www.clare.com
DS-PLA110L-R4.0
1
PLA110L
Single Pole OptoMOS
®
Relays
PLA110L is a 1-Form-A solid state relay which uses
optically coupled MOSFET technology to provide
3750V of input to output isolation. The efficient cur-
rent limited MOSFET switches and photovoltaic die
use Clare's patented OptoMOS
®
architecture. The
optically-coupled input is controlled by a highly effi-
cient GaAIAs infrared LED. The PLA110L can be
used to replace mechanical relays and offers the
superior reliability associated with semiconductor
devices. Because they have no moving parts, they
can offer faster, bounce-free switching in a more
compact surface mount or through hole package.
·
Telecommunications
·
Telecom Switching
·
Tip/Ring Circuits
·
Modem Switching (Laptop, Notebook, Pocket
Size)
·
Hookswitch
·
Dial Pulsing
·
Ground Start
·
Ringer Injection
·
Instrumentation
·
Multiplexers
·
Data Acquisition
·
Electronic Switching
·
I/O Subsystems
·
Meters (Watt-Hour, Water, Gas)
·
Medical Equipment-Patient/Equipment Isolation
·
Security
·
Aerospace
·
Industrial Controls
·
UL Recognized: File Number E76270
·
CSA Certified: File Number LR 43639-10
·
BSI Certified:
·
BS EN 60950:1992 (BS7002:1992)
Certificate #:7344
·
BS EN 41003:1993
Certificate #:7344
·
Small 6 Pin DIP Package
·
Low Drive Power Requirements (TTL/CMOS
Compatible)
·
No Moving Parts
·
High Reliability
·
Arc-Free With No Snubbing Circuits
·
3750V
RMS
Input/Output Isolation
·
No EMI/RFI Generation
·
Machine Insertable, Wave Solderable
·
Current Limiting, Surface Mount and Tape & Reel
Versions Available
Applications
Features
Description
Approvals
Ordering Information
Part #
Description
PLA110L
6 Pin Dip (50/Tube)
PLA110LS
6 Pin Surface Mount (50/Tube)
PLA110LSTR
6 Pin Surface Mount (1000/Reel)
PLA110L
Units
Load Voltage
400
V
Load Current
150
mA
Max R
ON
25
Pin Configuration
1
3
2
4
5
6
+ Control
Ð Control
NC
Load
Do Not Use
Load
AC/DC Configuration
PLA110L Pinout
1
3
2
4
5
6
+ Control
Ð Control
NC
+ Load
Ð Load
DC Only Configuration
PLA110L Pinout
CONTROL
LOAD
10ms
10%
10%
90%
+
T
ON
T
OFF
+
+
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2
PLA110L
Rev. 4.0
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at these or
any other conditions beyond those indicated in the opera-
tional sections of this data sheet is not implied. Exposure
of the device to the absolute maximum ratings for an
extended period may degrade the device and effect its
reliability.
Electrical Characteristics
Absolute Maximum Ratings (@ 25° C)
Parameter
Conditions
Symbol
Min
Typ
Max
Units
Output Characteristics @ 25°C
Load Voltage (Peak)
-
V
L
-
-
400
V
Load Current (Continuous)
AC/DC Configuration
-
I
L
-
-
150
mA
DC Configuration
-
I
L
-
-
250
mA
Peak Load Current
10ms
I
L
-
-
-
mA
On-Resistance
AC/DC Configuration
I
L
=150mA R
ON
-
-
25
DC Configuration
I
L
=250mA R
ON
-
-
9
Off-State Leakage Current
V
L
=400V
I
LEAK
-
-
-
µA
Switching Speeds
Turn-On
I
F
=5mA, V
L
=10V
T
ON
-
-
1
ms
Turn-Off
I
F
=5mA, V
L
=10V
T
OFF
-
-
0.25
ms
Output Capacitance
50V; f=1MHz
C
OUT
-
25
-
pF
Load Current Limiting
I
CL
190
235
280
mA
Input Characteristics @ 25°C
Input Control Current
I
L
=150mA
I
F
5
-
50
mA
Input Dropout Current
-
I
F
0.4
0.7
-
mA
Input Voltage Drop
I
F
=5mA
V
F
0.9
1.2
1.4
V
Reverse Input Voltage
-
V
R
-
-
5
V
Reverse Input Current
V
R
=5V
I
R
-
-
10
µA
Common Characteristics @ 25°C
Input to Output Capacitance
-
C
I/O
-
3
-
pF
Input to Output Isolation
-
V
I/O
3750
-
-
V
RMS
Parameter
Min
Typ
Max
Units
Input Power Dissipation
-
-
150
1
mW
Input Control Current
-
-
50
mA
Peak (10ms)
-
-
1
A
Reverse Input Voltage
-
-
5
V
Total Power Dissipation
-
-
800
2
mW
Isolation Voltage
Input to Output
3750
-
-
V
RMS
Operational Temperature
-40
-
+85
°C
Storage Temperature
-40
-
+125
°C
Soldering Temperature
DIP Package
-
-
+260
°C
Surface Mount Package
-
-
+220
°C
(10 Seconds Max.)
1
Derate Linearly 1.33 mw/°C
2
Derate Linearly 6.67 mw/°C
PLA110L
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3
Rev. 4.0
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
PLA110L
Typical LED Forward Voltage Drop
(N=50 Ambient Temperature = 25
°C)
I
F
= 5mADC
35
30
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
De
vice Count
(N)
PLA110L
Typical On-Resistance Distribution
(N=50 Ambient Temperature = 25
°C)
(Load Current = 150mADC; I
F
= 5mADC)
35
30
25
20
15
10
5
0
13.7
14.9
16.1
13.1
14.3
15.5
On-Resistance (
)
De
vice Count
(N)
PLA110L
Typical Blocking Voltage Distribution
(N=50 Ambient Temperature = 25
°C)
35
30
25
20
15
10
5
0
450.5
468.5
486.5
441.5
459.5
477.5
Blocking Voltage (V)
De
vice Count
(N)
PLA110L
Typical I
F
for Switch Dropout
(N=50 Ambient Temperature = 25
°C)
25
20
15
10
5
0
0.75
1.35
1.95
1.05
1.65
2.25
LED Current (mA)
De
vice Count
(N)
PLA110L
Typical Turn-On Time
(N=50 Ambient Temperature = 25
°C)
(Load Current = 150mADC; I
F
= 5mADC)
0.21
0.33
0.45
0.15
0.27
0.39
Turn-On (ms)
De
vice Count
(N)
25
20
15
10
5
0
PLA110L
Typical Turn-Off Time
(N=50 Ambient Temperature = 25
°C)
(Load Current = 150mADC; I
F
= 5mADC)
0.07
0.11
0.15
0.13
0.09
0.05
Turn-Off (ms)
De
vice Count
(N)
25
20
15
10
5
0
PLA110L
Typical Load Current vs. Temperature
Temperature (
°C)
Load Current (mA)
300
250
200
150
100
50
0
-40
-20
0
20
40
60
80
120
100
20mA
10mA
5mA
PLA110L
Typical Turn-On vs. Temperature
(Load Current = 150mADC)
Temperature (
°C)
T
urn-On (ms)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20
0
20
40
60
80
120
100
5mA
10mA
20mA
PLA110L
Typical Leakage vs. Temperature
(Measured across Pins 4 & 6)
Temperature (
°C)
Leaka
g
e
(
µ
A)
-40
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
-20
0
20
40
60
80
100
PLA110L
Typical Blocking Voltage vs. Temperature
Temperature (
°C)
Bloc
king V
olta
g
e
(V
RMS
)
-40
480
475
470
465
460
455
450
-20
0
20
40
60
80
100
PLA110L
Typical Turn-Off vs. Temperature
(Load Current = 150mADC)
Temperature (
°C)
T
urn-Off (ms)
-40
0.140
0.120
0.100
0.080
0.060
0.040
0.020
0
-20
0
20
40
60
80
100
5mA
PLA110L
Typical I
F
for Switch Operation
(N=50 Ambient Temperature = 25
°C)
(Load Current = 150mADC)
0.75
1.35
1.95
1.05
1.65
2.25
LED Current (mA)
De
vice Count
(N)
25
20
15
10
5
0
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4
PLA110L
Rev. 4.0
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
PLA110L
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (
°C)
LED Forwar
d
V
olta
g
e
Dr
op
(V)
1.8
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
120
100
50mA
30mA
20mA
10mA
5mA
PLA110L
Typical Turn-On vs. LED Forward Current
(Load Current = 150mADC)
Forward Current (mA)
T
urn-On (ms)
0
5
10
15
20
25
30
35
40
45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
50
PLA110L
Typical Turn-Off vs. LED Forward Current
(Load Current = 150mADC)
Forward Current (mA)
T
urn-Off (ms)
0
5
10
15
20
25
30
35
40
45
0.12
0.10
0.08
0.06
0.04
0.02
0
50
PLA110L
Typical On-Resistance vs. Temperature
(Load Current = 150mADC; I
F
= 5mADC)
Temperature (
°C)
On-Resistance (
)
-40
25
20
15
10
5
0
-20
0
20
40
60
80
100
PLA110L
Typical I
F
for Switch Operation
vs. Temperature
(Load Current = 150mADC)
Temperature (
°C)
LED Current (mA)
-40
3.000
2.500
2.000
1.500
1.000
0.500
0
-20
0
20
40
60
80
100
PLA110L
Typical I
F
for Switch Dropout
vs. Temperature
(Load Current = 150mADC)
Temperature (
°C)
LED Current (mA)
-40
3.000
2.500
2.000
1.500
1.000
0.500
0
-20
0
20
40
60
80
100
PLA110L
Typical Load Current vs. Load Voltage
(Ambient Temperature = 25
°C)
I
F
= 5mADC
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-2.5 -2.0 -1.5 -1.0 -0.5
0
1.5
1.0
0.5
2.0 2.5
PLA110L
Energy Rating Curve
Time
Load Current (A)
10
µs
1.2
1.0
0.8
0.6
0.4
0.2
0
1ms
100
µs
100ms
1s
10ms
10s
100s
PLA110L
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5
Rev. 4.0
Rev. 2.0
Dimensions
mm
(inches)
MECHANICAL DIMENSIONS
PC Board Pattern
(Top View)
6.350
± .127
(.250
± .005)
2.540
± .127
(.100
± .005)
7.620
± .127
(.300
± .005)
5.080
± .127
(.200
± .005)
6-.800 DIA.
(6-.031 DIA.)
6.350
± .127
(.250
± .005)
8.382
± .635
(.330
± .025)
2.540
± .127
(.100
± .005)
9.144
(.360)
.457
± .076
(.018
± .003)
6 Pin DIP Through Hole (Standard)
7.239 TYP.
(.285)
3.302
(.130)
7.620
± .254
(.300
± .010)
9.144
± .508
(.360
± .020)
PC Board Pattern
(Top View)
2.540
± .127
(.100
± .005)
8.305
± .127
(.327
± .005)
1.905
± .127
(.075
± .005)
1.499
± .127
(.059
± .005)
4.445
± .127
(.175
± .005)
3.302
(.130)
7.620
± .254
(.300
± .010)
6.350
± .127
(.250
± .005)
8.382
± .635
(.330
± .025)
2.540
± .127
(.100
± .005)
9.525
± .254
(.375
± .010)
.457
± .076
(.018
± .003)
.254 TYP.
(.010)
.635 TYP.
(.025)
6 Pin DIP Surface Mount ("S" Suffix)
Tape and Reel Packaging for 6 Pin Surface Mount Package
7.493
± .102
(.295
± .004)
12.090
(.476)
330.2 DIA.
(13.00)
1.753
± .102
(.069
± .004)
3.987
± .102
(.157
± .004)
1.498
± .102
(.059
± .004)
6.731 MAX.
(.265)
.406 MAX.
(.016)
4.877
(.192)
Top Cover
Tape
2.007
± .102
(.079
± .004)
11.989
± .102
(.472
± .004)
User Direction of Feed
.050R TYP.
16.002
± .305
(.630
± .012)
10.100
(.398)
Embossment
Embossed Carrier
Top Cover
Tape Thickness
.102 MAX.
(.004)
10.100
± .102
(.398
± .004)
1.549
± .102
(.061
± .004)
1
6
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