GF(p) and up to 2048 bits RSA
computation
·
CRC Module according to ISO/IEC 3309
supporting CCIT v.41 & HDLC X25
·
8 Interrupt Vectors Module with 3 priority
levels to ensure real time operation
·
PLL: to speed up the internal CPU clock
frequency up to 15MHz
(optional use)
·
Two 16-bit Timers with interrupt capability
for protocols, security checks & watch dog
implementations
·
Power saving sleep mode
·
Temperature range:
contact-based: -25°C to +85°C
contact-less: -25°C to +70°C
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2004-04-27
Full operation either via Contact-based
and/or Contactless interfaces
controlled by Operating System
enhances Security Level
Contact-based Interface
·
Contact configuration and serial
interface according to ISO/IEC 7816
·
UART handling serial interface compliant
with ISO/IEC 7816 supporting
transmission protocols T=0 and T=1
·
Supply voltage range:
5V ± 10% (Class A)
3V ± 10% (Class B)
·
Current consumption < 10 mA @ 5.5 V
·
External CPU clock frequency:
1 to 7.5 MHz
·
Internal CPU clock frequency:
up to 15 MHz
·
ESD protection larger than 6 kV
Contactless Interface
·
Interface according to ISO/IEC 14443 for
both Type A and Type B
·
Carrier frequency 13.56 MHz
·
Data rate
106 Kbit/s in type A operation
up to 848 Kbit/s in type B operation
·
Anticollision & Transmission Protocol
supported by open source application
notes for both Type A & B
·
Flexible Internal CPU clock frequency:
fully configurable from 1.7MHz up to
15 MHz
·
256 bytes buffer for contactless data
exchange (FiFo circular architecture)
·
Parallel operation of CPU, Peripherals
like DES, CRC and Contactless Interface
possible for High Demanding
Contactless Applications
EEPROM (SuperSlim Technology)
·
Byte wise EEPROM programming and read
accesses
·
Versatile & Flexible page mode for 1 to 256
bytes write/erase operation
·
32 bytes security area including:
- 16 bytes chip unique identification number
- 16 bytes PROM area (OTP like)
·
Fast personalisation mode 1.5 ms
·
Typical Page Erase time < 2.5ms
·
Typical Page Writing time < 1.8 ms
·
Minimum of 100.000 Write/erase cycles
1)
·
Data retention for a minimum of 10 years
1)
·
EEPROM programming voltage generated
on chip
Memory Management and Protection
Unit
·
Addressable memory up to 1 Mbytes
·
Separates OS (system mode) and
Application (application mode)
·
System routines called by traps
·
Access Restrictions to peripherals in
application mode controlled by OS
·
Code execution from XRAM possible
1)
Values are temperature dependant
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2004-04-27
Security Features
Operation state monitoring mechanism
The chip goes in a secure reset state on any
following sensors alarm:
·
Low and high voltage sensors
·
Internal voltage sensor
·
Frequency sensors and filters
·
Light sensor
·
Glitch sensor
·
Temperature sensor
·
Life Test Sensor
·
Internal power-on reset sensor
·
Active Shield with automatic and user
controlled attack detection
Secure chip and firmware design
·
Security scrambled & optimized chip
layout against physical chip manipulation
·
Memory encryption/decryption module
(MED) for XRAM, ROM and EEPROM
against reverse engineering and power
attacks
·
ROM code not visible due to implantation
·
Mask dependant ROM code encrypted
during production
·
Chip Unique encryption of the XRAM and
EEPROM
·
Flexible encryption of part or whole
EEPROM by additional user-defined key
·
16 byte Unique chip identification number
for anti-clone countermeasure & tracking
·
16 bytes security PROM hardware
protected (OTP like)
·
Secure start of the operating system
ensured by certified Self Test Software
(STS)
·
Certified EEPROM programming routines
(RMS_E)
·
True Random Number Generator with
Firmware test function
·
High Speed SPA/DPA resistant Triple
DES (DDES) Accelerator and Advanced
Crypto Engine
Anti Snooping
·
HW-countermeasures against SPA/DPA-,
Timing- and DFA-attacks (differential fault
analysis)
Supported Standards
·
ISO/IEC 7816
·
EMV 2000
·
GSM 11.1x
·
ETSI TS 102 221
·
ISO/IEC 14443
·
ISO/IEC 3309
·
CCIT v.41
·
HDLC X25