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Part Number A49LF040TX-33

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A49LF040
4 Mbit CMOS 3.3Volt-only Low Pin Count Flash Memory
Preliminary
PRELIMINARY (August, 2004, Version 0.1)
AMIC Technology, Corp.
Document Title
4 Mbit CMOS 3.3 Volt-only Low Pin Count Flash Memory
Revision History
Rev. No. History Issue
Date Remark
0.0
Initial issue
February 17, 2004
Preliminary
0.1
Add Pb-Free package type
August 20, 2004
A49LF040
4 Mbit CMOS 3.3Volt-only Low Pin Count Flash Memory
Preliminary
PRELIMINARY (August, 2004, Version 0.1)
1
AMIC Technology, Corp.
FEATURES
· Single Power Supply Operation
-
Low voltage range: 3.0 V - 3.6 V for Read and Write
Operations
· Standard Intel Low Pin Count Interface
-
Read compatible to Intel® Low Pin Count (LPC)
interface
· Memory Configuration
-
512K x 8 (4 Mbit)
· Block Architecture
-
4Mbit: eight uniform 64KByte blocks
-
Supports full chip erase for Address/Address
Multiplexed (A/A Mux) mode
·
Automatic Erase and Program Operation
-
Embedded Byte Program and Block/Chip Erase
algorithms
-
Typical 10 µs/byte programming time
-
Typical 1s block erase time
· Two Operational Modes
-
Low Pin Count Interface (LPC) Mode for in-system
operation
-
Address/Address Multiplexed (A/A Mux) Interface
Mode for programming equipment
· Low Pin Count (LPC) Mode
-
33 MHz synchronous operation with PCI bus
-
5-signal communication interface for in-system read
and write operations
-
Standard SDP Command Set
-
Data# Polling (I/O
7
) and Toggle Bit (I/O
6
) features
-
4 ID pins for multi-chip selection
-
5 GPI pins for General Purpose Input Register
-
TBL# pin for hardware write protection to Boot Block
-
WP# pin for hardware write protection to whole
memory array except Boot Block

· Address/Address Multiplexed (A/A Mux) Mode
-
11-pin multiplexed address and 8-pin data I/O interface
-
Supports fast programming on EPROM programmers
-
Standard SDP Command Set
-
Data# Polling (I/O
7
) and Toggle Bit (I/O
6
) features
· Lower Power Consumption
-
Typical 12mA active read current
-
Typical 24mA program/erase current
·
High Product Endurance
-
Guarantee 100,000 program/erase cycles for each
block
-
Minimum 20 years data retention
· Compatible Pin-out and Packaging
-
32-pin (8 mm x 14 mm) TSOP (TYPE I)
-
32-pin PLCC
GENERAL DESCRIPTION
The A49LF040 flash memory device is designed to be read-
compatible with the Intel Low Pin Count (LPC) Interface
Specification 1.1. This device is designed to use a single low
voltage, range from 3.0 Volt to 3.6 Volt power supply to
perform in-system or off-system read and write operations. It
provides protection for the storage and update of code and
data in addition to adding system design flexibility through
five general-purpose inputs. Two interface modes are
supported by the A49LF040: Low Pin Count (LPC) Interface
mode for In-System programming and Address/Address
Multiplexed (A/A Mux) mode for fast factory programming of
PC-BIOS applications.

The memory is divided into eight uniform 64Kbyte blocks that
can be erased independently without affecting the data in
other blocks. Blocks also can be protected individually to
prevent accidental Program or Erase commands from
modifying the memory. The Program and Erase operations
are executed by issuing the Program/Erase commands into
the command interface by which activating the internal
control logic to automatically process the Program/Erase
procedures. The device can be programmed on a byte-by-
byte basis after performing the Erase operation. In addition to
the Block Erase operation, the Chip Erase feature is provided
in A/A Mux mode that allows the whole memory to be erased
in one single Erase operation. The A49LF040 provides the
status detection such as Data# Polling and Toggle Bit
Functions in both LPC and A/A Mux modes. The process or
completion of Program and Erase operations can be
detected by reading the status bits.

The A49LF040 is offered in 32-lead TSOP and 32-lead
PLCC packages. See Figures 1 and 2 for pin assignments
and Table 1 for pin descriptions.



A49LF040
PRELIMINARY (August, 2004, Version 0.1)
2
AMIC Technology, Corp.
PIN CONFIGURATIONS
A7 (GPI1)
A6 (GPI0)
A5 (WP#)
A4 (TBL#)
A3 (ID3)
A2 (ID2)
A1 (ID1)
A0 (ID0)
I/O
0
(LAD0)
21
22
23
24
25
26
27
28
29
12
13
11
8
9
5
7
6
RB# (RES)
I/O
7
(RES)
WE# (LFRAME#)
32-lead PLCC
Top View
OE# (INIT#)
VDD (VDD)
NC
NC
VSS (VSS)
MODE (MODE)
I/O
1
(L
A
D
1
)
I/O
2
(L
A
D
2
)
VS
S (
VSS
)
I/O
3
(L
A
D
3
)
I/O
4
(R
E
S
)
I/O
5
(R
E
S
)
I/O
6
(R
E
S
)
4
3
2
1
32
31
30
A8
(
G
PI
2
)
A9
(
G
P
I
3
)
RST#
(
R
ST
#
)
NC
VDD
(
V
DD)
R/
C# (
L
CL
K)
A1
0 (
G
PI
4
)
14
15
16
17
18
19
20
10
(*) Designates LPC Mode
FIGURE 1: Pin Assignments for 32-Lead PLCC
32-lead TSOP (8
MM
X 14
MM
)
Top View
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
NC
NC
VSS (VSS)
MODE (MODE)
A10 (GPI4)
R/C# (LCLK)
VDD (VDD)
RST# (RST#)
A9 (GPI3)
A8 (GPI2)
A7 (GPI1)
A6 (GPI0)
A5 (WP#)
A4 (TBL#)
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A3 (ID3)
A2 (ID2)
A1 (ID1)
A0 (ID0)
I/O
0
(LAD0)
I/O
1
(LAD1)
I/O
2
(LAD2)
VSS (VSS)
I/O
3
(LAD3)
I/O
4
(RES)
I/O
5
(RES)
I/O
6
(RES)
I/O
7
(RES)
VDD (VDD)
WE# (LFRAME#)
OE# (INIT#)
NC
NC
FIGURE 2: Pin Assignments for 32-Lead TSOP
(*) Designates LPC Mode
A49LF040
PRELIMINARY (August, 2004, Version 0.1)
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AMIC Technology, Corp.
BLOCK DIAGRAM
High Voltage
Generator
Data Latch
LPC Mode
Interface
LAD[3:0]
LCLK
LFRAME#
ID[3:0]
GPI[4:0]
A/A Mux
Mode
Interface
A[10:0]
I/O
7
~ I/O
0
WE#
OE#
R/C#
MODE
RST#
A
ddr
es
s
Lat
c
h
X-Decoder
Y-Decoder
Cell Matrix
Y-Gating
Control Logic
Input/Output
Buffers
TBL# WP# INIT#
RB#
A49LF040
PRELIMINARY (August, 2004, Version 0.1)
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AMIC Technology, Corp.
Table 1: Pin Description
1. IN=Input, OUT=output, I/O=Input/Output, PWR=Power
Interface
Symbol Pin
Name
Type
A/A
Mux
LPC
Descriptions
A
10
-A
0
Address
IN
X
Inputs for addresses during Read and Write operations in A/A Mux
mode. Row and column addresses are latched by R/C# pin.
I/O
7
-I/O
0
Data I/O
X
To output data during Read cycle and receive input data during
Write cycle in A/A Mux mode. The outputs are in tri-state when
OE# is high.
OE# Output
Enable
IN
X
To
control the data output buffers.
WE# Write
Enable
IN
X
To
control the Write operations.
MODE
Interface
Configuration Pin
IN X X
To determine which interface is operational. When held high, A/A
Mux mode is enabled and when held low, LPC mode is enabled.
This pin must be setup at power-up or before return from reset and
not change during device operation. This pin is internally pulled
down with a resistor between 20-100 K
.
INIT# Initialize
IN
X
This is the second reset pin for in-system use. INIT# and RST#
pins are internally combined and initialize a device reset when
driven low.
ID[3:0] Identification
Inputs IN X
These four pins are part of the mechanism that allows multiple
LPC devices to be attached to the same bus. To identify the
component, the correct strapping of these pins must be set. The
boot device must have ID[3:0]=0000 and it is recommended that
all subsequent devices should use sequential up-count strapping.
These pins are internally pulled down with a resistor between 20-
100 K
.
GPI[4:0]
General Purpose
Inputs
IN X
These individual inputs can be used for additional board flexibility.
The state of these pins can be read immediately at boot, through
LPC internal registers. These inputs should be at their desired
state before the start of the PCI clock cycle during which the read
is attempted, and should remain in place until the end of the Read
cycle. Unused GPI pins must not be floated.
TBL#
Top Block Lock
IN
X
To prevent any write operations to the Boot Block when driven low,
regardless of the state of the block lock registers. When TBL# is
high it disables hardware write protection for the top Boot Block.
This pin cannot be left unconnected.
LAD[3:0]
LPC I/Os
I/O
X
I/O Communications in LPC mode.
LCLK Clock
IN
X
To provide a clock input to the device. This pin is the same as that
for the PCI clock and adheres to the PCI specifications.
LFRAME# Frame IN
X
To indicate start of a data transfer operation; also used to abort an
LPC cycle in progress.
RST#
Reset
IN
X
X
To reset the operation of the device
WP# Write
Protect
IN
X
When low, prevents any write operations to all but the highest
addressable block. When WP# is high it disables hardware write
protection for these blocks. This pin cannot be left unconnected.
R/C# Row/Column
Select
IN X
This pin determines whether the address pins are pointing to the
row addresses or the column addresses in A/A Mux mode.
RB# Ready/Busy#
OUT
X
To determine if the device is busy in write operations. Valid only in
A/A Mux mode.
RES
Reserved
X
Reserved. These pins must be left unconnected.
VDD
Power Supply
PWR
X
X
To provide power supply (3.0-3.6Volt).
VSS
Ground
PWR
X
X
Circuit ground. All VSS pins must be grounded.
NC
No Connection
X
X
Unconnected pins.
A49LF040
PRELIMINARY (August, 2004, Version 0.1)
5
AMIC Technology, Corp.
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias . . . . . . . . . .. . . . -55
°C to + 125°C
Storage Temperature . . . . . . . . . . . . . . . . . -65
°C to + 125°C
D.C. Voltage on Any Pins with Respect to Ground
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . ... . . . . . -0.5V to VDD + 0.5V
Package Power Dissipation Capability (Ta=25
°C)
. . . . . . . . . . . . . . . . . . . . . . . . .... . . . . . -0.5V to VDD + 0.5V
Output Short Circuit Current
(2)
. . . . . . . . . .. . . . . . . 50mA
Notes:
1. Minimum DC voltage on input or I/O pins is -0.5V. During voltage
transitions, input or I/O pins may undershoot VSS to -2.0V for
periods of up to 20ns. Maximum DC voltage on input and I/O
pins is VDD + 0.5V. During voltage transitions, input or I/O pins
may
overshoot to VDD + 2.0V for periods up to 20ns.
2. No more than one output is shorted at a time. Duration of the
short circuit should not be greater than one second.
*Comments
Stresses above those listed under "Absolute Maximum Ratings" may
cause permanent damage to this device. These are stress ratings
only. Functional operation of this device at these or any other
conditions above those indicated in the operational sections of these
specifications are not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may affect device
reliability.
Operating Ranges
Commercial (C) Devices
Ambient Temperature (T
A
) . . . . . . . . ..... . . . . . 0
°C to +85°C
VDD Supply Voltages
VDD for all devices . . . . . . . . . . . . . . . . ..... . +3.0V to +3.6V
Operating ranges define those limits between which the
functionally of the device is guaranteed.
MODE SELECTION
The A49LF040 flash memory devices can operate in two
distinct interface modes: the Low Pin Count Interface
(LPC) mode and the Address/Address Multiplexed (A/A Mux)
mode. The Mode pin is used to set the interface mode
selection. If the Mode pin is set to logic High, the device is in
A/A Mux mode; while if the Mode pin is set Low, the device is
in the LPC mode. The Mode pin must be configured prior to
device operation. The Mode pin is internally pulled down if
the pin is not connected. In LPC mode, the device is
configured to interface with its host using Intel's Low Pin
Count proprietary protocol. Communication between Host
and the A49LF040 occurs via the 4-bit I/O communication
signals, LAD[3:0] and the LFRAME#. In A/A Mux mode, the
device is programmed via an 11-bit address A
10
-A
0
and an 8-
bit data I/O
7
-I/O
0
parallel signals. The address inputs are
multiplexed in row and column selected by control signal
R/C# pin. The column addresses are mapped to the higher
internal addresses, and the row addresses are mapped to
the lower internal addresses. See the Device Memory Maps
in Figure 3 for address assignment.
LPC MODE OPERATION
The LPC interface consists of four data signals (LAD[3:0]),
one control signal (LFRAME#) and a clock (LCLK). The data
signals, control signal and clock comply with PCI
specifications. Operations such as Memory Read and
Memory Write use Intel LPC propriety protocol. JEDEC
Standard SDP (Software Data Protection) Byte-Program and
Block-Erase command sequences are incorporated into the
LPC memory cycles. Chip-Erase command is only available
in A/A Mux mode. The addresses and data are transferred
through LAD[3:0] synchronized with the input clock LCLK
during a LPC memory cycle. The pulse of LFRAME# is
inserted for at least one clock period to indicate the start of a
LPC memory cycle. The address or data on LAD[3:0] is
latched on the rising edge of LCLK. The device enters
standby mode when LFRAME# is high and no internal
operation is in progress. The device is in ready mode when
LFRAME# is low and no activity is on the LPC bus.
LPC Read Operation
LPC Read operations read from the memory cells or specific
registers in the LPC device. A valid LPC Read operation
starts when LFRAME# is Low as LCLK rises and a START
value "0000b" is on LAD[3:0] then the next nibble "010X" is
on LAD[3:0]. Addresses and data are transferred to and from
the device decided by a series of "fields". Field sequences
and contents are strictly defined for LPC Read operations.
Refer to Table 2 for LPC Read Cycle Definition.
LPC Write Operation
LPC Write operations write to the LPC Interface or LPC
registers. A valid LPC Write operation starts when LFRAME#
is Low as LCLK rises and a START value "0000b" is on
LAD[3:0] then the next nibble "011X" is on LAD[3:0].
Addresses and data are transferred to and from the device
decided by a series of "fields". Field sequences and contents
are strictly defined for LPC Write operations. Refer to Table 3
for LPC write Cycle Definition.
LPC Abort Operation
If LFRAME# is driven low for one or more clock cycles during
a LPC cycle, the cycle will be terminated and the device will
wait for the ABORT command. The host may drive the
LAD[3:0] with `1111b' (ABORT command) to return the
device to Ready mode. If abort occurs during a Write
operation such as checking the operation status with Data#
Polling (I/O
7
) or Toggle Bit (I/O
6
) pins, the read status cycle
will be aborted but the internal write operation will not be
affected. In this case, only the reset operation initiated by
RST# or INIT# pin can terminate the Write operation..
Response To Invalid Fields
During LPC operations, the LPC will not explicitly indicate
that it has received invalid field sequences. The response to
specific invalid fields or sequences is as follows:
Address out of range:
The A49LF040 will only response to
address range as specified in Table 4. Address A22 has the
special function of directing reads and writes to the flash
memory (A22=1) or to the register space (A22=0).
A49LF040
PRELIMINARY (August, 2004, Version 0.1)
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AMIC Technology, Corp.
Table 2: LPC Read Cycle
1. Field contents are valid on the rising edge of the present clock cycle.

LPC Single-Byte Read Waveforms
LCLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
START
ADDRESS
TAR0
TAR1
SYNC
DATA
TAR0
TAR1
LFRAME#
LAD[3:0]
CYCTYPE +
DIR
Clock
Cycle
Field
Name
Field Contents
LAD[3:0]
1
LAD[3:0]
Direction
Comments
1 START 0000
IN
LFRAME# must be active (low) for the part to respond. Only the last
start field (before LFRAME# transitioning high) should be recognized.
2
CYCTYPE
+ DIR
010X IN
Indicates the type of cycle. Bits 3:2 must be "01b" for memory cycle.
Bit 1 indicates the type of transfer "0" for Read. Bit 0 is reserved.
3-10 ADDRESS
YYYY
IN
Address Phase for Memory Cycle. LPC protocol supports a 32-bit
address phase. YYYY is one nibble of the entire address. Addresses
are transferred most-significant nibble first. See Table 4 for address
bits definition and Table 5 for valid memory address range.
11 TAR0
1111
IN
then Float
In this clock cycle, the host has driven the bus to all 1s and then floats
the bus. This is the first part of the bus "turnaround cycle."
12 TAR1 1111(float) Float
then OUT
The A49LF040 takes control of the bus during this cycle.
13 SYNC
0000
OUT
The A49LF040 outputs the value 0000b indicating that data will be
available during the next clock cycle.
14
DATA
ZZZZ
OUT
This field is the least-significant nibble of the data byte.
15
DATA
ZZZZ
OUT
This field is the most-significant nibble of the data byte.
16 TAR0
1111
IN
then Float
In this clock, the host has driven the bus to all 1s and then floats the
bus. This is the first part of the bus "turnaround cycle."
17 TAR1 1111(float) Float
then OUT
The A49LF040 takes control of the bus during this cycle.
A49LF040
PRELIMINARY (August, 2004, Version 0.1)
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AMIC Technology, Corp.
Table 3: LPC Write Cycle
1. Field contents are valid on the rising edge of the present clock cycle.

LPC Write Waveforms
LCLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
START
ADDRESS
TAR0
TAR1
SYNC
DATA
TAR0
TAR1
LFRAME#
LAD[3:0]
CYCTYPE
+ DIR
Clock
Cycle
Field
Name
Field Contents
LAD[3:0]
1
LAD[3:0]
Direction
Comments
1 START 0000
IN
LFRAME# must be active (low) for the part to respond. Only the last
start field (before LFRAME# transitioning high) should be
recognized.
2
CYCTYPE
+ DIR
010X IN
Indicates the type of cycle. Bits 3:2 must be "01b" for memory cycle.
Bit 1 indicates the type of transfer "1" for Write. Bit 0 is reserved.
3-10 ADDRESS
YYYY
IN
Address Phase for Memory Cycle. LPC protocol supports a 32-bit
address phase. YYYY is one nibble of the entire address.
Addresses are transferred most-significant nibble first. See Table 4
for address bits definition and Table 5 for valid memory address
range.
11 DATA ZZZZ
IN
This field is the least-significant nibble of the data byte.
12 DATA ZZZZ
IN
This field is the most-significant nibble of the data byte.
13 TAR0
1111
IN
then Float
In this clock cycle, the host has driven the bus to all `1's and then
floats the bus. This is the first part of the bus "turnaround cycle."
14 TAR1 1111(float)
Float
then OUT
The A49LF040 takes control of the bus during this cycle.
15 SYNC
0000
OUT
The A49LF040 outputs the values 0000, indicating that it has
received data or a flash command.
16 TAR0
1111
OUT
then Float
In this clock cycle, the A49LF040 has driven the bus to all `1's and
then floats the bus. This is the first part of the bus "turnaround
cycle."
17 TAR1 1111(float) Float
then IN
Host resumes control of the bus during this cycle.
A49LF040
PRELIMINARY (August, 2004, Version 0.1)
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AMIC Technology, Corp.
ID mismatch:
The A49LF040 will compare ID bits in the
address field with the hardware ID strapping. If there is a
mismatch, the device will ignore the cycle. Refer to Table 6
Multiple Device Selection Configuration for detail.
Device Memory Hardware Write Protection
The Top Boot Lock (TBL#) and Write Protect (WP#) pins are
provided for hardware write protection of device memory in
the A49LF040. The TBL# pin is used to write protect the top
boot block (64 Kbytes) at the highest flash memory address
range for the A49LF040. WP# pin write protects the
remaining blocks in the flash memory. An active low signal at
the TBL# pin prevents Program and Erase operations of the
top boot block. The WP# pin serves the same function for the
remaining blocks of the device memory. The TBL# and WP#
pins write protection functions operate independently of one
another. Both TBL# and WP# pins must be set to their
required protection states prior to starting a Program or Erase
operation. A logic level change occurring at the TBL# or WP#
pin during a Program or Erase operation could cause
unpredictable results. TBL# and WP# pins cannot be left
unconnected. Clearing the Write-Lock bit in any register
when WP# is low will have no functional effect, even though
the register may indicate that the block is no longer locked.
Reset
A V
IL
on INIT# or RST# pin initiates a device reset. INIT# and
RST# pins have the same function internally. It is required to
drive INIT# or RST# pins low during a system reset to ensure
proper CPU initialization. During a Read operation, driving
INIT# or RST# pins low deselects the device and places the
output drivers, LAD[3:0], in a high-impedance state. The
reset signal must be held low for a minimal duration of time
T
RSTP
. A reset latency will occur if a reset procedure is
performed during a Program or Erase operation. See Table
19, Reset Timing Parameters for more information. A device
reset during an active Program or Erase will abort the
operation and memory contents may become invalid due to
data being altered or corrupted from an incomplete Erase or
Program operation. In this case, the device can take up to
T
RSTE
to abort a Program or Erase operation.
Write Operation Status Detection
The A49LF040 device provides two software means to detect
the completion of a Write (Program or Erase) cycle, in order
to optimize the system Write cycle time. The software
detection includes two status bits: Data# Polling (I/O
7
) and
Toggle Bit (I/O
6
). The End-of-Write detection mode is
incorporated into the LPC Read cycle. The actual completion
of the nonvolatile write is asynchronous with the system;
therefore, either a Data# Polling or Toggle Bit read may be
simultaneous with the completion of the Write cycle. If this
occurs, the system may possibly get an erroneous result, i.e.,
valid data may appear to conflict with either I/O
7
or I/O
6
. In
order to prevent spurious rejection, if an erroneous result
occurs, the software routine should include a loop to read the
accessed location an additional two times. If both reads are
valid, then the device has completed the Write cycle,
otherwise the rejection is valid.
Data# Polling (I/O
7
)
When the A49LF040 device is in the internal Program
operation, any attempt to read I/O
7
will produce the
complement of the true data. Once the Program operation is
completed, I/O
7
will produce true data. Note that even though
I/O
7
may have valid data immediately following the
completion of an internal Write operation, the remaining data
outputs may still be invalid: valid data on the entire data bus
will appear in subsequent successive Read cycles after an
interval of 1 µs. During internal Erase operation, any attempt
to read I/O
7
will produce a `0'. Once the internal Erase
operation is completed, I/O
7
will produce a `1'. Proper status
will not be given using Data# Polling if the address is in the
invalid range.
Toggle Bit (I/O
6
)
During the internal Program or Erase operation, any
consecutive attempts to read I/O
6
will produce alternating
`0's and `1's, i.e., toggling between 0 and 1. When the
internal Program or Erase operation is completed, the
toggling will stop.
Multiple Device Selection
The four ID pins, ID[3:0], allow multiple devices to be
attached to the same bus by using different ID strapping in a
system. When the A49LF040 is used as a boot device, ID[3:0]
must be strapped as 0000, all subsequent devices should
use a sequential up-count strapping (i.e. 0001, 0010, 0011,
etc.). The ID bits in the address field are inverse of the
hardware strapping. The address bits [A23, A21:A19] for
A49LF004 are used to select the device with proper IDs. See
Table 6 for IDs. The A49LF040 will compare the strapping
values, if there is a mismatch, the device will ignore the
remainder of the cycle and go into standby mode. Since there
is no ID support in A/A Mux mode, to program multiple
devices a stand-alone PROM programmer is recommended.
REGISTERS
There are two types of registers available on the A49LF040,
the General Purpose Inputs Register, and the JEDEC ID
Registers. These registers appear at their respective address
location in the 4 GByte system memory map. Unused register
locations will read as 00H. Any attempt to read or write any
register during an internal Write operation will be ignored.
Refer to Table 7 for the LPC register memory map.
General Purpose Inputs Register
The GPI_REG (General Purpose Inputs Register) passes the
state of GPI[4:0] pins at power-up on the A49LF040. It is
recommended that the GPI[4:0] pins be in the desired state
before LFRAME# is brought low for the beginning of the next
bus cycle, and remain in that state until the end of the cycle.
There is no default value since this is a pass-through register.
See Table 8
for the GPI_REG bits and function, and Table 9
for memory address locations for its respective device
strapping.

A49LF040
PRELIMINARY (August, 2004, Version 0.1)
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AMIC Technology, Corp.
Table 4: Address Bit Definition

Table 5: Address Decoding Range


Table 6: Multiple Device Selection Configuration


Table 7: LPC Register Memory Map

A
31
:A
23
A
23
A
22
A
21
:A
19
A
18
:A
0
1111 1111b
ID[3]
1 = Memory access
0 = Register access
ID[2:0] Device
memory address
ID Strapping
Device Access
A
21
:A
19
Memory
Size
Memory Access
FFFF FFFFH: FFC0 0000H
4 MByte
Device #0 ­ 7
Register Access
FFBF FFFFH: FF80 0000H
4 MByte
Memory Access
FF7F FFFFH: FF40 0000H
4 MByte
Device #8 - 15
Register Access
FF3F FFFFH: FF00 0000H
4 MByte
Address Bits Decoding
Device#
Hardware Strapping
ID[3:0]
A23 A21 A20 A19
0 (Boot device)
0000
1
1
1
1
1
0001
1 1 1 0
2
0010
1 1 0 1
3
0011
1 1 0 0
4
0100
1 0 1 1
5
0101
1 0 1 0
6
0110
1 0 0 1
7
0111
1 0 0 0
8
1000
0 1 1 1
9
1001
0 1 1 0
10
1010
0 1 0 1
11
1011
0 1 0 0
12
1100
0 0 1 1
13
1101
0 0 1 0
14
1110
0 0 0 1
15
1111
0 0 0 0
Memory
Address
Mnemonic Register
Name
Default
Type
FFBC0100h
GPI_REG
LPC General Purpose Input Register
N/A
R
FFBC0000h
MANUF_REG
Manufacturer ID Register
37h
R
FFBC0001h
DEV_REG
Device ID Register
9Dh
R
FFBC0003h CONT_REG
Continuation ID Register
7Fh
R
A49LF040
PRELIMINARY (August, 2004, Version 0.1)
10
AMIC Technology, Corp.
JEDEC ID Registers
The JEDEC ID registers identify the device as A49LF040 and
manufacturer as SST in LPC mode. See Table 9 for memory
address locations for its respective JEDEC ID location.








Table 8: General Purpose Inputs Register
Pin Number
Bit
Bit
Function
32-PLCC 32-TSOP
7:5
- Reserved - -
4
GPI[4]
GPI_REG Bit 4
30
6
3
GPI[3]
GPI_REG Bit 3
3
11
2
GPI[2]
GPI_REG Bit 2
4
12
1
GPI[1]
GPI_REG Bit 1
5
13
0
GPI[0]
GPI_REG Bit 0
6
14

Table 9 Memory Map Register Addresses for A49LF040
JEDEC ID
Device# Hardware
Strapping
ID[3:0]
GPI_REG
Manufacturer
Continuation Device
0 (Boot device)
0000
FFBC 0100H
FFBC 0000H
FFBC 0003H
FFBC 0001H
1
0001
FFB4 0100H
FFB4 0000H
FFB4 0003H
FFB4 0001H
2
0010
FFAC 0100H
FFAC 0000H
FFAC 0003H
FFAC 0001H
3
0011
FFA4 0100H
FFA4 0000H
FFA4 0003H
FFA4 0001H
4
0100
FF9C 0100H
FF9C 0000H
FF9C 0003H
FF9C 0001H
5
0101
FF94 0100H
FF94 0000H
FF94 0003H
FF94 0001H
6
0110
FF8C 0100H
FF8C 0000H
FF8C 0003H
FF8C 0001H
7
0111
FF84 0100H
FF84 0000H
FF84 0003H
FF84 0001H
8
1000
FF3C 0100H
FF3C 0000H
FF3C 0003H
FF3C 0001H
9
1001
FF34 0100H
FF34 0000H
FF34 0003H
FF34 0001H
10
1010
FF2C 0100H
FF2C 0000H
FF2C 0003H
FF2C 0001H
11
1011
FF24 0100H
FF24 0000H
FF24 0003H
FF24 0001H
12
1100
FF1C 0100H
FF1C 0000H
FF1C 0003H
FF1C 0001H
13
1101
FF14 0100H
FF14 0000H
FF14 0003H
FF14 0001H
14
1110
FF0C 0100H
FF0C 0000H
FF0C 0003H
FF0C 0001H
15
1111
FF04 0100H
FF04 0000H
FF04 0003H
FF04 0001H
A49LF040
PRELIMINARY (August, 2004, Version 0.1)
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AMIC Technology, Corp.
ADDRESS/ADDRESS MULTIPLEXED (A/A
MUX) MODE

Device Operation
Commands are used to initiate the memory operation
functions of the device. The data portion of the software
command sequence is latched on the rising edge of WE#.
During the software command sequence the row address is
latched on the falling edge of R/C# and the column address
is latched on the rising edge of R/C#. Refer to Table 8 and
Table 9 for operation modes and the command sequence.
Read
The Read operation of the A49LF040 device is controlled by
OE#. OE# is the output control and is used to gate data from
the output pins. Refer to the Read cycle timing diagram,
Figure 10 for further details.
Reset
A V
IL
on RST# pin initiates a device reset.


Byte-Program Operation
The A49LF040 device is programmed on a byte-by-byte
basis. Before programming, one must ensure that the block,
in which the byte which is being programmed exists, is fully
erased. The Byte-Program operation is initiated by executing
a four-byte command load sequence for Software Data
Protection with address and data in the last byte sequence.
During the Byte-Program operation, the row address (A10-A0)
is latched on the falling edge of R/C# and the column
Address (A18-A11) is latched on the rising edge of R/C#. The
data bus is latched in the rising edge of WE#. See Figure 11
for Program operation timing diagram, Figure 14 for timing
waveforms, and Figure 19 for its flowchart. During the
Program operation, the only valid reads are Data# Polling
and Toggle Bit. During the internal Program operation, the
host is free to perform additional tasks. Any commands
written during the internal Program operation will be ignored.

Table 10: A/A Mux Mode Operation Selection
Block-Erase Operation
The Block-Erase Operation allows the system to erase the
device in 64 KByte uniform block size for the A49LF040. The
Block-Erase operation is initiated by executing a six-byte
command load sequence for Software Data Protection with
Block-Erase command (30H or 50H) and block address. The
internal Block-Erase operation begins after the sixth WE#
pulse. The End-of-Erase can be determined using either
Data# Polling or Toggle Bit methods. See Figure 15 for
timing waveforms. Any commands written during the Block-
Erase operation will be ignored.
Chip-Erase
The A49LF040 device provides a Chip-Erase operation only
in A/A Mux mode, which allows the user to erase the entire
memory array to the `1's state. This is useful when the entire
device must be quickly erased. The Chip-Erase operation is
initiated by executing a six-byte Software Data Protection
command sequence with Chip-Erase command (10H) with
address 5555H in the last byte sequence. The internal Erase
operation begins with the rising edge of the sixth WE#.

During the internal Erase operation, the only valid read is
Toggle Bit or Data# Polling. See Table 11 for the command
sequence, Figure 16 for timing diagram, and Figure 21 for
the flowchart. Any commands written during the Chip-Erase
operation will be ignored.

Write Operation Status Detection
The A49LF040 device provides two software means to detect
the completion of a Write cycle, in order to optimize the
system Write cycle time. The software detection includes two
status bits: Data# Polling (I/O
7
) and Toggle Bit (I/O
6
). The
End-of-Write detection mode is enabled after the rising edge
of WE# which initiates the internal Write operation. The
actual completion of the nonvolatile write is asynchronous
with the system; therefore, either a Data# Polling or Toggle
Bit read may be simultaneous with the completion of the
Write cycle. If this occurs, the system may possibly get an
erroneous result, i.e., valid data may appear to conflict with
either I/O
7
or I/O
6
. In order to prevent spurious rejection, if an
erroneous result occurs, the software routine should include
a loop to read the accessed location an additional two times.
If both reads are valid, then the device has completed the
Write cycle, otherwise the rejection is valid.
Data# Polling (I/O
7
)
When the A49LF040 device is in the internal Program
operation, any attempt to read I/O
7
will produce the
complement of the true data. Once the Program operation is
completed, I/O
7
will produce true data. Note that even though
I/O
7
may have valid data immediately following the
completion of an internal Write operation, the remaining data
outputs may still be invalid: valid data on the entire data bus
will appear in subsequent successive Read cycles after an
interval of 1 µs. During internal Erase operation, any attempt
Mode RST#
OE#
WE#
Address
I/O
Read V
IH
V
IL
V
IH
A
IN
D
OUT
Write V
IH
V
IH
V
IL
A
IN
D
IN
Standby V
IH
V
IH
V
IH
X
High
Z
Output Disable
V
IH
V
IH
X
X
High
Z
Reset V
IL
X X
X
High
Z
A18 ­ A2 = X, A1 = V
IL
, A0 = V
IL
Manufacturer
ID
A18 ­ A2 = X, A1 = V
IL
, A0 = V
IH
Device
ID
Product Identification
V
IH
V
IL
V
IH
A18 ­ A2 = X, A1 = V
IH
, A0 = V
IH
Continuation
ID
A49LF040
PRELIMINARY (August, 2004, Version 0.1)
12
AMIC Technology, Corp.
to read I/O
7
will produce a `0'. Once the internal Erase
operation is completed, I/O
7
will produce a `1'. The Data#
Polling is valid after the rising edge of fourth WE# pulse for
Program operation. For Block- or Chip-Erase, the Data#
Polling is valid after the rising edge of sixth WE# pulse. See
Figure 12 for Data# Polling timing diagram. Proper status will
not be given using Data# Polling if the address is in the
invalid range.
Toggle Bit (I/O
6
)
During the internal Program or Erase operation, any
consecutive attempts to read I/O
6
will produce alternating `0's
and `1's, i.e., toggling between 0 and 1. When the internal
Program or Erase operation is completed, the toggling will
stop. The device is then ready for the next operation. The
Toggle Bit is valid after the rising edge of fourth WE# pulse
for Program operation. For Block- or Chip-Erase, the Toggle
Bit is valid after the rising edge of sixth WE# pulse. See
Figure 13 for Toggle Bit timing diagram.
Data Protection
The A49LF040 device provides both hardware and software
features to protect nonvolatile data from inadvertent writes.
Hardware Data Protection
Noise/Glitch Protection: A WE# pulse of less than 5 ns will
not initiate a Write cycle.
V
DD
Power Up/Down Detection: The Write operation is
inhibited when V
DD
is less than 1.5V.
Write Inhibit Mode: Forcing OE# low, WE# high will inhibit the
Write operation. This prevents inadvertent writes during
power-up or power-down.
Software Data Protection (SDP)
The A49LF040 provides the JEDEC approved Software Data
Protection scheme for all data alteration operation, i.e.,
Program and Erase. Any Program operation requires the
inclusion of a series of three-byte sequences. The three-byte
load sequence is used to initiate the Program operation,
providing optimal protection from inadvertent Write
operations, e.g., during the system power-up or power-down.
Any Erase operation requires the inclusion of a six-byte load
sequence. The A49LF040 device is shipped with the
Software Data Protection permanently enabled. See Table
11 for the specific software command codes. During SDP
command sequence, invalid commands will abort the device
to Read mode, within T
RC
.
Electrical Specifications
The AC and DC specifications for the LPC Interface signals
(LAD[3:0], LCLK, LFRAME#, and RST#) as defined in
Section 4.2.2 of the
PCI Local Bus Specification, Rev. 2.1
.
Refer to Table 12 for the DC voltage and current
specifications. Refer to the specifications on Table 13 to
Table 22 for Clock, Read/Write, and Reset operations.

Product Identification
The product identification mode identifies the Manufacturer
ID, Continuation ID, and Device ID of the A49LF040. See
Table 9 for detail information.





































A49LF040
PRELIMINARY (August, 2004, Version 0.1)
13
AMIC Technology, Corp.
Figure 3: System Memory Map and Device Memory Map for A49LF040
Block 7
(64K Bytes)
000000
00FFFF
010000
01FFFF
020000
02FFFF
030000
03FFFF
040000
04FFFF
050000
05FFFF
060000
06FFFF
070000
07FFFF
Block 6
(64K Bytes)
Block 5
(64K Bytes)
Block 4
(64K Bytes)
Block 3
(64K Bytes)
Block 2
(64K Bytes)
Block 1
(64K Bytes)
Block 0
(64K Bytes)
TBL#
Device Memory
WP#
for Block 6 ~ 0
A49LF040




Table 11: Software Data Protection Command Definition
Notes:
1.
LPC Mode uses consecutive Write cycles to complete a command sequence; A/A Mux Mode uses consecutive bus cycles to complete a
command sequence.
2.
YYYY = A[31:16]. In LPC mode, during SDP command sequence, YYYY must be within memory address range specified in Table 5. In A/A
Mux mode, YYYY can be V
IL
or V
IH
, but no other value.
3.
Chip erase is available in A/A Mux Mode only.
4.
BA: Block Erase Address.
5.
Either 30H or 50H are acceptable for Block Erase.
6.
PA: Program Byte Address; PD: Byte data to be programmed.
7.
Both Product ID Exit commands are equivalent.

1
st
Cycle
(1)
2
nd
Cycle
3
rd
Cycle
4
th
Cycle
5
th
Cycle
6
th
Cycle
Command
Bus
Cycles
Addr
(2)
Data Addr Data
Addr Data
Addr Data
Addr Data Addr Data
Block Erase
6
YYYY 5555H
AAH
YYYY 2AAAH
55H
YYYY 5555H
80H
YYYY 5555H
AAH
YYYY 2AAAH
55H
BA
(4)
30H/50H
(5)
Chip Erase
(3)
6
YYYY 5555H
AAH
YYYY 2AAAH
55H
YYYY 5555H
80H
YYYY 5555H
AAH
YYYY 2AAAH
55H
YYYY 5555H
10H
Byte Program
4
YYYY 5555H
AAH
YYYY 2AAAH
55H
YYYY 5555H
A0H
PA
(6)
PD
(6)
Product ID Entry
3
YYYY 5555H
AAH
YYYY 2AAAH
55H
YYYY 5555H
90H
Product ID Exit
(7)
1
XXXX XXXXH
F0H
Product ID Exit
(7)
3
YYYY 5555H
AAH
YYYY 2AAAH
55H
YYYY 5555H
F0H
A49LF040
PRELIMINARY (August, 2004, Version 0.1)
14
AMIC Technology, Corp.
Operating Range

AC Conditions of Test


Table 12: DC Operating Characteristics (All Interfaces)
Notes:
1. I
DD
active while Erase or Program is in progress.
2. The device is in Ready Mode when no activity is on the LPC bus.
3. Do not violate processor or chipset specification regarding INIT# voltage.

Table 13: Recommended System Power-Up Timings
Symbol
Parameter Min
Units
T
PU-READ
(1)
Power-up to Read Operation
100
µs
T
PU-WRITE
(1)
Power-up to Write Operation
100
µs
Notes:
1.
This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
Range Ambient
Temperature
V
DD
Commercial 0
°C to +85°C 3.0-3.6V
Input Rise/Fall Time . . . . . . . . . . . . . . . . . . . . . . 3ns
Output Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . CL = 30pF
Limits
Symbol Parameter
Min Max
Units
Test Conditions
Active V
DD
Current:
Read
12
mA
I
DD
Active V
DD
Current:
Write
(1)
24
mA
Address Input=V
IL
/V
IH
, at F=1/T
RC
Min, V
DD
=V
DD
Max(A/A
Mux Mode)
OE#=V
IH
, WE#=V
IH
I
SB
Standby V
DD
Current
(LPC Mode)
100
µA
LFRAME#=0.9V
DD
,f=33MHz,V
DD
=V
DD
Max, All other
inputs 0.9V
DD
or 0.1V
DD
I
RY
(2)
Ready Mode V
DD
Current
(LPC Mode)
10
mA
LFRAME#=V
IL
,f=33MHz,V
DD
=V
DD
Max, All other inputs
0.9V
DD
or 0.1V
DD
I
I
Input Current for Mode
and ID[3:0] Pins
100
µA
V
IN
=GND to V
DD
, V
DD
=V
DD
Max
I
LI
Input Leakage Current
1
µA V
IN
=GND to V
DD
, V
DD
=V
DD
Max
I
LO
Output Leakage Current
1
µA V
OUT
=GND to V
DD
, V
DD
=V
DD
Max
V
IHI
(3)
INIT# Input High Voltage
1.0
V
DD
+0.5
V V
DD
=V
DD
Max
V
ILI
(3)
INIT# Input Low Voltage
-0.5
0.4
V
V
DD
=V
DD
Min
V
IH
Input High Voltage
0.5V
DD
V
DD
+0.5
V V
DD
=V
DD
Max
V
IL
Input Low Voltage
-0.5
0.3V
DD
V V
DD
=V
DD
Min
V
OL
Output Low Voltage
0.1V
DD
V IOL=1500
µA, V
DD
=V
DD
Min
V
OH
Output High Voltage
0.9V
DD
V
IOH=-500
µA, V
DD
=V
DD
Min
A49LF040
PRELIMINARY (August, 2004, Version 0.1)
15
AMIC Technology, Corp.
Table 14: Pin Impedance (V
DD
=3.3V, Ta=25
°C, f=1MHz, other pins open)
Parameter
Description Test
Condition
Max
C
I/O
(1)
I/O Pin Capacitance
V
I/O
= 0V
12pF
C
IN
(1)
Input
Capacitance
V
IN
= 0V
12pF
L
PIN
(2)
Pin
Inductance
20nH
Notes:
1. This parameter is measured only for initial qualification and after a design or process change that could affect this
parameter.
2. Refer to PCI specifications.
Table 15: Clock Timing Parameters
Symbol
Parameter Min
Max
Units
T
CYC
LCLK Cycle Time
30
ns
T
HIGH
LCLK High Time
11
ns
T
LOW
LCLK Low Time
11
ns
LCLK Slew Rate (peak-to-peak)
1
4
V/ns

Figure 4: LCLK Waveform
0.2 V
DD
0.5 V
DD
0.4 V
DD
0.3 V
DD
0.6 V
DD
0.4 V
DD
Peak-to-Peak
(Min)
T
CYC
T
LOW
T
HIGH

Table 16: LPC Mode Read/Write Cycle Timing Parameters, V
DD
=3.0-3.6V
Symbol
Parameter Min
Max
Units
T
SU
Input Set Up Time to LCLK Rising
7
ns
T
DH
LCLK Rising to Data Hold Time
0
ns
T
VAL
LCLK Rising to Data Valid
2
11
ns
T
ON
LCLK Rising to Active (Float to Active Delay)
2
ns
T
OFF
LCLK Rising to Inactive (Active to Float Delay)
28
ns


A49LF040
PRELIMINARY (August, 2004, Version 0.1)
16
AMIC Technology, Corp.
Table 17: LPC Mode Interface Measurement Condition Parameters
Symbol
Value Units
V
TH
0.6
V
DD
V
V
TL
0.2
V
DD
V
V
TEST
0.4
V
DD
V
V
MAX
0.4
V
DD
V
Input Signal Edge Rate
1V/ns

Figure 5: Input Timing Parameters
V
TL
V
TH
T
SU
V
TEST
LCLK
LAD[3:0]
(Valid Input Data)
V
MAX
Valid Inputs
T
DH


Figure 6: Output Timing Parameters
V
TL
V
TH
T
ON
T
OFF
T
VAL
V
TEST
LCLK
LAD[3:0]
(Valid Output Data)
LAD[3:0]
(Float Output Data)

A49LF040
PRELIMINARY (August, 2004, Version 0.1)
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AMIC Technology, Corp.
Table 18: LPC Mode Interface AC Input/Output Characteristics
Symbol
Parameter Test
Conditions
Min Max
Units
0 < V
OUT
0.3V
DD
-12
V
DD
mA
0.3V
DD
< V
OUT
0.9V
DD
-17.1(V
DD
-V
OUT
) mA
I
OH
(AC)
Switching Current High
0.7V
DD
< V
OUT
V
DD
Equation
C
mA
(Test
Point)
V
OUT
= 0.7V
DD
-32
V
DD
mA
V
DD
> V
OUT
0.6V
DD
16V
DD
mA
0.6V
DD
> V
OUT
> 0.1V
DD
26.7V
OUT
mA
I
OL
(AC)
Switching Current Low
0.18V
DD
> V
OUT
> 0
Equation D
mA
(Test
Point)
V
OUT
=0.18V
DD
38V
DD
mA
I
CL
Low Clamp Current
-3 < V
IN
-1
-25+(V
IN
+1)/0.015 mA
I
CH
High Clamp Current
V
DD
+4 > V
IN
> V
DD
+1 25+(V
IN
-V
DD
-1)/0.015
mA
slewr
Output Rise Slew Rate
0.2V
DD
-0.6V
DD
load
1
4
V/ns
slewf
Output Fall Slew Rate
0.6V
DD
-0.2V
DD
load
1
4
V/ns
Notes:
1. See PCI specification.
2.
PCI specification output load is used.
Table 19: LPC Mode Interface Reset Timing Parameters, V
DD
=3.0-3.6V
Symbol
Parameter Min
Max
Units
T
PRST
V
DD
Stable to Reset Low
1
ms
T
KRST
Clock Stable to Reset Low
100
µs
T
RSTP
RST# Pulse Width
100
ns
T
RSTF
RST# Low to Output Float
48
ns
T
RST
(1)
RST# High to LFRAME# Low
1
µs
T
RSTE
RST# Low to Reset During Erase or Program
10
µs
RST# or INIT# Slew Rate
50
mV/ns
Notes:
1. There will be a latency of T
RSTE
if a reset procedure is performed during a Program or Erase operation.
Figure 7: Reset Timing Diagram
T
KRST
T
PRST
T
RST
T
RSTF
T
RSTE
T
RSTP
Program or Erase
Operation Aborted
V
DD
LCLK
RST#/INIT#
LAD[3:0]
LFRAME#
A49LF040
PRELIMINARY (August, 2004, Version 0.1)
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AMIC Technology, Corp.
Figure 8: A/A Mux Mode AC Input/Output Reference Waveforms
V
IT
V
OT
Reference Points
INPUT
OUTPUT
V
IHT
V
ILT
AC test inputs are driven at V
IHT
(0.9V
DD
) for a logic HIGH and V
ILT
(0.1V
DD
) for a
logic LOW. Measurement reference points for inputs and outputs are V
IT
(0.5V
DD
)
and V
OT
(0.5V
DD
). Input rise and fall times (10% <-> 90%) are < 5ns
Note:
V
IT
: V
INPUT
Test
V
OT
: V
OUTPUT
Test
V
IHT
: V
INPUT
HIGH Test
V
ILT
: V
INPUT
LOW Test


Figure 9: A/A Mux Mode Test Load Condition
CL=30pF
TO TESTER
TO DUT
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PRELIMINARY (August, 2004, Version 0.1)
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AMIC Technology, Corp.
A/A MUX MODE AC CHARACTERISTICS
Table 20: Read Cycle Timing Parameters V
DD
=3.0-3.6V
Symbol
Parameter Min
Max
Units
T
RC
Read Cycle Time
270
ns
T
RST
RST# High to Row Address Setup
1
µs
T
AS
R/C# Address Set-up Time
45
ns
T
AH
R/C# Address Hold Time
45
ns
T
AA
Address
Access
Time
120 ns
T
OE
Output Enable Access Time
60
ns
T
OLZ
OE# Low to Active Output
0
ns
T
OHZ
OE# High to High-Z Output
35
ns
T
OH
Output Hold from Address Change
0
ns

Table 21: Program/Erase Cycle Timing Parameters, V
DD
=3.0-3.6V
Symbol
Parameter Min
Max
Units
T
RST
RST# High to Row Address Setup
1
µs
T
AS
R/C# Address Setup Time
50
ns
T
AH
R/C# Address Hold Time
50
ns
T
CWH
R/C# to Write Enable High Time
50
ns
T
OES
OE# High Setup Time
20
ns
T
OEH
OE# High Hold Time
20
ns
T
OEP
OE# to Data# Polling Delay
40
ns
T
OET
OE# to Toggle Bit Delay
40
ns
T
WP
WE# Pulse Width
100
ns
T
WPH
WE# Pulse Width High
100
ns
T
DS
Data Setup Time
50
ns
T
DH
Data Hold Time
5
ns
T
IDA
Product ID Access and Exit Time
150
ns
T
BP
Byte Programming Time
300
µs
T
BE
Block Erase Time
8
s
T
SCE
Chip Erase Time
10
s

Table 22: Reset Timing Parameters, V
DD
=3.0-3.6V
Symbol
Parameter Min
Max
Units
T
PRST
V
DD
Stable to Reset Low
1
ms
T
RSTP
RST# Pulse Width
100
ns
T
RSTF
RST# Low to Output Float
48
ns
T
RST
(1)
RST# High to LFRAME# Low
1
µs
T
RSTE
RST# Low to Reset During Erase or Program
10
µs
1. There will be a reset latency of TRSTE if a reset procedure is performed during a Program or Erase operation.
A49LF040
PRELIMINARY (August, 2004, Version 0.1)
20
AMIC Technology, Corp.
Figure 10: A/A Mux Mode Read Cycle Timing Diagram
T
RST
RST#
Address
WE#
OE#
I/O
7
-I/O
0
T
RSTP
Row Address
Column Address
Row Address
Column Address
T
RC
T
AS
T
AH
T
AS
T
AH
V
IH
T
OE
T
AA
T
OHZ
T
OH
T
OLZ
Data Valid
High-Z
High-Z
R/C#


Figure 11: A/A Mux Mode Write Cycle Timing Diagram
T
RST
RST#
Address
OE#
WE#
I/O
7
-I/O
0
T
RSTP
Row Address
Column Address
T
AS
T
AH
T
AS
T
AH
T
DS
T
WP
Data Valid
High-Z
R/C#
T
OES
T
WPH
T
DH
T
OEH
T
CWH

A49LF040
PRELIMINARY (August, 2004, Version 0.1)
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AMIC Technology, Corp.
Figure 12: A/A Mux Mode Data# Polling Timing Diagram
Address
WE#
OE#
I/O
7
Row
Address
Column
Address
High-Z
R/C#
Write Operation
Complete
Data
In
Write Operation In
Progress
Final Input Command
Status Bit
Data
T
OEP
Command Input
Row
Address
Column
Address
Row
Address
Column
Address
Row
Address
Column
Address
Data#
Data#
Data
Status Bit

Figure 13: A/A Mux Mode Toggle Bit Timing Diagram
Address
WE#
OE#
I/O
6
Row
Address
Column
Address
High-Z
R/C#
Write Operation
Complete
Data
In
Write Operation In
Progress
Final Input Command
Status Bit
Data
T
OET
Command Input
Row
Address
Column
Address
Row
Address
Column
Address
Row
Address
Column
Address
Data
Status Bit


A49LF040
PRELIMINARY (August, 2004, Version 0.1)
22
AMIC Technology, Corp.
Figure 14: A/A Mux Mode Byte Program Timing Diagram
Address
OE#
WE#
I/O
7
-I/O
0
High-Z
R/C#
AA
Byte Program Operation In Progress
T
WP
Byte Program Command Input
55
A0
PD
T
WPH
T
BP
5555
2AAA
5555
PA
PA = Byte Program Address
PD = Byte Program Data
Four-Byte Byte Program Command Sequence


Figure 15: A/A Mux Mode Block Erase Timing Diagram
Address
OE#
WE#
I/O
7
-I/O
0
High-Z
R/C#
AA
Block Erase Operation In Progress
T
WP
Block Erase Command Input
T
WPH
5555
2AAA
5555
5555
BA = Block Address
Six-Byte Block Erase Command Sequence
55
80
AA
55
30/50
2AAA
BA
T
BE

A49LF040
PRELIMINARY (August, 2004, Version 0.1)
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AMIC Technology, Corp.
Figure 16: A/A Mux Mode Chip Erase Timing Diagram
Address
OE#
WE#
I/O
7
-I/O
0
High-Z
R/C#
AA
Chip Erase Operation In Progress
T
WP
Chip Erase Command Input
T
WPH
5555
2AAA
5555
5555
Six-Byte Chip Erase Command Sequence
55
80
AA
55
10
2AAA
5555
T
SCE


Figure 17: A/A Mux Mode Product ID Entry and Read Timing Diagram
Address
OE#
WE#
I/O
7
-I/O
0
High-Z
R/C#
AA
T
WP
T
WPH
5555
2AAA
5555
Three-Byte Product ID Entry
Command Sequence
55
90
37
95
7F
0000
0001
0003
T
AA
T
IDA


Figure 18: A/A Mux Mode Product ID Exit and Reset Timing Diagram
Address
OE#
WE#
I/O
7
-I/O
0
High-Z
R/C#
AA
T
WP
T
WPH
5555
2AAA
5555
Three-Byte Product ID Exit and
Reset Command Sequence
55
F0
A49LF040
PRELIMINARY (August, 2004, Version 0.1)
24
AMIC Technology, Corp.
Figure 19: Automatic Byte Program Algorithm
Start
Write Command
Address: 5555H
Data: AAH
Write Command
Address: 2AAAH
Data: 55H
Write Command
Address: 5555H
Data: A0H
Write Command
Address: PA
Data: PD
I/O
7
= Data ?
Or
I/O
6
Stop Toggle?
Byte Program
Completed
NO
YES
PA: Byte Program Address
PD: Byte Program Data

A49LF040
PRELIMINARY (August, 2004, Version 0.1)
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AMIC Technology, Corp.
Figure 20: Automatic Block Erase Algorithm
Start
Write Command
Address: 5555H
Data: AAH
Write Command
Address: 2AAAH
Data: 55H
Write Command
Address: 5555H
Data: 80H
Write Command
Address: 5555H
Data: AAH
I/O
7
= Data ?
Or
I/O
6
Stop Toggle?
Block Erase
Completed
NO
YES
BA: Block Address
Write Command
Address: 2AAAH
Data: 55H
Write Command
Address: BA
Data: 30H or 50H

A49LF040
PRELIMINARY (August, 2004, Version 0.1)
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AMIC Technology, Corp.
Figure 21: Automatic Chip Erase Algorithm
Start
Write Command
Address: 5555H
Data: AAH
Write Command
Address: 2AAAH
Data: 55H
Write Command
Address: 5555H
Data: 80H
Write Command
Address: 5555H
Data: AAH
I/O
7
= Data ?
Or
I/O
6
Stop Toggle?
Chip Erase
Completed
NO
YES
Write Command
Address: 2AAAH
Data: 55H
Write Command
Address: 5555H
Data: 10H

A49LF040
PRELIMINARY (August, 2004, Version 0.1)
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AMIC Technology, Corp.
Figure 22: Product ID Command Flowchart
Start
Write Command
Address: 5555H
Data: AAH
Write Command
Address: 2AAAH
Data: 55H
Write Command
Address: 5555H
Data: 90H
Enter
Product ID Mode
Start
Write Command
Address: 5555H
Data: AAH
Write Command
Address: 2AAAH
Data: 55H
Write Command
Address: 5555H
Data: F0H
Exit
Product ID Mode
Write Command
Address: XXXXH
Data: F0H
OR
A49LF040
PRELIMINARY (August, 2004, Version 0.1)
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AMIC Technology, Corp.
Ordering Information
A49LF040T x - 33 C
Temperature Range
C = Commercial (0
°
C to +85
°
C)
Clock Frequency
33 = 33MHz
Package Type
L = PLCC
X = TSOP (8mmX14mm)
Device Number
4 Mbit LPC Flash Memory





Part No.
Clock Frequency
(MHz)
Boot Block
Location
Temperature
Range
Package Type
A49LF040TL-33
Top
0
°C to +85°C
32-pin PLCC
A49LF040TL-33F
Top
0
°C to +85°C
32-pin Pb-Free PLCC
A49LF040TX-33
Top 0
°C to +85°C
32-pin TSOP
(8mm X 14 mm)
A49LF040TX-33F
33
Top 0
°C to +85°C
32-pin Pb-Free TSOP
(8mm X 14 mm)
A49LF040
PRELIMINARY (August, 2004, Version 0.1)
29
AMIC Technology, Corp.
Package Information

PLCC 32L Outline Dimension
unit: inches/mm
A
1
A
2
A
e
D
y
H
D
D
13
G
D
b
1
b
G
E
c
5
14
20
21
29
30
32
1
4
E
H
E
L


Dimensions in inches
Dimensions in mm
Symbol
Min Nom
Max Min Nom
Max
A -
-
0.134
-
-
3.40
A
1
0.0185
- - 0.47
- -
A
2
0.105
0.110
0.115
2.67
2.80
2.93
b
1
0.026
0.028
0.032
0.66
0.71
0.81
b 0.016
0.018
0.021
0.41
0.46
0.54
C 0.008
0.010
0.014
0.20
0.254
0.35
D 0.547
0.550
0.553
13.89
13.97
14.05
E 0.447
0.450
0.453
11.35
11.43
11.51
e 0.044
0.050
0.056
1.12
1.27
1.42
G
D
0.490
0.510
0.530
12.45
12.95
13.46
G
E
0.390
0.410
0.430
9.91
10.41
10.92
H
D
0.585
0.590
0.595
14.86
14.99
15.11
H
E
0.485
0.490
0.495
12.32
12.45
12.57
L 0.075
0.090
0.095
1.91
2.29
2.41
y
- -
0.003
- -
0.075
0
° - 10°
0
° - 10°
Notes:
1. Dimensions D and E do not include resin fins.
2. Dimensions G
D
& G
E
are for PC Board surface mount pad pitch
design reference only.

A49LF040
PRELIMINARY (August, 2004, Version 0.1)
30
AMIC Technology, Corp.
Package Information
TSOP 32L TYPE I (8 X 14mm) Outline Dimensions
unit: inches/mm

e
Detail "A"
Detail "A"
b
D
1
E
D
L
A
A
2
c
A
1
Pin1
Gage Plane
0.
254
D y



Dimensions in inches
Dimensions in mm
Symbol
Min Nom
Max Min Nom
Max
A
- -
0.047
- -
1.20
A
1
0.002
- 0.006
0.05
- 0.15
A
2
0.037
0.039
0.041
0.95
1.00
1.05
b 0.0067
0.0087
0.0106
0.17
0.22
0.27
c 0.004
-
0.0083
0.10 - 0.21
E 0.311
0.315
0.319
7.90
8.00
8.10
e
- 0.0197
- - 0.50 -
D 0.543
0.551
0.559
13.80
14.00
14.20
D
1
0.484
0.488
0.492
12.30
12.40
12.50
L 0.020
0.024
0.028
0.50
0.60
0.70
y 0.000
- 0.003
0.00 - 0.076
0
°
3
°
5
°
0
°
3
°
5
°
Notes:
1. Dimension E does not include mold flash.
2. Dimension D
1
does not include interlead flash.
2. Dimension b does not include dambar protrusion.