Edition 1.1
July 2004

Driver Integrated 10Gb/s
MI-DFB LD Module

FTM1141GF-C

Parameter

Condition

Symbol

Operating Case Temperature

Top(Tc)

°C

Modulator (Mod) Modulation
Control Voltage

Mod Bias Control Voltage

Power Supply Voltage

Vss

Laser Forward Current

Laser Reverse Voltage

Storage Temperature

Tstg

°C

Differential

(AC-coupled)

Data Input Voltage

Din, DinB

Vpp

Note (1-1)

ESD Tolerance

Vesd

Note (1-2)

ESD Tolerance

Vesd

Photodiode Forward Current

Photodiode Reverse Voltage

VDR

260

°C MAX

Lead Soldering Time

sec

Cooling

Heating

TEC Voltage

Cooling

Heating

TEC Current

Tth

Thermistor Temperature

°C

Optical Output Power

Unit

ABSOLUTE MAXIMUM RATINGS (Top=25

°C, Unless otherwise specified)

Limits

-6.5

-40

ATC operation

-1.0

-0.5

Min.

Vss-4.8

(min-6.5)

Cross Point Control Voltage

Vx1,(Vx2)

Vss+1.2

(max0)

Vss+2.4

(max0)

150

1.6

200

2.5

1.5

+75

Max.

Vss+2.4

(max0)

FEATURES

· Driver integrated 10Gb/s MI-DFB module for 1600ps/nm

optical transmission

· MI-DFB-LD (Modulator Integrated DFB Laser Diode) is installed
· Modulator driver IC is installed
· Built-in optical isolator, PIN-Photo diode for monitor, thermistor

and thermo-electric cooler

· 1600ps/nm (80km)

DESCRIPTION

The FTM1141GF-C was developed to reduce the size and technical
complexity of 10Gb/s optical board designs. This product, which includes
a driver and modulator integrated laser in one package, eliminates the
customer concerns regarding how to handle the RF interfacing between
these two components on his board. By co-packaging these components
a solution has also been achieved that offers greatly reduced board space.
This reduction in space is critical for next generation transponder applications.
The FTM1141GF-C has been designed with a differential co-planar electrical interface
which allows for easy interfacing to RF lines on PC boards. The package and pinout are part of a
multi-source agreement. This product is designed for 80km SONET/SDH applications and single
channel drop links in DWDM systems.

Parameter

Limit

LASER DIODE AND MODULATOR CHARACTERSITICS

OPTICAL SPECIFICATIONS (TLD=25°C, Top=0 to 75°C and BOL, unless otherwise specified)

Unit

Symbol

Condition

Min.

Max.

Typ.

Optical Output Power

dBm

Pop

+1.0

+3.5

Note (2a)

Forward Voltage

2.2

1.4

CW, IF=Iop

Extinction Ratio

Rext

9.0

Pf=Pop, Note (2a)

Peak Wavelength

1530

1565

Pf=Pop, Note (2a)

Side Mode Suppresion
Ratio

SSR

IF=Pop, CW

Optical Rise Time

psec

Note (3), 20% to 80%

Optical Fall Time

psec

Note (3), 20% to 80%

Optical Isolation

Tracking Error

-0.5

+0.5

Note (2a)

Input Return Loss

S11

130KHz to 10GHz

Dispersion Penalty

2.0

Note (2)

Eye Pattern Mask

Msk

Error Free

Note (2a), 500 counts

Threshold Current

Ith

Pf=Pop

Operating Current

Iop

100

Parameter

Limit

MONITOR DIODE CHARACTERISTICS

Unit

Symbol

Condition

Min.

Max.

Typ.

Monitor Diode Capacitance

VDR=5V, f=1MHz

IF=Iop, VDR=5V

Monitor Current

µA

100

1500

VDR=5V

Monitor Dark Current

100

Parameter

Limit

TEC & THERMISTOR CHARACTERISTICS

Unit

Symbol

Condition

Min.

Max.

Typ.

TEC Power Consumption

2.0

Note (4)

Thermistor Resistance

Rth

TLD=25

°C

25/75

°C

Thermistor B Constant

3270

3630

3450

Note (4)

TEC Current

1.0

Note (4)

TEC Voltage

2.0

Driver Integrated 10Gb/s
MI-DFB LD Module

FTM1141GF-C

Driver Integrated 10Gb/s
MI-DFB LD Module

FTM1141GF-C

Parameter

Limit

DRIVER IC CHARACTERISTICS

Unit

Symbol

Condition

Vpp

Min.

Max.

Typ.

Modulator (Mod) Modulation
Control Voltage

Vss

+1.0

Mod Bias Control Voltage

Vss

+2.2

Differential (AC Coupled)

Data Input Voltage

Din, DinB

0.5

1.0

Xp=50%

Cross Point (XP) Control
Voltage

Vx1, (Vx2)

Vss

+0.8

Vss

+2.2

Driver IC Supply Voltage

Vss

-5.5

-4.9

-5.2

Driver IC Supply Current

Iss

285

Note (1-1): Pin No. 3,4,5,6,7,9,11 (Human Body Model)
Note (1-2): Pin No. 1,2,8,10,12-19 (Human Body Model)
Note (2): Eudyna Test System

(a) Drive Condition

Bit Rate:

9.95328 Gb/s

Word Pattern:

PRBS=2

-1

Mark Density:

50%

Laser Bias Current:

Iop

Laser Temperature(TLD):

°C

Eye Pattern Mask:

ITU-T Eye mask for STM-64

(b) Fiber Dispersion

1600ps/nm

Bit Error Rate=10

-12

Note (3): Eudyna Test System

Vb, Vm, Vx1(Vx2) is set to make Pop and Rext within the specification

Note (4): Eudyna Test System

Operating Case Temperature: Top=+75°C
Laser Temperature:

°C

Optical Output Power:

Pf=Pop, Note (2a)

Typical Output Waveform

Back to Back (with Filter)

9.95328Gb/s, NRZ, PRBS=2

-1, TLD=TC=25°C

Driver Integrated 10Gb/s
MI-DFB LD Module

FTM1141GF-C

TEC

GND

Blocking

Capacitor
Ex. 0.1µF

Din

GND

DinB

GND

Vx1

Vx2

Cross Point Control

Bias Voltage Control

Supply Voltage

Modulation Voltage Control

VSS

Ther r

TEC

Chip

Capacitor

0.1µF

Chip

Capacitor

0.1µF

Typical Application for Driver IC

For stable operation:

8-1. To prevent a dependence of "Cross point" on the supply voltage VSS,

(1) Use an external voltage source of -3.8V for "Vx2", or
(2) Control the voltage of "Vx1", so that the voltage difference "Vx1-Vx2" remain constant.

8-2. To prevent a dependence of "Modulation control voltage" on the supply voltage VSS,

control the voltage of "Vm", so that the difference "Vm-VSS" remain constant.

8-3. To prevent a dependence of "Bias control voltage" on the supply voltage VSS,

control the voltage of "Vb", so that the difference "Vb-VSS" remain constant.

14-0.3

6.00

±0.25

5-0.15

0.08

4.95

22.0

18.0

12.0

Ø0.9

0.1

Ø5.20

0.25

4-Ø2.6

±0.2

NOTE: Pigtail length (L)
shall be specified in the
detail (individual) specification.

CONNECTOR

DETAIL-B

5.3

17.6

Detail A

Detail B

13.6

9.6

25.0

±0.5

1.25

(3)

0.5

7.7

14-0.2

4.86

±0.20

1.25

4.56

4.46

0.20

3.56

5-0.3

4-P1.0

4.00

0.25

Pin Description

1. Thermoelectric cooler(Anode, +)
2. Thermistor
3. Vb: Modulator bias control voltage
4. Vm: Modulator modulation voltage control voltage
5. Vss: Driver IC supply voltage
6. Vx2: Cross point control voltage
7. Vx1: Cross point control voltage
8. Case Ground
9. DinB: Inverted data input voltage
10. Case Ground
11. Din: Data Input voltage
12. Case Ground
13. Monitor photo diode(Cathode)
14. Monitor photo diode(Anode)
15. Case Ground
16. LD Bias(Anode)
17. NC
18. NC
19. Thermoelectric cooler(Cathode, -)

12-P1.0

5.8

DETAIL-A

"GF" PACKAGE

UNIT: mm

Driver Integrated 10Gb/s
MI-DFB LD Module

FTM1141GF-C

Eudyna Devices Inc. products contain gallium arsenide
(GaAs) which can be hazardous to the human body and the environment.
For safety, observe the following procedures:

CAUTION

· Do not put this product into the mouth.

· Do not alter the form of this product into a gas, powder, or liquid

through burning, crushing, or chemical processing as these by-products
are dangerous to the human body if inhaled, ingested, or swallowed.

· Observe government laws and company regulations when discarding this

product. This product must be discarded in accordance with methods
specified by applicable hazardous waste procedures.

For further information please contact:

Eudyna Devices USA Inc.

2355 Zanker Rd.
San Jose, CA 95131-1138, U.S.A.
TEL: (408) 232-9500
FAX: (408) 428-9111

www.us.eudyna.com

Eudyna Devices Europe Ltd.

Network House
Norreys Drive
Maidenhead, Berkshire SL6 4FJ
United Kingdom
TEL: +44 (0) 1628 504800
FAX: +44 (0) 1628 504888

Eudyna Devices Asia Pte Ltd.

Hong Kong Branch

Rm. 1101, Ocean Centre, 5 Canton Rd.
Tsim Sha Tsui, Kowloon, Hong Kong
TEL: +852-2377-0227
FAX: +852-2377-3921

Eudyna Devices Inc.

Sales Division
1, Kanai-cho, Sakae-ku
Yokohama, 244-0845, Japan
TEL: +81-45-853-8156
FAX: +81-45-853-8170

Eudyna Devices Inc. reserves the right to change products and specifications
without notice. The information does not convey any license under rights of
Eudyna Devices Inc. or others.

Part Number FTM1141GF-C