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Part Number SLE66C640P

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Security & Chip Card ICs
SLE 66C640P
16-Bit Security Controller
with Memory Management and Protection Unit
in 0.22 µm CMOS Technology
136-Kbytes ROM, 4352 bytes RAM, 64-Kbytes EEPROM
Short Product Information 08.01
SLE 66C640P Short Product Information
Ref.: SPI SLE 66C640P 0801.doc
This document contains preliminary information on a new product under development.
Details are subject to change without notice.
Revision History:
Current Version 08.01
Previous Releases:
Page
Subjects (changes since last revision)
Important: Further information is confidential and on request. Please contact:
Infineon Technologies AG in Munich, Germany,
Security & Chip Card ICs,
Tel +49 - (0)89 234-80000
Fax +49 - (0)89 234-81000
E-Mail: security.chipcard.ics@infineon.com
Edition 2001
Published by Infineon Technologies AG, CC Applications Group
St.-Martin-Strasse 53, D-81541 München
© Infineon Technologies AG 2001
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon
Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of
that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices
or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect
human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
SLE 66C640P
Short Product Information
3 / 8
08.01
16-Bit Security Controller with MMU in 0.22µm CMOS Technologie
136 Kbytes ROM, 4352 bytes RAM, 64 Kbytes EEPROM
Features
·
16-bit microcomputer in 0.22 µm CMOS
technology
·
Instruction set opcode compatible with
standard SAB 8051 processor
·
Enhanced 16-bit arithmetic
·
Additional powerful instructions optimized
for chip card applications
·
Dedicated, non-standard architecture with
execution time 6 times faster (18 times
by PLLmax)
than standard SAB 8051
processor at external same clock
·
134 Kbytes User ROM for application
programs
·
Additional 2 Kbytes reserved ROM for
Resource Management System (RMS+
light) with intelligent EEPROM write/erase
routines
·
64 Kbytes Slim-EEPROM
·
4 Kbytes XRAM, 256 Bytes IRAM
·
Memory Management and Protection
Unit (MMU)
·
CRC Module
·
Interrupt Module
·
Two 16-bit Autoreload Timer
·
PLL
·
Power saving sleep mode
·
External clock frequency 1 to 7.5 MHz
for internal clock
10 MHz
·
UART for handling serial interface in
accordance with ISO/IEC 7816 part 3
supporting transmission protocols T=1
and T=0
·
I/O routines realized in software executable
·
Supply voltage range: 2.7 V to 5.5 V
·
Current consumption
< 10mA @ 5.5 V
< 6 mA @ 3.3 V
·
Temperature range: -25 to +85°C
·
ESD protection larger than 6 kV
Slim-EEPROM
·
Reading, erasing and writing byte by byte
·
Flexible page mode for 1 to 64 bytes
write/erase operation
·
32 bytes security area (OTP)
·
Fast personalization mode
·
Erase + Write time < 4.5 ms
·
Minimum of 500.000 write/erase cycles at
25°C
·
Data retention for a minimum of 10 years
·
EEPROM programming voltage generated on
chip
Memory Management and Protection Unit
·
Addressable memory up to 1 Mbyte
·
Separation OS (system) and application
(user)
·
System routines called by traps
·
OS can restrict access to peripherals in
application mode
·
Code execution from XRAM possible
Security Features
Operation state monitoring mechanism
·
Low and high voltage sensors
·
Frequency sensors and filters
·
Glitch Sensor
Memory Security
·
16 bytes security PROM, hardware protected
·
Unique chip identification number for each
chip
·
MED - memory encryption/decryption device
for XRAM, ROM and EEPROM
·
True Random Number Generator with
Firmware test function
·
Security optimised layout and layout
scrambling
SLE 66C640P
Short Product Information
4 / 8
08.01
Testmode
·
Irreversible Lock - Out of testmode
Anti Snooping
·
HW-countermeasures against SPA/DPA-,
Timing- and DFA-attacks (differential fault
analysis ­ DFA)
·
CRC ­ Module
·
Non standard dedicated Smart Card CPU ­
Core
Support
·
HW-& SW-Tools (Emulator, ROM Monitor,
Card Emulator, Simulator, Softmasking)
·
Application notes
Supported Standards
·
ISO/IEC 7816
·
EMV 2000
·
GSM 11.1x
·
ETS I TS 102 221
Document References
·
Confidential Data Book SLE 66CxxxP
·
Qualification report
·
Chip delivery specification for wafer with
chip-layout (die size, orientation,...)
·
Module specification containing description
of package, etc.
·
Qualification report module
Development Tools Overview
·
Short Product Information Software
Development Kit SDK CC
·
Short Product Information Card Emulator
CE66P
·
Short Product Information ROM Monitor
RM66P
·
Short Product Information Emulator ET66P
Hitex or ET66P KSC
·
Short Product Information Smart Mask
Package
SLE 66C640P
Short Product Information
5 / 8
08.01
Ordering Information
Type
Package
1
Voltage
Range
Temperature
Range
Frequency Range
(ext. clock frequency)
SLE 66C640P M5
M5
SLE 66C640P C
die
2.7 V - 5.5 V ­ 25°C to + 70°C 1 MHz - 5 MHz
SLE 66C640P-T85 M5
M5
SLE 66C640P-T85 C
die
2.7 V - 5.5 V ­ 25°C to + 85°C 1 MHz - 5 MHz
SLE 66C640P-F7 M5
M5
SLE 66C640P-F7 C
die
2.7 V - 5.5 V ­ 25°C to + 70°C 1 MHz ­ 7.5 MHz
Production sites:
·
Dresden SLE66CxxxP
·
UMC Taiwan SLE66CxxxPU
1
available as wire-bonded module (M5) for embedding in plastic cards or as die (C) for customer packaging