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Part Number PDS3100

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e
3
DS30487 Rev. 4 - 2
1 of 3
PDS3100
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
ã
Diodes Incorporated
PDS3100
3A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER
PowerDI
ä
5
Features
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
·
Case: PowerDI
ä
5
·
Case Material: Molded Plastic, "Green" Molding
Compound. UL Flammability Classification Rating
94V-0
·
Moisture sensitivity: Level 1 per J-STD-020C
·
Terminals: Finish ­ Matte Tin annealed over
Copper leadframe. Solderable per MIL-STD-202,
Method 208
·
Polarity: See Diagram
·
Marking: See Page 3
·
Weight: 0.093 grams (approx.)
Mechanical Data
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
100
V
RMS Reverse Voltage
V
R(RMS)
70
V
Average Rectified Output Current
(See also Figure 5)
I
O
3
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
I
FSM
90
A
Operating Temperature Range
T
j
-65 to +150
°C
Storage Temperature Range
T
STG
-65 to +150
°C
·
Guard Ring Die Construction for
Transient Protection
·
Low Power Loss, High Efficiency
·
Low Reverse Leakage Current
·
For Use in Low Voltage, High Frequency Inverters,
Free Wheeling, and Polarity Protection Applications
·
High Forward Surge Current Capability
·
Lead Free Finish, RoHS Compliant (Note 1)
·
"Green" Molding Compound (No Br, Sb)
T
C
U
D
O
R
P
W
E
N
Maximum Ratings
@ T
A
= 25
°C unless otherwise specified
E
E1
b1
A
A2
A2
D
b2
b1
e
L1
L1
E
b1
D
b2
b1
e
D2
L
E2
L1
LEFT PIN
RIGHT PIN
Note: Pins Left & Right must
be electrically connected
at the printed circuit board.
BOTTOMSIDE
HEAT SINK
W
PowerDI
ä
5
Dim
Min
Max
A
1.05
1.15
A2
0.33
0.43
b1
0.80
0.99
b2
1.70
1.88
D
3.90
4.05
D2
3.05 NOM
E
6.40
6.60
e
1.84 NOM
E1
5.30
5.45
E2
3.55 NOM
L
0.75
0.95
L1
0.50
0.65
W
1.20
1.50
All Dimensions in mm
Thermal Characteristics
@ T
A
= 25
°C unless otherwise specified
Characteristic
Symbol
Typ
Max
Unit
Thermal Resistance Junction to Soldering Point
R
qJS
¾
6.0
°C/W
Thermal Resistance Junction to Ambient Air (Note 2)
R
qJA
¾
¾
°C/W
Thermal Resistance Junction to Ambient Air (Note 3)
R
qJA
¾
¾
°C/W
Thermal Resistance Junction to Ambient Air (Note 4)
R
qJA
¾
¾
°C/W
Notes:
1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
3. Polyimide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polyimide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm.
SPICE MODEL: PDS3100
DS30487 Rev. 4 - 2
2 of 3
PDS3100
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
T
C
U
D
O
R
P
W
E
N
0.01
0.1
1
10
0.001
0.0001
0
20
40
60
100
80
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Fig. 2 Typical Reverse Characteristics
T = +25
°C
j
T = -65
°C
j
0.01
0.1
1.0
10
0
20
40
60
80
100
I
,
INST
ANT
A
NEOUS
R
EVERSE
CURRENT
(mA)
R
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Fig. 3 Typical Reverse Characteristics
T = +125°C
j
T = +150°C
j
T = +100°C
j
T = +85°C
j
0.01
0
V , INSTANTANEOUS FORWARD VOLTAGE (mV)
F
Fig. 1 Typical Forward Characteristics
I
,
INST
ANT
A
NE
O
US
F
O
R
W
ARD
C
URRENT
(mA)
F
0.1
1
10
100
1000
10000
100000
100 200 300 400 500 600 700 800 900 1000 1100 1200 1300
T = 150°C
j
T = 125°C
j
T = 100°C
j
T = 85°C
j
T = 25°C
j
T = -65°C
j
0
40
C
,
T
O
T
A
L
C
AP
ACIT
ANCE
(pF)
T
V , REVERSE VOLTAGE (V)
R
Fig. 4 Typical Total Capacitance vs. Reverse Voltage
0
100
50
200
150
250
300
5
10
15
20
25
30
35
f = 1MHz
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 5)
V
(BR)R
100
¾
¾
V
I
R
= 0.2mA
Forward Voltage
V
F
¾
¾
¾
¾
0.71
0.61
0.78
0.68
0.75
0.65
0.83
0.75
V
I
F
= 3A, T
j
= 25
°C
I
F
= 3A, T
j
= 100
°C
I
F
= 6A, T
j
= 25
°C
I
F
= 6A, T
j
= 100
°C
Reverse Current (Note 5)
I
R
¾
¾
2
0.5
200
20
mA
mA
T
j
= 25
°C, V
R
= 100V
T
j
= 100
°C, V
R
= 100V
Electrical Characteristics
@ T
A
= 25
°C unless otherwise specified
Notes:
5. Short duration test pulse used to minimize self-heating effect.
DS30487 Rev. 4 - 2
3 of 3
PDS3100
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
(Note 7)
Device
Packaging
Shipping
PDS3100-13
PowerDI
ä
5
5000/Tape & Reel
Marking Information
S3100 = Product type marking code
= Manufacturers' code marking
YYWW = Date code marking
YY = Last digit of year ex: 4 for 2004
WW = Week code 01 to 52
K = Factory Designator
YYWWK
S3100
Ordering Information
Notes: 1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
3. Polyimide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polyimide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm.
5. Short duration test pulse used to minimize self-heating effect.
6. Polyimide PCB, 2 oz. Copper. Cathode pad dimensions 18.8mm x 14.4mm. Anode pad dimensions 5.6mm x 3.0mm.
7. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
T
C
U
D
O
R
P
W
E
N
0
0.5
1
1.5
2.5
2
3
3.5
4
0
30
60
90
120
150
I
,
DC
FOR
W
A
RD
CURRENT
(A)
F
T , AMBIENT TEMPERATURE (°C)
A
Fig. 5 DC Forward Current Derating
Note 2
Note 6
0
1
2
3
4
0
1
2
3
4
5
6
7
P
,
FOR
W
A
RD
POWER
D
ISSIP
A
TION
(W)
F
I , FORWARD CURRENT (A)
F
Fig. 6 Forward Power Dissipation
I
PK
I
AV
= 1 (DC)
0
40
20
200
180
160
140
120
100
80
60
0
25
50
75
100
T
,
DERA
TED
AMBIENT
T
EMPERA
T
URE
(°C)
A
V , DC REVERSE VOLTAGE (V)
R
Fig. 7 Operating Temperature Derating
Note 2