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Part Number FLM1213-12F

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1
Edition 1.3
August 2004
FLM1213-12F
X, Ku-Band Internally Matched FET
Item
Drain-Source Voltage
Gate-Source Voltage
Total Power Dissipation
Storage Temperature
Channel Temperature
Symbol
VDS
VGS
15
-5
57.6
-65 to +175
175
Tc = 25°C
V
V
W
°C
°C
PT
Tstg
Tch
Condition
Unit
Rating
ABSOLUTE MAXIMUM RATING (Ambient Temperature Ta=25
°C)
Fujitsu recommends the following conditions for the reliable operation of GaAs FETs:
1. The drain-source operating voltage (VDS) should not exceed 10 volts.
2. The forward and reverse gate currents should not exceed 34.0 and -5.0 mA respectively with
gate resistance of 50
.
Item
Saturated Drain Current
Transconductance
Pinch-off Voltage
Gate Source Breakdown Voltage
Output Power at 1dB G.C.P.
Power Gain at 1dB G.C.P.
Symbol
IDSS
-
6000
9000
-0.5
-1.5
-3.0
39.5
40.5
-
4.5
5.5
-
VDS = 5V, IDS = 300mA
VDS = 5V, IDS = 3600mA
VDS = 5V, VGS = 0V
IGS = -340µA
VDS = 10V
f = 12.7 ~ 13.2 GHz
IDS = 0.6 IDSS(Typ.)
ZS = ZL = 50
mA
V
-
5000
-
mS
-5
-
-
V
dB
dBm
gm
Vp
VGSO
P1dB
G1dB
Drain Current
-
3600
4500
mA
Idsr
Power-Added Efficiency
-
24
-
%
add
Gain Flatness
-
-
±0.6
dB
G
Thermal Resistance
Channel to Case
-
2.3
2.6
°C/W
CASE STYLE: IB
Rth
3rd Order Intermodulation
Distortion
f = 13.2GHz,
f = 10MHz
2-Tone Test
Pout = 28dBm S.C.L.
-42
-45
-
dBc
IM3
Test Conditions
Unit
Limit
Typ.
Max.
Min.
ELECTRICAL CHARACTERISTICS (Ambient Temperature Ta=25
°C)
G.C.P.: Gain Compression Point
10V x Idsr x Rth
Channel Temperature Rise
-
-
80
°C
Tch
FEATURES
· High Output Power: P1dB = 40.5dBm (Typ.)
· High Gain: G1dB = 5.5dB (Typ.)
· High PAE:
add = 24% (Typ.)
· IM3 = -45dBc@Po = 28dBm
· Broad Band: 12.7 ~ 13.2GHz
· Impedance Matched Zin/Zout = 50
· Hermetically Sealed
DESCRIPTION
The FLM1213-12F is a power GaAs FET that is internally matched for
standard communication bands to provide optimum power and gain in a
50 ohm system.
Eudyna's stringent Quality Assurance Program assures the highest
reliability and consistent performance.
2
FLM1213-12F
X, Ku-Band Internally Matched FET
POWER DERATING CURVE
50
0
100
150
200
Case Temperature (
°C)
60
45
30
15
Total Power Dissipation (W)
OUTPUT POWER & IM3 vs. INPUT POWER
VDS=10V
f1 = 13.2 GHz
f2 = 13.21 GHz
2-tone test
17
15
21
19
23
27
29
25
Input Power (S.C.L.) (dBm)
S.C.L.: Single Carrier Level
Output Power (S.C.L.) (dBc)
-20
-10
-30
-40
-50
25
23
21
27
31
33
35
29
IM
3
(dBc)
IM3
Pout
26
28
30
32
34
36
32
34
36
38
40
20
10
30
Input Power (dBm)
Output Power (dBm)
add (%)
add
Pout
OUTPUT POWER vs. INPUT POWER
VDS = 10V
f = 12.95 GHz
12.7
12.8
12.9
13.0
13.1
13.2
34
32
36
38
40
Frequency (GHz)
Output Power (dBm)
OUTPUT POWER vs. FREQUENCY
VDS = 10V
P1dB
Pin = 36dBm
32dBm
30dBm
28dBm
26dBm
3
FLM1213-12F
X, Ku-Band Internally Matched FET
+j250
+j100
+j50
+j25
+j10
0
-j10
-j25
-j50
-j100
-j250
S11
S22
180
°
+90
°
0
°
-90
°
S21
S12
SCALE FOR |S21|
SCALE FOR |S
12
|
0.2
0.1
1
2
3
4
5
250
100
50
13.4 GHz
13.2
13.2
13.3
13.0
13.1
12.8
12.8
12.7
12.7
12.9
12.6
12.5
12.5
13.4 GHz
13.4 GHz
13.2
13.2
13.3
13.0
13.0
13.1
12.9
12.8
12.8
12.7
12.7
12.6
10
12.5
12.5
13.4 GHz
S-PARAMETERS
VDS = 10V, IDS = 3600mA
FREQUENCY
S11
S21
S12
S22
(MHZ)
MAG
ANG
MAG
ANG
MAG
ANG
MAG
ANG
12500
.511
-86.9
1.787
16.5
.080
-2.7
.531
-110.8
12600
.474
-101.9
1.891
4.5
.089
-15.2
.497
-121.6
12700
.435
-118.0
1.995
-8.2
.098
-27.4
.460
-132.6
12800
.400
-134.6
2.092
-21.1
.104
-40.6
.414
-144.1
12900
.360
-152.2
2.192
-34.1
.112
-54.4
.362
-158.1
13000
.324
-171.0
2.283
-47.9
.120
-68.6
.298
-175.0
13100
.290
168.5
2.341
-62.2
.127
-82.8
.229
164.7
13200
.249
147.6
2.386
-77.2
.132
-97.1
.164
133.3
13300
.212
125.2
2.369
-91.4
.136
-111.6
.127
82.9
13400
.172
100.6
2.343
-106.4
.134
-126.6
.169
34.4
4
FLM1213-12F
X, Ku-Band Internally Matched FET
2-R 1.6
±0.15
(0.063)
0.6
(0.024)
10.7
(0.421)
12.0
(0.422)
17.0
±0.15
(0.669)
21.0
±0.15
(0.827)
12.9
±
0.2
(0.508)
2.0 Min.
(0.079)
2.0 Min.
(0.079)
0.2 Max.
(0.008)
1.45
(0.059)
Case Style "IB"
Metal-Ceramic Hermetic Package
Unit: mm(inches)
1. Gate
2. Source (Flange)
3. Drain
5.2 Max.
(0.205)
2.6
±0.15
(0.102)
0.1
(0.004)
1
2
3
Eudyna Devices Inc. products contain gallium arsenide
(GaAs)
which can be hazardous to the human body and the environment.
For safety, observe the following procedures:
CAUTION
· Do not put this product into the mouth.
· Do not alter the form of this product into a gas, powder, or liquid
through burning, crushing, or chemical processing as these by-products
are dangerous to the human body if inhaled, ingested, or swallowed.
· Observe government laws and company regulations when discarding this
product. This product must be discarded in accordance with methods
specified by applicable hazardous waste procedures.
For further information please contact:
Eudyna Devices USA Inc.
2355 Zanker Rd.
San Jose, CA 95131-1138, U.S.A.
TEL: (408) 232-9500
FAX: (408) 428-9111
www.us.eudyna.com
Eudyna Devices Europe Ltd.
Network House
Norreys Drive
Maidenhead, Berkshire SL6 4FJ
United Kingdom
TEL: +44 (0) 1628 504800
FAX: +44 (0) 1628 504888
Eudyna Devices Asia Pte Ltd.
Hong Kong Branch
Rm. 1101, Ocean Centre, 5 Canton Rd.
Tsim Sha Tsui, Kowloon, Hong Kong
TEL: +852-2377-0227
FAX: +852-2377-3921
Eudyna Devices Inc.
Sales Division
1, Kanai-cho, Sakae-ku
Yokohama, 244-0845, Japan
TEL: +81-45-853-8156
FAX: +81-45-853-8170
Eudyna Devices Inc. reserves the right to change products and specifications
without notice. The information does not convey any license under rights of
Eudyna Devices Inc. or others.
© 2004 Eudyna Devices USA Inc.
Printed in U.S.A.