ChipFind - Datasheet

Part Number FDC6331L

Download:  PDF   ZIP
August 2001
©
2001 Fairchild Semiconductor Corporation
FDC6331L Rev C(W)
FDC6331L
Integrated Load Switch
General Description
This device is particularly suited for compact power
management in portable electronic equipment where
2.5V to 8V input and 2.8A output current capability are
needed. This load switch integrates a small N-Channel
power MOSFET (Q1) that drives a large P-Channel
power MOSFET (Q2) in one tiny SuperSOT
T M
-6
package.
Applications
·
Load switch
·
Power management
Features
·
­2.8 A, ­8 V. R
DS(ON)
= 55 m
@ V
GS
= ­4.5 V
R
DS(ON)
= 70 m
@ V
GS
= ­2.5 V
R
DS(ON)
= 100 m
@ V
GS
= ­1.8 V
·
Control MOSFET (Q1) includes Zener protection for
ESD ruggedness (>6KV Human body model)
·
High performance trench technology for extremely
low R
DS(ON)

D1
S2
G1
D2
S1
G2
SuperSOT -6
TM
Pin 1
SuperSOTTM-6
3
2
1
4
5
6
Q1
Q2
Vout,C1
Vout,C1
R2
Vin,R1
ON/OFF
R1,C1
See Application Circuit
Equivalent Circuit
V
DROP
+
­
IN
OUT
ON/OFF
Absolute Maximum Ratings
T
A
=25
o
C unless otherwise noted
Symbol
Parameter
Ratings
Units
V
IN
Maximum Input Voltage
±
8
V
V
ON/OFF
High level ON/OFF voltage range
­0.5 to 8
V
I
Load
Load Current ­ Continuous
(Note 1)
­2.8
A
­ Pulsed
­9
P
D
Maximum Power Dissipation
(Note 1)
0.7
W
T
J
, T
STG
Operating and Storage Junction Temperature Range
­55 to +150
°
C
Thermal Characteristics
R
JA
Thermal Resistance, Junction-to-Ambient
(Note 1)
180
°
C/W
R
JC
Thermal Resistance, Junction-to-Case
(Note 1)
60
°
C/W
Package Marking and Ordering Information
Device Marking
Device
Reel Size
Tape width
Quantity
.
331
FDC6331L
7''
8mm
3000 units
FDC6331L
FDC6331L Rev C(W)
Electrical Characteristics
T
A
= 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max Units
Off Characteristics
BV
IN
Vin Breakdown Voltage
V
ON/OFF
= 0 V, I
D
= ­250
µ
A
8
V
I
Load
Zero Gate Voltage Drain Current
V
IN
= 6.4 V, V
ON/OFF
= 0 V
­1
µ
A
I
FL
Leakage Current, Forward
V
ON/OFF
= 0 V, V
IN
= 8 V
­100
nA
I
RL
Leakage Current, Reverse
V
ON/OFF
= 0 V, V
IN
= ­8 V
100
nA
On Characteristics
(Note 2)
V
ON/OFF (th)
Gate Threshold Voltage
V
IN
= V
ON/OFF
, I
D
= ­250
µ
A
0.4
0.9
1.5
V
R
DS(on)
Static Drain­Source
On­Resistance (Q2)
V
IN
= 4.5 V,
I
D
= ­2.8A
V
IN
= 2.5 V,
I
D
= ­2.5 A
V
IN
= 1.8 V,
I
D
= ­2.0 A
34
45
64
55
70
100
m
R
DS(on)
Static Drain­Source
On­Resistance (Q1)
V
IN
= 4.5 V,
I
D
= 0.4A
V
IN
= 2.7 V,
I
D
= 0.2 A
3.1
3.8
4
5
Drain­Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain­Source Diode Forward Current
­0.6
A
V
SD
Drain­Source Diode Forward
Voltage
V
ON/OFF
= 0 V, I
S
= ­0.6 A
(Note 2)
­1.2
V
Notes:
1. R
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting
surface of the drain pins. R
JC
is guaranteed by design while R
JA
is determined by the user's board design.
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
FDC6331L Load Switch Application Circuit
Q2
Q1
R1
IN
OUT
ON/OFF
LOAD
C1
R2
External Component Recommendation:
For additional in-rush current control, R2 and C1 can be added. For more information, see application note AN1030.
FDC6331L
FDC6331L Rev C(W)
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0
1
2
3
4
5
6
-I
L
, (A)
-V
DROP
, (V)
T
J
= 25
O
C
T
J
= 125
O
C
V
IN
= -1.8V
V
ON/OFF
= -1.5V -8V
PW = 300us, D < 2%
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0
1
2
3
4
5
6
-I
L
, (A)
-V
DROP
, (V)
T
J
= 25
O
C
T
J
= 125
O
C
V
IN
= -2.5V
V
ON/OFF
= -1.5V -8V
PW = 300us, D < 2%
Figure 1. Conduction Voltage Drop
Variation with Load Current.
Figure 2. Conduction Voltage Drop
Variation with Load Current.
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0
1
2
3
4
5
6
-I
L
, (A)
-V
DROP
, (V)
V
IN
= -4.5V
V
ON/OFF
= -1.5V -8V
PW = 300us, D < 2%
T
J
= 125
O
C
T
J
= 25
O
C
0
0.025
0.05
0.075
0.1
0.125
0.15
1
2
3
4
5
-V
IN
, INPUT VOLTAGE (V)
R
DS(ON)
, ON-RESISTANCE (
)
T
J
= 25
O
C
T
J
= 125
O
C
I
L
= -1A
V
ON/OFF
= -1.5V -8V
PW = 300us, D
<
2%
Figure 3. Conduction Voltage Drop
Variation with Load Current.
Figure 4. On-Resistance Variation
With Input Voltage
0.01
0.1
1
0.0001
0.001
0.01
0.1
1
10
100
1000
r(t), NORMALIZED EFFECTIVE
TRANSIENT THERMAL RESISTANCE
R
JA
(t) = r(t) + R
JA
R
JA
= 156 °C/W
T
J
- T
A
= P * R
JA
(t)
Duty Cycle, D = t
1
/ t
2
P(pk)
t
1
t
2
SINGLE PULSE
0.01
0.02
0.05
0.1
0.2
D = 0.5
FDC6331L
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
OPTOLOGICTM
OPTOPLANARTM
PACMANTM
POPTM
Power247TM
PowerTrench
QFETTM
QSTM
QT OptoelectronicsTM
Quiet SeriesTM
SILENT SWITCHER
FAST
FASTrTM
FRFETTM
GlobalOptoisolatorTM
GTOTM
HiSeCTM
ISOPLANARTM
LittleFETTM
MicroFETTM
MicroPakTM
MICROWIRETM
Rev. H4
®
ACExTM
BottomlessTM
CoolFETTM
CROSSVOLT
TM
DenseTrenchTM
DOMETM
EcoSPARKTM
E
2
CMOS
TM
EnSigna
TM
FACTTM
FACT Quiet SeriesTM
SMART STARTTM
STAR*POWERTM
StealthTM
SuperSOTTM-3
SuperSOTTM-6
SuperSOTTM-8
SyncFETTM
TinyLogicTM
TruTranslationTM
UHCTM
UltraFET
®
®
®
STAR*POWER is used under license
VCXTM