Microwave Ceramics and Modules
Filter
2 Pole Filter for W-LAN 5GHz / [5.15-5.35] Band
B69842N5257A202
Preliminary Data Sheet
ISSUE DATE
18.03.04
ISSUE
P2
PUBLISHER
SAW MWC PD
PAGE
1/4
Features
SMD filter consisting of coupled resonators with stepped impedances
MgTiO3 - CaTiO3 (
r = 21 / TCf =0±10 ppm/K) with a coating of copper (10
µ
m) and tin (>5
µ
m)
Excellent reflow solderability, no migration effect due to copper/tin metallization
Index
Page 2
Component drawing
Recommended footprint
Page 3
Characteristics
Maximum ratings
Typical passband characteristic
Page 4
Processing information
Soldering requirements
Delivery mode
Microwave Ceramics and Modules
Filter
2 Pole Filter for W-LAN 5GHz / [5.15-5.35] Band
B69842N5257A202
Preliminary Data Sheet
ISSUE DATE
18.03.04
ISSUE
P2
PUBLISHER
SAW MWC PD
PAGE
2/4
Component drawing
Recommended footprint
soldered Pads. I/O
pads must be
soldered to 50 ohms
impedance lines
ground under solder
resist. It must be
connected to ground
plane below by vias.
Max via diameter:0.3 mm
Max via pitch:1 mm
View from below onto the solder terminals and view from beside
Microwave Ceramics and Modules
Filter
2 Pole Filter for W-LAN 5GHz / [5.15-5.35] Band
B69842N5257A202
Preliminary Data Sheet
ISSUE DATE
18.03.04
ISSUE
P2
PUBLISHER
SAW MWC PD
PAGE
3/4
Characteristics
min.
typ.
max.
Center frequency
fc -
5250
-
MHz
Insertion loss
IL
1.0
1.2
dB
Passband
B 200
MHz
Standing wave ratio
SWR
1.5
2.0
Impedance
Power
Z
P
50
1.0
W
Attenuation
at DC to 1990 MHz
at 1990 to 2170 MHz
at 2400 to 2500 MHz
52
50
45
57
55
50
dB
dB
dB
Maximum ratings
IEC climatic category (IEC 68-1)
- 40/+ 90/56
Operating temperature
Top -40 / + 85
°C
Typical passband characteristic
-70
-60
-50
-40
-30
-20
-10
0
1,0
1,3
1,5
1,8
2,0
2,3
2,5
2,8
3,0
3,3
3,5
3,8
4,0
4,3
4,5
4,8
5,0
5,3
5,5
5,8
6,0
Frequency [GHz]
Atte
nua
tion [dB]
S11 [dB]
S21 [dB]
Microwave Ceramics and Modules
Filter
2 Pole Filter for W-LAN 5GHz / [5.15-5.35] Band
B69842N5257A202
Preliminary Data Sheet
ISSUE DATE
18.03.04
ISSUE
P2
PUBLISHER
SAW MWC PD
PAGE
4/4
Processing information
Wettability acc. to IEC 68-2-58:
75% (after aging)
Soldering Requirements
Profile for eutectic
SnPb solder paste
Profile for leadfree
solder paste
Soldering type
reflow
reflow
Maximum soldering temperature
235 (max. 2 sec.)
260 (max. 2 sec.)
°C
(measuring point on top surface of the component) 225 (max. 10 sec.)
250 (max. 10 sec.) °C
Recommended soldering conditions (infrared):
20-40 sec.
40-80 sec.
within 10 sec.
Time [sec.]
Temp. [°C]
215°C±10°C
30 sec.
2-3 min.
within 10 sec.
Time [sec.]
Temp. [°C]
245°C±5°C
2.5 °C/s
> - 5 °C/s
Delivery mode
·
Blister tape acc. to IEC 286-3, grey
·
Pieces/tape: 4000
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry
recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed.
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