MPX4080D
Rev 2, 05/2005
Freescale Semiconductor
Technical Data
© Freescale Semiconductor, Inc., 2005. All rights reserved.
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
The MPX4080D series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications, but
particularly those employing a microcontroller or microprocessor with A/D inputs.
This patented, single element transducer combines advanced micromachining
techniques, thin-film metallization, and bipolar processing to provide an accurate,
high level analog output signal that is proportional to the applied pressure.
Features
·
3.0% Maximum Error over 0
° to 85°C
·
Ideally suited for Microprocessor or Microcontroller-Based Systems
·
Temperature Compensated from -40
° to 105°C
·
Easy-to-Use, Durable Epoxy Unibody Package
ORDERING INFORMATION
Device
Device Type
Case No.
Device Marking
MPX4080D
Differential
867
MPX4080D
MPX4080D
INTEGRATED PRESSURE SENSOR
0 TO 80 kPA (0 TO 11.6 psi)
0.58 TO 4.9 V OUTPUT
MPX4080D
CASE 867-08
PIN NUMBERS
1
V
out
4
NC
2
GND
5
NC
3
V
S
6
NC
Note: Pins 4, 5, and 6 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the notch
in the lead.
MPX4080D
Sensors
2
Freescale Semiconductor
Figure 1
shows a block diagram of the internal circuitry integrated on the pressure sensor chip.
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings
(1)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating
Symbol
Value
Unit
Maximum Pressure
(P1 > P2)
(P2 > P1)
P
max
400
400
kPa
Storage Temperature
T
stg
-40
° to +125°
°C
Table 2. Operating Characteristics (VS = 5.1 Vdc, TA = 25×C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 4
required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
(1)
1. 0kPa (kiloPascal) equals 0.145 psi.
P
OP
0
--
80
kPa
Supply Voltage
(2)
2. Device is ratiometric within this specified excitation range.
V
S
4.85
5.1
5.35
Vdc
Supply Current
I
o
--
7.0
10
mAdc
Minimum Pressure Offset
(3)
(0 to 85
°C)
@ V
S
= 5.1 V
3. Offset (V
off
) is defined as the output voltage at the minimum rated pressure.
V
off
0.478
0.575
0.672
Vdc
Full Scale Output
(4)
(0 to 85
°C)
@ V
S
= 5.1 V
4. Full Scale Output (V
FSO
) is defined as the output voltage at the maximum or full rated pressure.
V
FSO
4.772
4.900
5.020
Vdc
Full Scale Span
(5)
(0 to 85
°C)
@ V
S
= 5.1 V
5. Full Scale Span (V
FSS
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
V
FSS
--
4.325
--
Vdc
Accuracy
(6)
6. Accuracy (error budget) consists of the following:
· Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
· Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
· Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25
°C.
· TcSpan:
Output deviation over the temperature range of 0
° to 85°C, relative to 25°C.
· TcOffset:
Output deviation with minimum pressure applied, over the temperature range of 0
° to 85°C, relative to 25°C.
· Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V
FSS
at 25
°C.
--
--
--
3.0
%V
FSS
Sensitivity
V/P
--
54
--
mV/kPa
Sensing
Element
GND
V
out
V
S
Pins 4, 5, and 6 Are NO CONNECTS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and
Ground
Reference
Shift Circuitry
MPX4080D
Sensors
Freescale Semiconductor
3
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2
shows the sensor output signal relative to
differential pressure input. Typical, minimum, and maximum
output curves are shown for operation over a temperature
range of 0
° to 85°C using the decoupling circuit shown in
Figure 4
. The output will saturate outside of the specified
pressure range.
Figure 2. Output versus Pressure Differential
Figure 3. Cross-Sectional Diagrams (Not to Scale)
Figure 3
illustrates the differential sensing chip in the basic
chip carrier (Case 867). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the sensor
diaphragm.
The MPX4080D pressure sensor operating
characteristics, internal reliability, and qualification tests are
based on use of dry air as the pressure media. Media, other
than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 4
shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4. Recommended Power Supply Decoupling and Output Filter
(For additional output filtering information, refer to Application Note AN1646.)
Ou
tpu
t
(V)
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
TYP
MAX
MIN
Offset
(TYP)
0
10
40
60
80
kPa
PSI
20
30
50
70
VS = 5.1 Vdc
TA = 25°C
MPX4080
Sp
an Range
(TYP)
Outp
ut Ran
ge (T
YP)
5
Pressure (kPa)
Lead Frame
Wire Bond
Die
Fluoro Silicone
Gel Die Coat
Differential/Gauge
Bond
Die
Epoxy Plastic
Case
Stainless Steel
Metal Cover
Element
Vs
1.0 µF
470 pF
OUTPUT
+5.0 V
0.01 µF
GND
V
out
IPS
MPX4080D
Sensors
4
Freescale Semiconductor
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
The two sides of the pressure sensor are designated as
the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
which protects the die from harsh media. The pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side is identified by the stainless steel
cap.
Nominal Transfer Value:
V
out
= V
S
(P x 0.01059 + 0.11280)
± (Pressure Error x Temp. Mult. x 0.01059 x V
S
)
V
S
= 5.1 V ±0.25 V P kPa
Temperature in °C
4.0
3.0
2.0
0.0
1.0
-40
-20
0
20
40
60
130
120
100
80
Pressure in kPa
3.0
2.0
1.0
-1.0
-2.0
-3.0
0.0
0
20
40
60
80
100
120
Pressure
Error (max)
- 40
3
0 to 85
1
+105
2
NOTE: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 105°C.
140
Err
o
r (kPa)
Transfer Function (MPX4080D)
Temperature Error Multiplier
Pressure Error Band
MPX4080D
Temp. Multiplier
Error Limits for Pressure
± 1.5 kPa
± 1.8 kPa
± 2.3 kPa
0 to 6 kPa
0 to 60 kPa
60 to 80 kPa
MPX4080D
PACKAGE DIMENSIONS
PIN 1
F
G
N
L
R
1
2
3
4
5
6
6 PL
D
SEATING
PLANE
-T-
M
A
M
0.136 (0.005)
T
POSITIVE PRESSURE
(P1)
C
B
M
J
S
-A-
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
STYLE 3:
PIN 1. OPEN
2. GROUND
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. OPEN
STYLE 2:
PIN 1. OPEN
2. GROUND
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
MAX
MILLIMETERS
INCHES
16.00
13.56
5.59
0.84
1.63
0.100 BSC
2.54 BSC
0.40
18.42
30° NOM
30° NOM
12.57
11.43
DIM
A
B
C
D
F
G
J
L
M
N
R
S
MIN
0.595
0.514
0.200
0.027
0.048
0.014
0.695
0.475
0.430
0.090
MAX
0.630
0.534
0.220
0.033
0.064
0.016
0.725
0.495
0.450
0.105
MIN
15.11
13.06
5.08
0.68
1.22
0.36
17.65
12.07
10.92
2.29
2.66
NOTES:
1.
2.
3.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
CASE867-08
ISSUE N
BASIC ELEMENT
MPX4080D
Sensors
Freescale Semiconductor
5
MPX4080D
Sensors
6
Freescale Semiconductor
NOTES
MPX4080D
Sensors
Freescale Semiconductor
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NOTES
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MPX4080D
Rev. 2
05/2005
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