ChipFind - Datasheet

Part Number HVU187

Download:  PDF   ZIP
Äîêóìåíòàöèÿ è îïèñàíèÿ www.docs.chipfind.ru
background image
HVU187
Silicon Epitaxial Planar Pin Diode for High Frequency Attenuator
ADE-208-054D(Z)
Rev 4
Nov. 1998
Features
·
Low forward resistance. (rf=5.5
max)
·
U
ltra small
R
esin
P
ackage (URP) is suitable for surface mount design.
Ordering Information
Type No.
Laser Mark
Package Code
HVU187
D
URP
Outline
Cathode mark
Mark
1
2
1. Cathode
2. Anode
D
background image
HVU187
2
Absolute Maximum Ratings (Ta = 25
°
C)
Item
Symbol
Value
Unit
Reverse voltage
V
R
60
V
Forward current
I
F
50
mA
Power dissipation
P
d
100
mW
Junction temperature
Tj
125
°
C
Storage temperature
Tstg
-55 to +125
°
C
Electrical Characteristics (Ta = 25
°
C)
Item
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse current
I
R
--
--
100
nA
V
R
= 60V
Forward voltage
V
F
--
--
1.0
V
I
F
= 10 mA
Capacitance
C
--
--
2.4
pF
V
R
= 0V, f = 1 MHz
Forward resistance
r
f
3.5
--
5.5
I
F
= 10 mA, f = 100 MHz
ESD-Capability
*1
--
200
--
--
V
C=200pF , Both forward and reverse direction
1 pulse.
Notes
1. Failure criterion ; IR
100nA at VR = 60V
background image
HVU187
3
Main Characteristic
Fig.1 Forward current Vs. Forward voltage
Fig.3 Capacitance Vs. Reverse voltage
Fig.4 Forward resistance Vs. Forward current
Fig.2 Reverse current Vs. Reverse voltage
0
0.2
0.4
0.6
0.8
1.0
10
10
-5
10
-7
10
-9
10
-11
Forward voltage V (V)
F
Forward current I (A)
F
10
-13
-5
-3
0
80
20
60
40
100
10
-8
Reverse voltage V (V)
R
Reverse current I (A)
R
10
10
-6
10
-7
10
-9
10
-11
10
-12
10
-13
-10
Reverse voltage V (V)
R
10
10
10
10
1.0
Capacitance C (pF)
2
1.0
-1
f=1MHz
10
10
10
10
1.0
10
10
10
Forward current I (A)
F
Forward resistance r ( )
f
3
2
-5
-4
-3
-2
10
4
f=100MHz
background image
HVU187
4
Package Dimensions
Unit : mm
1.25
±
0.15
2.5
±
0.15
1.7
±
0.15
0.3
±
0.15
0.9
±
0.15
0 -- 0.10
Cathode Mark
1
2
1. Cathode
2. Anode
D
Hitachi Code
JEDECCode
EIAJCode
Weight(g)
URP
--
--
0.004
background image
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party's rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi's sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Fax: 535-1533
URL
NorthAmerica
: http:semiconductor.hitachi.com/
Europe
: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore)
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan)
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong)
: http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan
: http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Hitachi Europe GmbH
Electronic components Group
Dornacher Stra§e 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
For further information write to: