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Part Number FSDL0365RN

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©2004 Fairchild Semiconductor Corporation
www.fairchildsemi.com
Rev.1.0.4
Features
· Internal Avalanche Rugged Sense FET
· Consumes only 0.65W at 240VAC & 0.3W load with
Advanced Burst-Mode Operation
· Frequency Modulation for low EMI
· Precision Fixed Operating Frequency
· Internal Start-up Circuit
· Pulse by Pulse Current Limiting
· Abnormal Over Current Protection
· Over Voltage Protection
· Over Load Protection
· Internal Thermal Shutdown Function
· Auto-Restart Mode
· Under Voltage Lockout
· Low Operating Current (3mA)
· Adjustable Peak Current Limit
· Built-in Soft Start
Applications
· SMPS for VCR, SVR, STB, DVD & DVCD
· SMPS for Printer, Facsimile & Scanner
· Adaptor for Camcorder
Description
The FSDx0365RN(x stands for L, M) are integrated Pulse
Width Modulators (PWM) and Sense FETs specifically
designed for high performance offline Switch Mode Power
Supplies (SMPS) with minimal external components. Both
devices are integrated high voltage power switching regula-
tors which combine an avalanche rugged Sense FET with a
current mode PWM control block. The integrated PWM con-
troller features include: a fixed oscillator with frequency
modulation for reduced EMI, Under Voltage Lock Out
(UVLO) protection, Leading Edge Blanking (LEB), opti-
mized gate turn-on/turn-off driver, Thermal Shut Down
(TSD) protection, Abnormal Over Current Protection
(AOCP) and temperature compensated precision current
sources for loop compensation and fault protection circuitry.
When compared to a discrete MOSFET and controller or
RCC switching converter solution, the FSDx0365RN reduce
total component count, design size, weight and at the same
time increase efficiency, productivity, and system reliability.
Both devices are a basic platform well suited for cost effec-
tive designs of flyback converters.
Table 1. Notes: 1. Typical continuous power in a non-ven-
tilated enclosed adapter measured at 50
°
C ambient. 2.
Maximum practical continuous power in an open frame
design at 50
°
C ambient. 3. 230 VAC or 100/115 VAC with
doubler.
Typical Circuit
Figure 1. Typical Flyback Application
OUTPUT POWER TABLE
PRODUCT
230VAC
±
15%
(3)
85-265VAC
Adapt-
er
(1)
Open
Frame
(2)
Adapt-
er
(1)
Open
Frame
(2)
FSDL321
11W
17W
8W
12W
FSDH321
11W
17W
8W
12W
FSDL0165RN
13W
23W
11W
17W
FSDM0265RN
16W
27W
13W
20W
FSDH0265RN
16W
27W
13W
20W
FSDL0365RN
19W
30W
16W
24W
FSDM0365RN
19W
30W
16W
24W
FSDL0165RL
13W
23W
11W
17W
FSDM0265RL
16W
27W
13W
20W
FSDH0265RL
16W
27W
13W
20W
FSDL0365RL
19W
30W
16W
24W
FSDM0365RL
19W
30W
16W
24W
Drain
Source
Vstr
Vfb
Vcc
PWM
AC
IN
DC
OUT
Ipk
FSDL0365RN, FSDM0365RN
Green Mode Fairchild Power Switch (FPS
TM
)
FSDL0365RN, FSDM0365RN
2
Internal Block Diagram
Figure 2. Functional Block Diagram of FSDx0365RN
8V/12V
2
6,7,8
1
3
Vref
Internal
Bias
S
Q
Q
R
OSC
Vcc
Vcc
I
delay
I
FB
V
SD
TSD
Vovp
Vcc
Vocp
S
Q
Q
R
R
2.5R
Vcc good
Vcc
Drain
V
FB
GND
AOCP
Gate
driver
5
Vstr
I
start
Vcc good
V
BURL
/V
BURH
LEB
PWM
Soft start
+
-
4
I
pk
Freq.
Modulation
V
BURH
Vcc
I
B_PEAK
Burst
Normal
FSDL0365RN, FSDM0365RN
3
Pin Definitions
Pin Configuration
Figure 3. Pin Configuration (Top View)
Pin Number
Pin Name
Pin Function Description
1
GND
Sense FET source terminal on primary side and internal control ground.
2
Vcc
Positive supply voltage input. Although connected to an auxiliary transform-
er winding, current is supplied from pin 5 (Vstr) via an internal switch during
startup (see Internal Block Diagram section). It is not until Vcc reaches the
UVLO upper threshold (12V) that the internal start-up switch opens and de-
vice power is supplied via the auxiliary transformer winding.
3
Vfb
The feedback voltage pin is the non-inverting input to the PWM comparator.
It has a 0.9mA current source connected internally while a capacitor and op-
tocoupler are typically connected externally. A feedback voltage of 6V trig-
gers over load protection (OLP). There is a time delay while charging
between 3V and 6V using an internal 5uA current source, which prevents
false triggering under transient conditions but still allows the protection
mechanism to operate under true overload conditions.
4
Ipk
Pin to adjust the current limit of the Sense FET. The feedback 0.9mA current
source is diverted to the parallel combination of an internal 2.8k
resistor
and any external resistor to GND on this pin to determine the current limit.
If this pin is tied to Vcc or left floating, the typical current limit will be 2.15A.
5
Vstr
This pin connects directly to the rectified AC line voltage source. At start up
the internal switch supplies internal bias and charges an external storage
capacitor placed between the Vcc pin and ground. Once the Vcc reaches
12V, the internal switch is disabled.
6, 7, 8
Drain
The Drain pin is designed to connect directly to the primary lead of the trans-
former and is capable of switching a maximum of 650V. Minimizing the
length of the trace connecting this pin to the transformer will decrease leak-
age inductance.
1
1
1
1
2
2
2
2
3
3
3
3
4
4
4
4
5
5
5
5
6
6
6
6
7
7
7
7
8
8
8
8
GND
GND
GND
GND
Vcc
Vcc
Vcc
Vcc
Vfb
Vfb
Vfb
Vfb
Ipk
Ipk
Ipk
Ipk
Vstr
Vstr
Vstr
Vstr
Drain
Drain
Drain
Drain
Drain
Drain
Drain
Drain
Drain
Drain
Drain
Drain
8DIP
8DIP
8DIP
8DIP
8LSOP
8LSOP
8LSOP
8LSOP
FSDL0365RN, FSDM0365RN
4
Absolute Maximum Ratings
(Ta=25
°
C, unless otherwise specified)
Note:
1. Repetitive rating: Pulse width limited by maximum junction temperature
2. L = 51mH, starting Tj = 25
°
C
3. L = 13
µ
H, starting Tj = 25
°
C
4. Vsd is shutdown feedback voltage ( see Protection Section in Electrical Characteristics )
Thermal Impedance
Note:
1. Free standing with no heatsink.
2. Measured on the GND pin close to plastic interface.
3. Soldered to 0.36 sq. inch(232mm2), 2 oz.(610g/m2) copper clad.
Characteristic
Symbol
Value
Unit
Drain Current Pulsed
(1)
I
DM
12.0
A
DC
Single Pulsed Avalanche Energy
(2)
E
AS
127
mJ
Maximum Supply Voltage
V
CC,MAX
20
V
Analog Input Voltage Range
V
FB
-0.3 to V
SD
V
Total Power Dissipation
P
D
1.56
W
Operating Junction Temperature.
T
J
+150
°
C
Operating Ambient Temperature.
T
A
-25 to +85
°
C
Storage Temperature Range.
T
STG
-55 to +150
°
C
Parameter
Symbol
Value
Unit
8DIP
Junction-to-Ambient Thermal
JA
(1)
85.74
°
C/W
(3)
Junction-to-Case Thermal
JC
(2)
30.38
°
C/W
FSDL0365RN, FSDM0365RN
5
Electrical Characteristics
(Ta = 25
°
C unless otherwise specified)
Parameter Symbol
Condition
Min.
Typ.
Max.
Unit
Sense FET SECTION
Startup Voltage (Vstr) Breakdown
BV
STR
V
CC
=0V, I
D
=1mA
650
-
-
V
Drain-Source Breakdown Voltage
BV
DSS
V
GS
=0V, I
D
=50
µ
A 650
-
-
V
Off-State Current
(Max.Rating =660V)
I
DSS
V
DS
=660V, V
GS
=0V -
-
50
µ
A
V
DS
=0.8Max.Rating,
V
GS
=0V, T
C
=125
°
C
-
-
200
µ
A
On-State Resistance
(1)
R
DS(ON)
V
GS
=10V, I
D
=0.5A -
3.6
4.5
Input Capacitance
C
ISS
V
GS
=0V, V
DS
=25V,
F=1MHz
-
315
-
pF
Output Capacitance
C
OSS
-
47
-
pF
Reverse Transfer Capacitance
C
RSS
-
9
-
pF
Turn On Delay Time
T
D(ON)
V
DS
=325V, I
D
=1.0A
(Sense FET switching
time is essentially
independent of
operating temperature)
-
11.2 -
ns
Rise Time
T
R
-
34
-
ns
Turn Off Delay Time
T
D(OFF)
-
28.2
-
ns
Fall Time
T
F
-
32
-
ns
CONTROL SECTION
Output Frequency
F
OSC
FSDM0365R
61 67 73 KHz
Output Frequency Modulation
F
MOD
±1.5 ±2.0 ±2.5 KHz
Output Frequency
F
OSC
FSDL0365R
45 50 55 KHz
Output Frequency Modulation
F
MOD
±1.0 ±1.5 ±2.0 KHz
Frequency Change With Temperature
(2)
-
-25
°
C
Ta
85
°
C
-
±5 ±10 %
Maximum Duty Cycle
D
MAX
71
77
83
%
Minimum Duty Cycle
D
MIN
0
0
0
%
Start threshold voltage
V
START
V
FB
=GND 11
12
13
V
Stop threshold voltage
V
STOP
V
FB
=GND 7
8
9
V
Feedback Source Current
I
FB
V
FB
=GND 0.7
0.9
1.1
mA
Internal Soft Start Time
T
S/S
V
FB
=4V 10
15
20
ms
BURST MODE SECTION
Burst Mode Voltages
V
BURH
-
0.4 0.5 0.6 V
V
BURL
-
0.25 0.35 0.45 V
PROTECTION SECTION
Drain to Source Peak Current Limit
I
OVER
Max. inductor current
1.89
2.15
2.41
A
FSDL0365RN, FSDM0365RN
6
Note:
1. Pulse test: Pulse width
300uS, duty
2%
2. These parameters, although guaranteed, are tested in EDS (wafer test) process
3. These parameters, although guaranteed, are not 100% tested in production
Current Limit Delay
(3)
T
CLD
-
500
-
ns
Thermal Shutdown
T
SD
-
125
140 -
°
C
Shutdown Feedback Voltage
V
SD
5.5
6.0
6.5
V
Over Voltage Protection
V
OVP
18
19
-
V
Shutdown Feedback Delay Current
I
DELAY
V
FB
=4V 3.5
5.0
6.5
µ
A
Leading Edge Blanking Time
T
LEB
200 -
-
ns
TOTAL DEVICE SECTION
Operating Current
I
OP
V
CC
=14V 1
3
5
mA
Start Up Current
I
START
V
CC
=0V 0.7
0.85
1.0
mA
Vstr Supply Voltage
V
STR
V
CC
=0V 35
-
-
V
FSDL0365RN, FSDM0365RN
7
Comparison Between KA5x0365RN and FSDx0365RN
Function
KA5x0365RN
FSDx0365RN
FSDx0365RN Advantages
Soft-Start
not applicable
15mS
· Gradually increasing current limit
during soft-start further reduces peak
current and voltage component
stresses
· Eliminates external components used
for soft-start in most applications
· Reduces or eliminates output
overshoot
External Current Limit
not applicable
Programmable of
default current limit
· Smaller transformer
· Allows power limiting (constant over-
load power)
· Allows use of larger device for lower
losses and higher efficiency.
Frequency Modulation
not applicable
±2.0KHz @67KHz
±1.5KHz @50KHz
· Reduced conducted EMI
Burst Mode Operation
not applicable
Yes-built into
controller
· Improve light load efficiency
· Reduces no-load consumption
· Transformer audible noise reduction
Drain Creepage at
Package
1,02mm
7.62mm
· Greater immunity to arcing as a result
of build-up of dust, debris and other
contaminants
FSDL0365RN, FSDM0365RN
8
Typical Performance Characteristics (Sense FET part)
10
0
10
1
10
-1
10
0
10
1
V
GS
Top : 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
Bottom : 5.5 V
Note :

1. 250µs Pulse Test
2. T
C
= 25
I
D
, Dr
ai
n
C
u
r
r
ent [A]
V
DS
, Drain-Source Voltage [V]
0
1
2
3
4
5
6
7
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
V
GS
= 20V
V
GS
= 10V
Note : T
J
= 25
R
DS(
O
N)
[
],
D
r
ain
-
S
ourc
e
On-R
es
i
s
t
a
nc
e
I
D
, Drain Current [A]
0.2
0.4
0.6
0.8
1.0
1.2
1.4
10
-1
10
0
10
1
25
150
Note :

1. V
GS
= 0V
2. 250µ s Pulse Test
I
DR

,
Rev
e
r
s
e D
r
ain Cur
r
ent
[
A
]
V
SD
, Source-Drain Voltage [V]
10
-1
10
0
10
1
100
200
300
400
500
600
700
C
iss
= C
gs
+ C
gd
(C
ds
= shorted)
C
oss
= C
ds
+ C
gd
C
rss
= C
gd
Note ;

1. V
GS
= 0 V
2. f = 1 MHz
C
rss
C
oss
C
iss
Capac
i
t
ances [
p
F]
V
DS
, Drain-Source Voltage [V]
0
2
4
6
8
10
12
0
2
4
6
8
10
12
V
DS
= 325V
V
DS
= 130V
V
DS
= 520V
Note : I
D
= 3.0 A
V
GS
, G
a
te
-S
o
u
r
c
e V
o
l
t
a
ge [V
]
Q
G
, Total Gate Charge [nC]
On-Resistance vs. Drain Current
Source-Drain Diode Forward Voltage
Capacitance vs. Drain-Source Voltage
Gate Charge vs. Gate-Source Voltage
Output Characteristics
FSDL0365RN, FSDM0365RN
9
Typical Performance Characteristics
(Continued)
-50
0
50
100
150
0.90
0.95
1.00
1.05
1.10
1.15
Note :

1. V
GS
= 0 V
2. I
D
= 250 µ A
BV
DSS
, (No
rma
l
i
z
e
d
)
D
r
ai
n-
So
ur
ce
Br
ea
kd
ow
n V
o
lt
ag
e
T
J
, Junction Temperature [
o
C]
-50
0
50
100
150
0.5
1.0
1.5
2.0
2.5
Note :

1. V
GS
= 10 V
2. I
D
= 1.5 A
R
DS
(
O
N)
,
(Nor
m
a
l
i
zed)
D
r
a
i
n-
S
o
ur
ce
O
n
-R
es
i
s
t
a
n
c
e
T
J
, Junction Temperature [
o
C]
Breakdown Voltage vs. Temperature
On-Resistance vs. Temperature
25
50
75
100
125
150
0.0
0.5
1.0
1.5
2.0
I
D
,

Dr
ain C
u
r
r
e
nt [A]
T
C
, Case Temperature [ ]
Max. Safe Operating Area
Max. Drain Current vs. Case Temperature
Thermal Response
10
0
10
1
10
2
10
-3
10
-2
10
-1
10
0
10
1
DC 10 s
1 s
100 ms
10 ms
1 ms
100
µ
s
10
µ
s
Operation in This Area
is Limited by R
DS(on)
I
D
, D
r
ai
n
Cu
r
r
e
nt
[A
]
V
DS
, Drain-Source Voltage [V]
1E-5
1E-4
1E-3
0.01
0.1
1
10
100
1000
0.1
1
10
0.05
0.02
0.01
single pulse
0.2
0.2
0.1
D=0.5
Notes :

1. Z
JC
(t) = 80 /W Max.
2. Duty Factor, D=t
1
/t
2
3. T
JM
- T
C
= P
DM
* Z
JC
(t)
Z
JC
(
t
)
,
Th
er
mal
R
e
spon
se
t
1
, Square Wave Pulse Duration [sec]
FSDL0365RN, FSDM0365RN
10
Typical Performance Characteristics (Control Part)
(
These characteristic graphs are normalized at Ta = 25
°
C)
0.00
0.20
0.40
0.60
0.80
1.00
1.20
-50
0
50
100
150
T emp[]
No
r
m
a
l
iz
ed
Operating Frequency (Fosc)
0.00
0.20
0.40
0.60
0.80
1.00
1.20
-50
0
50
100
150
T emp[]
No
r
m
a
l
iz
ed
Frequency Modulation (F
MOD
)
0.00
0.20
0.40
0.60
0.80
1.00
1.20
-50
0
50
100
150
T emp[]
No
r
m
a
l
i
z
ed
Maximum duty cycle (Dmax)
0.00
0.20
0.40
0.60
0.80
1.00
1.20
-50
0
50
100
150
T emp[]
No
r
m
al
i
zed
Operating supply current (Iop)
0.00
0.20
0.40
0.60
0.80
1.00
1.20
-50
0
50
100
150
T emp[]
No
m
a
lize
d
Start Threshold Voltage (Vstart)
0.00
0.20
0.40
0.60
0.80
1.00
1.20
-50
0
50
100
150
T emp[]
No
r
m
a
l
iz
ed
Stop Threshold Voltage (Vstop)
FSDL0365RN, FSDM0365RN
11
Typical Performance Characteristics
(Continued)
0.00
0.20
0.40
0.60
0.80
1.00
1.20
-50
0
50
100
150
T emp[]
No
r
m
alize
d
Feedback Source Current (Ifb)
0.00
0.20
0.40
0.60
0.80
1.00
1.20
-50
0
50
100
150
T emp[]
No
r
m
alize
d
Peak current limit (Iover)
0.00
0.20
0.40
0.60
0.80
1.00
1.20
-50
0
50
100
150
T emp[]
No
r
m
alize
d
Start up Current (Istart)
0.00
0.20
0.40
0.60
0.80
1.00
1.20
-50
0
50
100
150
T emp[]
No
r
m
alize
d
J-FET Start up current (Istr)
0.00
0.20
0.40
0.60
0.80
1.00
1.20
-50
0
50
100
150
T emp[]
No
r
m
alize
d
Burst peak current (Iburst)
0.00
0.20
0.40
0.60
0.80
1.00
1.20
-50
0
50
100
150
Temp[]
N
o
r
m
al
i
zed
Over Voltage Protection (Vovp)
FSDL0365RN, FSDM0365RN
12
Functional Description
1. Startup : In previous generations of Fairchild Power
Switches (FPS) the Vstr pin had an external resistor to the
DC input voltage line. In this generation the startup resistor
is replaced by an internal high voltage current source and a
switch that shuts off when 15mS goes by after the supply
voltage, Vcc, gets above 12V. The source turns back on if
Vcc drops below 8V.
Figure 4. High voltage current source
2. Feedback Control :
The FSDx0365RN employs current
mode control, shown in figure 5. An opto-coupler (such as
the H11A817A) and shunt regulator (such as the KA431) are
typically used to implement the feedback network. Compar-
ing the feedback voltage with the voltage across the Rsense
resistor plus an offset voltage makes it possible to control the
switching duty cycle. When the reference pin voltage of the
KA431 exceeds the internal reference voltage of 2.5V, the
H11A817A LED current increases, thus pulling down the
feedback voltage and reducing the duty cycle. This event
typically happens when the input voltage is increased or the
output load is decreased.
3. Leading edge blanking (LEB) :
At the instant the internal
Sense FET is turned on, there usually exists a high current
spike through the Sense FET, caused by the primary side
capacitance and secondary side rectifier diode reverse recov-
ery. Excessive voltage across the Rsense resistor would lead
to incorrect feedback operation in the current mode PWM
control. To counter this effect, the FPS employs a leading
edge blanking (LEB) circuit. This circuit inhibits the PWM
comparator for a short time (T
LEB
) after the Sense FET is
turned on.
Figure 5. Pulse width modulation (PWM) circuit
4. Protection Circuit :
The FPS has several protective
func-
tions such as over load protection (OLP), over voltage pro-
tection (OVP), abnormal over current protection (AOCP),
under voltage lock out (UVLO) and thermal shutdown
(TSD). Because these protection circuits are fully integrated
inside the IC without external components, the reliability is
improved without increasing cost. Once the fault condition
occurs, switching is terminated and the Sense FET remains
off. This causes Vcc to fall. When Vcc reaches the UVLO
stop voltage, 8V, the protection is reset and the internal high
voltage current source charges the Vcc capacitor via the Vstr
pin. When Vcc reaches the UVLO start voltage,12V, the FPS
resumes its normal operation. In this manner, the auto-restart
can alternately enable and disable the switching of the power
Sense FET until the fault condition is eliminated.
4.1 Over Load Protection (OLP) :
Overload is defined
as the
load current exceeding a pre-set level due to an unexpected
event. In this situation, the protection circuit should be acti-
vated in order to protect the SMPS. However, even when the
SMPS is in the normal operation, the over load protection
circuit can be activated during the load transition. In order to
avoid this undesired operation, the over load protection cir-
cuit is designed to be activated after a specified time to deter-
mine whether it is a transient situation or an overload
situation. In conjunction with the Ipk current limit pin (if
used) the current mode feedback path would limit the current
in the Sense FET when the maximum PWM duty cycle is
attained. If the output consumes more than this maximum
power, the output voltage (Vo) decreases below the set volt-
age. This reduces the current through the opto-coupler LED,
which also reduces the opto-coupler
transistor current, thus
increasing the feedback voltage (Vfb). If Vfb exceeds 3V, the feed-
back input diode is blocked and the 5uA I
delay
current source starts
to charge Cfb slowly up to Vcc. In this condition, Vfb continues
increasing until it reaches 6V, when the switching operation is ter-
minated as shown in figure 6. The delay time for shutdown is the
time required to charge Cfb from 3V to 6V with 5uA.
Vin,dc
Vin,dc
Vin,dc
Vin,dc
Vstr
Vstr
Vstr
Vstr
Vcc
Vcc
Vcc
Vcc
15m S After UVLO
15m S After UVLO
15m S After UVLO
15m S After UVLO
start(>12V)
start(>12V)
start(>12V)
start(>12V)
off
off
off
off
UVLO <8V
UVLO <8V
UVLO <8V
UVLO <8V
on
on
on
on
Istr
Istr
Istr
Istr
J-FET
J-FET
J-FET
J-FET
3
OSC
Vcc
Vref
2uA
0.9mA
V
SD
R
28R
FB
Gate
driver
OLP
D1
D2
Vfb*
Vfb
431
Cfb
Vo
FSDL0365RN, FSDM0365RN
13
Figure 6. Over load protection
4.2 Thermal Shutdown (TSD) :
The Sense FET and the
con-
trol IC are integrated, making it easier for the control IC to
detect the temperature of the Sense FET. When the tempera-
ture exceeds approximately 140
°
C, thermal
shutdown is acti-
vated.
4.3 Abnormal Over Current Protection (AOCP) :
Figure 7. AOCP Function & Block
Even though the FPS has OLP (Over Load Protection) and
current mode PWM feedback, these are not enough to pro-
tect the FPS when a secondary side diode short or a trans-
former pin short occurs. In addition to start-up, soft-start is
also activated at each restart attempt during auto-restart and
when restarting after latch mode is activated. The FPS has an
internal AOCP (Abnormal Over Current Protection) circuit
as shown in figure 7. When the gate turn-on signal is applied
to the power Sense FET, the AOCP block is enabled and
monitors the current through the sensing resistor. The volt-
age across the resistor is then compared with a preset AOCP
level. If the sensing resistor voltage is greater than the AOCP
level, pulse by pulse AOCP is triggered regardless of uncon-
trollable LEB time. Here, pulse by pulse AOCP stops Sense
FET within 350nS after it is activated.
4.4 Over Voltage Protection (OVP) : In case of malfunc-
tion in the secondary side feedback circuit, or feedback loop
open caused by a defect of solder, the current through the
opto-coupler transistor becomes almost zero. Then, Vfb
climbs up in a similar manner to the over load situation, forc-
ing the preset maximum current to be supplied to the SMPS
until the over load protection is activated. Because excess
energy is provided to the output, the output voltage may
exceed the rated voltage before the over load protection is
activated, resulting in the breakdown of the devices in the
secondary side. In order to prevent this situation, an over
voltage protection (OVP) circuit is employed. In general,
Vcc is proportional to the output voltage and the FPS uses
Vcc instead of directly monitoring the output voltage. If
V
CC
exceeds 19V, OVP circuit is activated resulting in ter-
mination of the switching operation. In order to avoid undes-
ired activation of OVP during normal operation, Vcc should
be properly designed to be below 19V.
5. Soft Start :
The FPS has an internal soft start circuit
that
increases the feedback voltage together with the Sense FET
current slowly after it starts up. The typical soft start time is
15msec, as shown in figure 8, where progressive increments
of Sense FET current are allowed during the start-up phase.
The pulse width to the power switching device is progres-
sively increased to establish the correct working conditions
for transformers, inductors, and capacitors. The voltage on
the output capacitors is progressively increased with the
intention of smoothly establishing the required output volt-
age. It also helps to prevent transformer saturation and
reduce the stress on the secondary diode.
1
t
2
t
3
t
4
t
t
3V
6V
Vcc
8V
Delay current (5uA) charges the Cfb
Delay current (5uA) charges the Cfb
Delay current (5uA) charges the Cfb
Delay current (5uA) charges the Cfb
FPS switching
FPS switching
FPS switching
FPS switching
OLP
Following Vcc
Following Vcc
Following Vcc
Following Vcc
2
.
_
,
8
.
2
,
3
)
1
(
);
)
1
(
1
(
1
1
fig
fb
fb
fb
C
C
K
R
V
t
V
R
t
V
In
RC
t
=
=
=
-
-
=
V
t
V
t
t
V
uA
I
I
t
V
t
t
V
C
t
delay
delay
fb
3
)
1
(
)
2
1
(
,
5
;
))
1
(
)
2
1
(
(
2
=
-
+
=
-
+
=
R
S
Q
Vsense
Vfb
Out Driver
Rsense
CLK
Drain
V
AOCP
PWM
COMPARATOR
AOCP
COMPARATOR
LEB
1mS
15steps
Current limit
0.98A
2.15A
t
Drain current
[A]
FSDL0365RN, FSDM0365RN
14
Figure 8. Soft Start Function
6. Burst operation :
In order to minimize power
dissipation in
standby mode, the FPS enters burst mode
operation.
Figure 9. Circuit for Burst operation
As the load decreases, the feedback voltage decreases. As shown in
figure 10, the device automatically enters burst mode when the
feedback voltage drops below V
BURH
(500mV). Switching still con-
tinues but the current limit is set to a fixed limit internally to mini-
mize flux density in the transformer. The fixed current limit is
larger than that defined by Vfb = V
BURH
and therefore, Vfb is
driven down further.
Switching continues until
the feedback
voltage drops below V
BURL
(300mV). At
this point switching
stops and the output voltages start to drop at a rate dependent
on the standby current load. This causes the feedback volt-
age to rise. Once it passes
V
BURH
(500mV) switching resumes.
The feedback
voltage then falls and the process repeats. Burst
mode operation alternately enables and disables switching of
the power Sense FET thereby reducing switching loss in
Standby mode.
Figure 10. Circuit for Burst Operation
7. Frequency Modulation : EMI reduction can be accom-
plished by modulating the switching frequency of a switched
power supply. Frequency modulation can reduce EMI by
spreading the energy over a wider frequency range than the
band width measured by the EMI test equipment. The
amount of EMI reduction is directly related to the depth of
the reference frequency. As can be seen in Figure 11, the fre-
quency changes from 65KHz to 69KHz in 4mS for the
FSDM0265RN. Frequency modulation allows the use of a
cost effective inductor instead of an AC input mode choke to
satisfy the requirements of world wide EMI limits.
Figure 11. Frequency Modulation Waveform
D R A I N
D R A I N
D R A I N
D R A I N
G N D
G N D
G N D
G N D
R s e n s e
I_ o v e r
S W IT C H
O F F
5 V
3
Vcc
Vcc
I
delay
I
FB
R
2.5R
FB
0.3/0.5V
PWM
+
-
0.5V
Vcc
I
B_PEAK
Burst
Normal
MOSFET
MOSFET
MOSFET
MOSFET
Current
Current
Current
Current
0.5V
Switching OFF
Current
waveform
Burst Operation
Normal Operation
Feedback
0.3V
Burst Operation
Switching OFF
69kH z
69kH z
67kH z
65kH z
4k H z
Turn-on
Turn-off
point
Internal
O scillator
D rain to
S ourc e
voltage
V ds
W aveform
D rain to
S ource
current
FSDL0365RN, FSDM0365RN
15
Figure 12. KA5-series FPS Full Range EMI scan(67KHz,
no Frequency Modulation) with DVD Player SET
Figure 13. FSDX-series FPS Full Range EMI Scan (67KHz,
with Frequency Modulation) with DVD Player SET
8. Adjusting Current limit function:
As shown in fig
14, a
combined 2.8K
internal resistance is connected into the
non-inverting lead on the PWM comparator. A external
resistance of Y on the current limit pin forms a parallel resis-
tance with the 2.8K
when the internal diodes are biased by
the main current source of 900uA.
Figure 14. Peak current adjustment
For example, FSDx0265RN has a typical Sense FET
current
limit (I
OVER
) of 2.15A. The Sense FET current
can be limited to
1A by inserting a 2.8k
between the current limit pin and
ground which is derived from the following equations:
2.15: 1 = 2.8K
: XK
,
X = 1.3K
,
Since X represents the resistance of the parallel network, Y
can be calculated using the following equation:
Y = X / (1 - (X/2.8K
))
Frequency (MHz)
Am
p
litu
d
e
(d
B
µ
V)
CISPR2QB
CISPR2AB
Frequency (MHz)
A
m
p
litu
d
e
(d
B
µ
V)
CISPR2QB
CISPR2AB
3
4
PWM
comparator
SenseFET
Sense
K
2
K
8
.
0
AK
900uA
5uA
Rsense
Feed
Back
Current
Limit
FSDL0365RN, FSDM0365RN
16
Typical application circuit
1. Set Top Box Example Circuit (20W Output Power)
FSDM0365RN
1
5
D D
D
S VccVfb
C7
400V
/47u
D5
UF4007
R1
47K
D6
UF4004
C9
33n
50V
I_pk
start
C8
6.8n/
1kV
R4
30R
C6
50V
47uF
D15
SB360
D14
D13
EGP20D
D12
PC817
FOD2741A
L1
L2
L3
C11
C12
+3.3V
+5.0V
+17.0V
+23.0V
0.4~1.4A
0.2~0.85A
0.01~0.5A
0.005~0.45A
C13
C15
C17
C16
C14
1000uF
/16V
470uF
/10V
1000uF
/16V
470uF
/10V
470uF
/35V
220uF
/35V
100uF
/50V
100uF
/50V
R21
R14
R13
R15
330R
800R
6.9K
R12
2.7K
1.5K
C209
0.1uF/
monolithic
LF1
40mH
KBP06M
100pF
/400V
100pF
/400V
C2
C1
2A/250V
FUSE
85VAC
~275VAC
56K/1/
4W
R3
Q1
R19
R20
PC817
TL431AZ
EGP20D
EGP20D
1
3
4
5
8
6
10
11
12
PERFORMANCE SUMMARY
Output Power: 20W
Regulation
3.3V: ±5%
5.0V: ±5%
17.0V: ±7%
23.0: ±7%
Efficiency: 75%
No load Consumption:
0.12W at 230Vac
GreenFPS
R5
6kR
R15
20R
R22
1KR
Figure15. 20W multiple power supply using FSDM0365RN
Multiple Output, 20W, 85-265VAC Input Power supply:
Figure 15 shows a multiple output supply typical for high
end set-top boxes containing high capacity hard disks for
recording or LIPS(LCD Inverter Power Supply) for 15"
LCD monitor. The supply delivers an output power of 20W
cont./24 W peak (thermally limited) from an input voltage of
85 to 265 VAC. Efficiency at 20W, 85VAC is
75%.
The 3.3 V and 5 V outputs are regulated to ±5% without the
need for secondary linear regulators. DC stacking (the sec-
ondary winding reference for the other output voltages is
connected to the anode of D15. For more accuracy, connec-
tion to the cathode of D15 will be better.) is used to minimize
the voltage error for the higher voltage outputs. Due to the
high ambient operating temperature requirement typical of a
set-top box (60
°
C) the FSDL0165RN is used to reduce con-
duction losses without a heatsink. Resistor R5 sets the device
current limit to limit overload power.
Leakage inductance clamping is provided by R1 and C8,
keeping the DRAIN voltage below 650 V under all condi-
tions. Resistor R1 and capacitor C8 are selected such that R1
dissipates power to prevent rising of DRAIN Voltage caused
by leakage inductance. The frequency modulation feature of
FSDL0165RN allows the circuit shown to meet CISPR2AB
with simple EMI filtering (C1, LF1 and C2) and the output
grounded. The secondaries are rectified and smoothed by
D12, D13, D14,and D15. Diode D15 for the 3.4V output is a
Schottky diode to maximize efficiency. Diode D14 for the 5
V output is a PN type to center the 5 V output at 5 V. The 3.3
V and 5 V output voltage require two capacitors in parallel to
meet the ripple current requirement. Switching noise filter-
ing is provided by L3, L2 and L1. Resistor R15 prevents
peak charging of the lightly loaded 23V output. The outputs
are regulated by the reference (TL431) voltage in secondary.
Both the 3.3 V and 5 V outputs are sensed via R13 and R14.
Resistor R22 provides bias for TL431and R21 sets the over-
all DC gain. Resistor R21, C209, R14 and R13 provide loop
compensation.
FSDL0365RN, FSDM0365RN
17
2. Transformer Specification
1. TRANSFORM ER
SPECIFICATION

- SCHEM ATIC DIAG RAM (TRANSFORM ER)

















2. WINDING
SPECIFIC ATIO N
NO.
PIN(S
F)
W IRE
TURNS
W INDING METHOD
N
P/2
3 2
0.25 × 1
22
SOLENOID W INDING
N
3.3V
6 8
0.3 × 8
2
STACK W INDING
N
5V
10 6
0.3 × 2
1
STACK W INDING
N
16V
11 6
0.3 × 4
7
SOLENOID W INDING
N
23V
12 11
0.3 × 2
3
SOLENOID W INDING
N
P/2
2
1
0.25 × 1
22
SOLENOID W INDING
N
B
4
5
0.25 × 1
10
CENTER W INDING
3. ELECTRIC CHAR ACTERISTIC

CLOSURE
PIN
SPEC.
REMARKS
INDUCTANCE
1 - 3
800uH ± 10%
1KHz, 1V
LEAKAGE L
1 - 3
15uH MAX.
2nd ALL SHORT


4. BOBBIN & CORE.

CORE: EER2828
BOBBIN: EER2828
N
P/2
N
3.3V
N
P/2
N
B
3mm
6mm
bottom
top
N
5V
N
23V
N
17V
1
2
3
4
5
6
7
8
10
11
12
FSDL0365RN, FSDM0365RN
18
Layout Considerations
Figure 15. Layout Considerations for FSDx0365RN using 8DIP
#1 : GND
#2 : VCC
#3 : Vfb
#4 : Ipk
#5 : Vstr
#6 : Drain
#7 : Drain
#8 : Drain
SURFACE MOUNTED
COPPER AREA FOR HEAT
SINKING
Y1-
CAPACITOR
+
-
DC
OUT
DC_link Capacitor
FSDL0365RN, FSDM0365RN
19
Package Dimensions
8DIP
FSDL0365RN, FSDM0365RN
20
Package Dimensions
(Continued)
8LSOP
FSDL0365RN, FSDM0365RN
21
Ordering Information
Product Number
Package
Marking Code
BV
DSS
F
OSC
R
DS(on)
FSDM0365RN
8DIP
DM0365R
650V
67KHz
3.6
FSDL0365RN
8DIP
DL0365R
650V
50KHz
3.6
FSDM0365RL
8LSOP
DM0365R
650V
67KHz
3.6
FSDL0365RL
8LSOP
DL0365R
650V
50KHz
3.6
FSDL0365RN, FSDM0365RN
6/17/04 0.0m 001
2004 Fairchild Semiconductor Corporation
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OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
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PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
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