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Part Number HSB88AS

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HSB88AS
Silicon Schottky Barrier Diode for High Speed Switching
ADE-208-964 (Z)
Rev. 0
Aug. 2000
Features
·
Low reverse current, Low capacitance.
·
CMPAK package is suitable for high density surface mounting and high speed assembly.
Ordering Information
Type No.
Laser Mark
Package Code
HSB88AS
C1
CMPAK
Pin Arrangement
1 Cathode 2
2 Anode 1
3 Cathode 1
Anode 2
(Top View)
2
1
3
HSB88AS
Rev.0, Aug. 2000, page 2 of 5
Absolute Maximum Ratings
(Ta = 25
°
C)
Item
Symbol
Value
Unit
Reverse voltage
V
R
10
V
Average rectified current
I
O
*
15
mA
Junction temperature
Tj
125
°
C
Storage temperature
Tstg
-
55 to +125
°
C
Note:
Per one device.
Electrical Characteristics *
1
(Ta = 25
°
C)
Item
Symbol
Min
Typ
Max
Unit
Test Condition
Forward voltage
V
F1
0.350
0.420 V
I
F
= 1 mA
V
F2
0.500
0.580
I
F
= 10 mA
Reverse current
I
R1
0.2
µ
A
V
R
= 2 V
I
R2
10
V
R
= 10 V
Capacitance
C
0.80
pF
V
R
= 0 V, f = 1 MHz
Capacitance deviation
C
0.10
pF
V
R
= 0 V, f = 1 MHz
Forward voltage deviation
V
F
10
mV
I
F
= 10 mA
ESD-Capabilityme *
2
30
V
C = 200 pF, R = 0
, Both forward and
reverse direction 1 pulse.
Notes
:
1. Per one device.
2. Failure criterion ; I
R
>
0.4
µ
A at V
R
= 2V
HSB88AS
Rev.0, Aug. 2000, page 3 of 5
Main Characteristic
Reverse voltage V R (V)
Reverse current I
R
(A)
Fig.1 Forward current Vs. Forward voltage
Fig.2 Reverse current Vs. Reverse voltage
Capacitance C (pF)
Fig.3 Capacitance Vs. Reverse voltage
Reverse voltage V R (V)
Forward voltage V (V)
F
Forward current I (A)
F
0
0.1
0.2
0.3
0.4
0.5
10
-5
10
-6
10
10
-3
-4
10
-2
0.6
Ta=25
°
C
Ta=75
°
C
0.1
1.0
10
1.0
0.1
10
f=1MHz
0
5
10
10
-9
10
-8
-7
10
15
10
10
-6
-5
Ta=25
°
C
Ta=75
°
C
HSB88AS
Rev.0, Aug. 2000, page 4 of 5
Package Dimensions
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
CMPAK
Conforms
0.006 g
Unit: mm
2.0
±
0.2
0.3
2.1
±
0.3
(0.425)
1.25
±
0.1
(0.425)
(0.65) (0.65)
1.3
±
0.2
0.16
0
-
0.1
0.2
0.9
±
0.1
+ 0.1
-
0.05
0.3
+ 0.1
-
0.05
0.3
+ 0.1
-
0.05
+ 0.1
-
0.06
HSB88AS
Rev.0, Aug. 2000, page 5 of 5
Disclaimer
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2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi's sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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