SLE 66CL81P Short Product Information

Ref.: SPI_SLE66CL81P_0404.doc

This document contains preliminary information on a new product under development.
Details are subject to change without notice.
Revision History:

Current Version 2004-04-01

Previous Releases: 2004-02-12
Page
3

Type A baud rate of 106 kbit/s

Important: Further information is confidential and on request. Please contact:

Infineon Technologies AG in Munich, Germany,
Secure Mobile Solutions - Security
Tel +49 - (0)89 234-80000

Fax +49 - (0)89 234-81000
E-Mail: security.chipcard.ics@infineon.com

Published by Infineon Technologies AG, SMS Security Applications Group
St.-Martin-Strasse 53, D-81541 München
Š Infineon Technologies AG 2004
All Rights Reserved.

To our valued customers
We constantly strive to improve the quality of all our products and documentation. We have spent an exceptional
amount of time to ensure that this document is correct. However, we realise that we may have missed a few things. If
you find any information that is missing or appears in error, please use the contact section above to inform us. We
appreciate your assistance in making this a better document.

Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.

Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon
Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see address list).

Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of
that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices
or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect
human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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16-Bit High Security Contactless Controller
ISO/IEC 14443 Type A &B Compliant Interfaces
For Contactless Operation with MMU in 0.22 ľm CMOS Technology
72-Kbyte ROM, 2304-byte RAM, 8-Kbyte EEPROM
112-Bit / 192-Bit DDES-EC2 Accelerator
supporting DES, 3DES and Elliptic Curve GF(2n)

Features

Enhanced low power 8051 CPU with
extended addressing modes for
contactless smart card applications

Instruction set opcode compatible with
standard 8051 processor with additional
powerful instructions optimized for smart
card application

Enhanced architecture with execution
time 6 times faster (18 times using
PLLmax) than standard 8051 processor at
same external clock

70 Kbytes User ROM for operating system
and application (programs & data)

2 Kbytes reserved ROM for Resource
Management System (RMS_E) with
Contactless Optimized EEPROM
write/erase routines

8 Kbytes Secure EEPROM in SuperSlim
technology for application program and
data

2048 bytes XRAM and 256 bytes internal
RAM for fast data processing

Memory Management Unit

Certified True Random Number
Generator

Dual Key Triple DES (DDES) &
GF

) Elliptic Curve (EC2) Accelerator

CRC Module according to ISO/IEC 3309
supporting CCIT v.41 & HDLC X25

8 Interrupt Vectors Module with 3 priority
levels to ensure real time operation

PLL: to speed up the internal CPU clock
frequency up to 15MHz (optional use)

Two 16-bit Timer with interrupt capability
for protocols, security checks & watch dog
implementations

Power saving sleep mode

Temperature range:
contact-less: -25°C to +70°C

Full operation of Contactless interface
controlled by Operating System
enhances Security Level

Contactless Interface

Interface compliant to ISO/IEC 14443 for
both Type A and Type B

Carrier frequency 13.56 MHz

Data rate
106 Kbit/s in type A operation
up to 848 Kbit/s in type B operation

Anticollision & Transmission Protocol
supported by open source application
notes for both Type A & B

Flexible Internal CPU clock frequency:
fully configurable from 1.7MHz up to
15 MHz

256 bytes buffer for contactless data
exchange (FiFo circular architecture)

Parallel operation of CPU, Peripherals
like DES, CRC and Contactless Interface
possible for High Demanding
Contactless Applications

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EEPROM (SuperSlim Technology)

Byte wise EEPROM programming and read
accesses

Versatile & Flexible page mode for 1 to 256
bytes write/erase operation

32 bytes security area including:
- 16 bytes chip unique identification number
- 16 bytes PROM area (OTP like)

Fast personalisation mode 1.5 ms

Typical Page Erase time < 2.5ms

Typical Page Writing time < 1.8 ms

Minimum of 100.000 Write/erase cycles

Data retention for a minimum of 10 years

EEPROM programming voltage generated
on chip

Memory Management and Protection
Unit

Addressable memory up to 1 Mbytes

Separates OS (system mode) and
Application (application mode)

System routines called by traps

Access Restrictions to peripherals in
application mode controlled by OS

Code execution from XRAM possible

Security Features

Operation state monitoring mechanism

The chip goes in a secure reset state on any
following sensors alarm:

Low and high voltage sensors

Internal voltage sensor

Frequency sensors and filters

Light sensor

Glitch sensor

Temperature sensor

Life Test Sensor

Internal power-on reset sensor

Active Shield with automatic and user
controlled attack detection

Values are temperature dependant

Secure chip and firmware design

Security scrambled & optimized chip
layout against physical chip manipulation

Memory encryption/decryption module
(MED) for XRAM, ROM and EEPROM
against reverse engineering and power
attacks

ROM code not visible due to implantation

Mask dependant ROM code encrypted
during production

Chip Unique encryption of the XRAM and
EEPROM

Flexible encryption of part or whole
EEPROM by additional user-defined key

16 byte Unique chip identification number
for anti-clone countermeasure & tracking

16 bytes security PROM hardware
protected (OTP like)

Secure start of the operating system
ensured by certified Self Test Software
(STS)

Certified EEPROM programming routines
(RMS_E)

True Random Number Generator with
Firmware test function

High Speed SPA/DPA resistant Triple
DES (DDES) Accelerator

Anti Snooping

HW-countermeasures against SPA/DPA-,
Timing- and DFA-attacks (differential fault
analysis)

Supported Standards

EMV 2000

ISO/IEC 14443

ISO/IEC 3309

CCIT v.41

HDLC X25

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Application Support

HW-& SW-Tools (Emulator, ROM Monitor,
Card Emulator, Simulator,

Evaluation Kit

Proximity (

Contactless Reader package),

SmartMaskTM package, Simulated Reader
Software, etc.)

Open Source Application Notes Tutorial
(e.g.: T=0, T=1, DES and 3DES, Crypto
Library, Anticollision and Contactless
Transmission Protocols for both Type A
and B, Card Coil Design Guide, Card Coil
Antenna Reference Design List, etc.)

Certified CC EAL5+ Crypto Library

Worldwide Application Engineer Team and
customer dedicated Field Application
Engineers

Regular Customer trainings on
Cryptography, Contactless and Dual
interface controllers including ISO/IEC
14443 related topics

On-site trainings available on request

Document References

Confidential Data Book SLE 66CxxP

Confidential Instruction SLE 66CxxP

Confidential Quick Reference SLE 66CxxP

Chip Qualification report

Chip delivery specification for wafer with
chip-layout (die size, orientation, ...)

Module specification containing description
of package, etc.

Module Qualification report

Development Tools Overview

Software Development Kit SDK CC

Card Emulator CE66P Dual Interface

ROM Monitor RM66P-II with stand alone
functionality for ROM mask qualification in
the end user system

Emulator ET66P Hitex or ET66P KSC

Smart MaskTM Package for chip evaluation

Smart MaskTM Pure Contactless modules
MCC8 (supplied by Infineon) supporting
both ISO/IEC 14443 Type A & B for
implantation process testing and production
setup

Evaluation Kit Proximity (Contactless
reader package)

Part Number SLE66CL81P