256 Megabit CMOS
3.3V EDO DRAM
DP3ED32MX8RY5
DESCRIPTION:
The
M-Densus series is a family of interchangeable memory
modules. The 64 Megabit DRAM is a member of this family
which utilizes the new and innovative space saving TSOP
stacking technology. The module is constructed with four
8 Meg x 8 EDO, 3.3 Volt DRAM's available in a 128 Megabit
compatible pin-out.
The 64 Megabit based
M-Densus modules have been
designed to fit in the same footprint as the 32 Meg x 4 DRAM
TSOP monolithic. This allows the memory board designer to
upgrade the memory in their products without redesigning the
memory board, thus saving time and money.
FEATURES:
·
Configurations Available:
256 Megabit: 32 Meg x 8
·
Access Times: 50, 60ns (max.)
·
3.3 Volt Supply
·
Common Data Inputs and Outputs
·
Extended Data Out Capability (EDO)
·
4K/8K 64ms Refresh
·
3 Variations of Refresh:
- RAS only Refresh
- CAS before RAS Refresh
- Hidden Refresh
·
Package: Leadless TSOP Module
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
PIN-OUT DIAGRAM
FUNCTIONAL BLOCK DIAGRAM
PIN NAMES
A0 - A11
Row Address:
A0 - A11
Column Address: A0 - A11
Refresh Address: A0 - A11
A0 - A12*
Row Address:
A0 - A12
Column Address: A0 - A10
Refresh Address: A0 - A12
DQ0 - DQ4
Data In / Data Out
CAS0 - CAS4
Column Address Strobe
RAS0 - RAS4
Row Address Enables
WE
Data Write Enable
OE
Data Output Enable
V
CC
Power Supply (+3.3V)
V
SS
Ground
N.C.
No Connect
*
A12 for 8K refresh device.
M-Densus
High Density Memory Device
30A228-00
REV. A
1
DP3ED32MX8RY5
M-Densus
Dense-Pac Microsystems, Inc.
PRELIMINARY
Dense-Pac Microsystems, Inc.
7321 Lincoln Way, Garden Grove, California 92841-1431
(714) 898-0007 u (800) 642-4477 u FAX: (714) 897-1772 u http://www.dense-pac.com
ORDERING INFORMATION
* Contact your sales representative for supplier and manufacturer codes.
MECHANICAL DRAWING
30A228-00
REV. A
2
PDF 
ZIP