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Part Number HFBR-5301

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215
Features
· Full Compliance with ANSI
X3T11 Fibre Channel
Physical and Signaling
Interface
· Multisourced 1x9 Package
Style with Duplex SC
Connector
· Wave Solder and Aqueous
Wash Process Compatibility
· Compatible with Various
Manufacturers FC-0 and
FC-1 Circuits
Applications
· Fibre Channel 12.5 MB/s
12-M6-LE-I Interfaces for
1300 nm LED Links to
1500 m
· Fibre Channel 25 MB/s
25-M6-LE-I Interfaces for
1300 nm LED Links to
1500 m
Description
The HFBR-5301 and HFBR-5302
Fibre Channel Transceivers from
Hewlett-Packard provide the
system designer with products to
implement Fibre Channel designs
for use in multimode fiber (MMF)
applications. These include the
12.5 MB/sec 12-M6-LE-I interface
and the 25 MB/sec 25-M6-LE-I
interface for 1300 nm LED links.
The products are produced in the
new industry standard 1x9 SIP
package style with a duplex SC
connector interface as defined in
the Fiber Channel ANSI FC-PH
standard document.
The HFBR-5301 is a 1300 nm
transceiver specified for use in
133 MBd, 12.5 MB/s, 12-M6-LE-I
Fibre Channel interfaces to either
62.5/125
µ
m or 50/125
µ
m
multimode fiber-optic cables.
The HFBR-5302 is a 1300 nm
transceiver specified for use in
266 MBd, 25 MB/s, 25-M6-LE-I
Fibre Channel interfaces to either
62.5/125
µ
m or 50/125
µ
m
multimode fiber-optic cables.
Transmitter Sections
The transmitter sections of the
HFBR-5301 and HFBR-5302
utilize 1300 nm InGaAsP LEDs.
These LEDs are packaged in the
optical subassembly portion of
the transmitter section. They are
driven by a custom silicon IC
which converts PECL logic
signals, into an analog LED drive
current.
Receiver Sections
The receiver sections of the
HFBR-5301 and HFBR-5302
utilize InGaAs PIN photo diodes
coupled to a custom silicon
transimpedance preamplifier IC.
Fibre Channel 133 MBd and
266 MBd Transceivers in Low
Cost 1x9 Package Style
Technical Data
HFBR-5301
133 MBd
HFBR-5302
266 MBd
These are packaged in the optical
subassembly portion of the
receiver.
These PIN/preamplifier combina-
tions are coupled to a custom
quantizer IC which provides the
final pulse shaping for the logic
output and the Signal Detect
function. The Data output is
differential. The Signal Detect
output is single-ended. Both data
and signal detect outputs are
PECL compatible, ECL refer-
enced (shifted) to a +5 volt
power supply.
Package
The overall package concept for
the HP Fibre Channel trans-
ceivers consists of three basic
elements; the two optical
subassemblies, an electrical
subassembly and the housing
with integral duplex SC connec-
tor interface. This is illustrated in
the block diagram in Figure 1.
5963-5608E (3/95)
216
The electrical subassembly con-
sists of a high volume multilayer
printed circuit board to which the
IC chips and various surface-
mount passive circuit elements
are attached.
The package includes internal
shields for the electrical and
optical subassemblies to insure
high immunity to external EMI
fields and low EMI emissions.
The outer housing, including the
duplex SC connector, is molded
of filled non-conductive plastic to
provide mechanical strength and
electrical isolation. The solder
posts are isolated from the circuit
design of the transceiver, while
they can be connected to a
ground plane on the circuit
board, doing so will have no
impact on circuit performance.
The transceiver is attached to a
printed circuit board with the
nine signal pins and the two
solder posts which exit the
bottom of the housing. The two
solder posts provide the primary
mechanical strength to withstand
the loads imposed on the trans-
ceiver by mating with the duplex
SC connectored fiber cables.
Application Information
The Applications Engineering
group in the Hewlett-Packard
Optical Communication Division
is available to assist with the
technical understanding and
design trade-offs associated with
these transceivers. You can
contact them through your local
Hewlett-Packard sales
representative.
The following information is
provided to answer some of the
most common questions about
the use of these parts.
Figure 1. Block Diagram.
DATA OUT
SIGNAL
DETECT
OUT
DATA IN
ELECTRICAL SUBASSEMBLY
QUANTIZER IC
DRIVER IC
TOP VIEW
PIN
DUPLEX SC
RECEPTACLE
OPTICAL
SUBASSEMBLIES
LED
PREAMP IC
The package outline drawing and
pin out are shown in Figures 2
and 3. The details of this package
outline and pin out are compliant
with the multisource definition of
the 1x9 single in-line package
(SIP). The low profile of the
Hewlett-Packard transceiver
design complies with the
maximum height allowed for the
duplex SC connector over the
entire length of the package.
The optical subassemblies utilize
a high volume assembly process
together with low cost lens
elements which result in a cost
effective building block.
Figure 2. Package Outline Drawing.
39.12
(1.540)
MAX.
AREA
RESERVED
FOR
PROCESS
PLUG
12.70
(0.500)
25.40
(1.000)
MAX.
12.70
(0.500)
10.35
(0.407)
MAX.
+ 0.25
- 0.05
+ 0.010
- 0.002
3.30 ± 0.38
(0.130 ± 0.015)
2.92
(0.115)
18.52
(0.729)
4.14
(0.163)
20.32
(0.800)
[8x(2.54/.100)]
23.55
(0.927)
16.70
(0.657)
17.32
(0.682)
20.32
(0.800)
23.32
(0.918)
0.46
(0.018)
NOTE 1
(9x)
ø
NOTE 1
0.87
(0.034)
23.24
(0.915)
15.88
(0.625)
NOTE 1: THE SOLDER POSTS AND ELECTRICAL PINS ARE PHOSPHOR BRONZE WITH TIN LEAD OVER NICKEL PLATING.
DIMENSIONS ARE IN MILLIMETERS (INCHES).
1.27
(0.050
+ 0.08
- 0.05
+ 0.003
- 0.002
0.75
(0.030
)
)
H
HFBR-5XXX
DATE CODE (YYWW)
SINGAPORE
217
Generic Cabling for Customer
Premises per DIS 11801
document and the EIA/TIA-568-A
Commercial Building Telecom-
munications Cabling Standard
per SP-2840.
Transceiver Signaling
Operating Rate Range and
BER Performance
For purposes of definition, the
symbol rate (Baud), also called
signaling rate, is the reciprocal of
the symbol time. Data rate (bits/
sec) is the symbol rate divided by
the encoding factor used to
encode the data (symbols/bit).
The specifications in this data
sheet have all been measured
using the standard Fibre Channel
symbol rates of 133 Mbd or
266 MBd.
The transceivers may be used for
other applications at signaling
rates different than specified in
this data sheet. Depending on the
actual signaling rate, there may
be some differences in optical
Figure 3. Pinout Diagram.
represents the remaining OPB at
any link length, which is available
for overcoming non-fiber cable
losses.
Hewlett-Packard LED technology
has produced 1300 nm LED
devices with lower aging charac-
teristics than normally associated
with these technologies in the
industry. The industry convention
is 1.5 dB aging for 1300 nm
LEDs. The HP LEDs will experi-
ence less than 1 dB of aging over
normal commercial equipment
mission life periods. Contact your
Hewlett-Packard sales represen-
tative for additional details.
Figure 4 was generated with a
Hewlett-Packard fiber optic link
model containing the current
industry conventions for fiber
cable specifications and the Fibre
Channel optical parameters.
These parameters are reflected in
the specified performance of the
transceiver in this data sheet.
This same model has been used
extensively in the ANSI and IEEE
committees, including the ANSI
X3T9.5 committee, to establish
the optical performance require-
ments for various fiber-optic
interface standards. The cable
parameters used come from the
ISO/IEC JTC1/SC 25/WG3
Figure 4. Optical Power Budget vs.
Fiber Optic Cable Length.
OPTICAL POWER BUDGET ­ dB
FIBER OPTIC CABLE LENGTH ­ km
4
2
0.5
8
1
0
6
0
2
1.5
1
3
5
7
HFBR-5301, 62.5/125µm
HFBR-5302, 62.5/125µm
HFBR-5301,
50/125µm
HFBR-5302, 50/125µm
Compatibility with Fibre
Channel FC-0/1 Chip Sets
The HFBR-5301 and HFBR-5302
transceivers are compatible with
various manufacturers FC-0 and
FC-1 integrated circuits. Evalua-
tion boards, which include the
Hewlett-Packard transceivers, are
available from these manufactur-
ers. The Applications Engineering
group in the Hewlett- Packard
Optical Communication Division
is available to assist you with
implementation details.
Transceiver Optical Power
Budget vs. Link Length
Optical Power Budget (OPB) is
the available optical power for a
fiber optic link to accommodate
fiber cable losses plus losses due
to in-line connectors, splices,
optical switches, and to provide
margin for link aging and
unplanned losses due to cable
plant reconfiguration or repair.
Figure 4 illustrates the predicted
OPB associated with the two
transceivers specified in this data
sheet at the Beginning of Life
(BOL). These curves represent
the attenuation and chromatic
plus modal dispersion losses
associated with the 62.5/125
µ
m
and 50/125
µ
m fiber cables only.
The area under the curves
1 = VEE
2 = RD
3 = RD
4 = SD
5 = VCC
6 = VCC
7 = TD
8 = TD
9 = VEE
TOP VIEW
N/C
N/C
Figure 5. HFBR-5301/5302 Bit Error
Rate vs. Relative Receiver Input
Optical Power.
BIT ERROR RATE
RELATIVE INPUT OPTICAL POWER ­ dB
1 x 10
-8
1 x 10
-10
-4
1 x 10
-2
-2
1 x 10
-12
1 x 10
-6
-6
2
0
1 x 10
-11
1 x 10
-9
1 x 10
-7
1 x 10
-5
1 x 10
-3
1 x 10
-4
CONDITIONS:
1. 133 & 266 MBd
2. PRBS 2
7
-1
3. CENTER OF SYMBOL SAMPLING
4. T
A
= 25 °C
5. V
CC
= 5 V
DC
6. INPUT OPTICAL RISE/FALL TIMES =
1.0/1.9 ns
218
power budget to do this. This is
primarily caused by a change of
receiver sensitivity.
These transceivers can also be
used for applications which
require different Bit Error Rate
(BER) performance. Figure 5
illustrates the typical trade-off
between link BER and the
receivers input optical power
level.
Transceiver Jitter
Performance
The Hewlett-Packard 1300 nm
transceivers are designed to
operate per the system jitter
allocations stated in FC-PH
Annex A.4.3 and A.4.4.
The HP 1300 nm transmitters will
tolerate the worst case input
electrical jitter allowed, without
violating the worst case output
optical jitter requirements.
The HP 1300 nm receivers will
tolerate the worst case input
optical jitter allowed without
violating the worst case output
electrical jitter allowed.
The jitter specifications stated in
the following tables are derived
from the values in FC-PH Annex
A.4.3 and A.4.4. They represent
the worst case jitter contribution
that the transceivers are allowed
to make to the overall system
jitter without violating the
allowed allocation. In practice,
the typical contribution of the HP
transceivers is below these
maximum allowed amounts.
Recommended Handling
Precautions
Hewlett-Packard recommends
that normal static precautions be
taken in handling and assembly
of these transceivers to prevent
damage and/or degradation which
may be induced by electrostatic
discharge (ESD). These trans-
ceivers are certified as MIL-STD-
883C Method 3015.4 Class 2
devices.
Care should be used to avoid
shorting the receiver data or
signal detect outputs directly to
ground.
Solder and Wash Process
Compatibility
The transceivers are delivered
with a protective process plug
inserted into the duplex SC
connector receptacle. This
process plug protects the optical
subassemblies during wave solder
and aqueous wash processing and
acts as a dust cover during
shipping.
These transceivers are compat-
ible with industry standard wave
and hand solder processes.
Shipping Container
The transceiver is packaged in a
shipping container designed to
protect it from mechanical and
ESD damage during shipment or
storage.
Board Layout ­ Decoupling
Circuit and Ground Planes
You should take care in the layout
of your circuit board to achieve
optimum performance from these
transceivers. Figure 6 provides a
good example of a schematic for
a power supply decoupling circuit
that works well with these parts.
Hewlett-Packard further recom-
mends that a contiguous ground
Figure 6. Recommended Decoupling and Termination Circuits.
,
,
,
,
,
,
,
NO INTERNAL CONNECTION
NO INTERNAL CONNECTION
HFBR-530X
TOP VIEW
V
EE
RD
RD
SD
V
CC
V
CC
TD
TD
V
EE
1
2
3
4
5
6
7
8
9
C1
C2
L1
L2
R2
R3
R1
R4
C5
C3
C4
R9
R10
V
CC
FILTER
AT V
CC
PINS
TRANSCEIVER
R5
R7
R6
R8
C6
RD
RD
SD
V
CC
TD
TD
TERMINATION
AT PHY
DEVICE
INPUTS
NOTES:
THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT
OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT
BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED.
TERMINATION
AT TRANSCEIVER
INPUTS
R1 = R4 = R6 = R8 = R10 = 130 ohms.
R2 = R3 = R5 = R7 = R9 = 82 ohms.
C1 = C2 = C3 = C5 = C6 = 0.1 µF.
C4 = 10 µF.
L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR.
Rx
Rx
Tx
Tx
V
CC
V
CC
219
The first case is during handling
of the transceiver prior to mount-
ing it on the circuit board. You
should use normal ESD handling
precautions for ESD sensitive
devices. These precautions
include using grounded wrist
straps, work benches, and floor
mats in ESD controlled areas.
The second case to consider is
static discharges to the exterior
of the equipment chassis contain-
ing the transceiver parts. To the
extent that the transceiver duplex
SC connector is exposed to the
outside of the equipment chassis,
it may be subject to whatever
ESD system level test criteria that
the equipment is intended to
meet.
Immunity
Equipment utilizing these trans-
ceivers will be subject to radio-
frequency electromagnetic fields
in some environments. These
transceivers have a high immunity
to such fields (see AN1075,
"Testing and Measuring Electro-
magnetic Compatibility Perfor-
mance of the HFBR-510X/520X
Fiber-Optic Transceivers," 5963-
3358E).
Transceiver Reliability and
Performance Qualification
Data
The 1x9 transceivers have passed
Hewlett-Packard reliability and
performance qualification testing
and are undergoing ongoing
quality monitoring. Details are
available from your Hewlett-
Packard sales representative.
These transceivers are manu-
factured at the Hewlett-Packard
Singapore location which is an
ISO 9002 certified facility.
Figure 7. Recommended Board Layout Hole Pattern.
(8X)2.54
.100
20.32
.800
20.32
.800
1.9 ± 0.1
.075 ± .004
(2X) ø
Ø0.000 M A
0.8 ± 0.1
.032 ± .004
(9X) ø
Ø0.000 M A
­A­
TOP VIEW
plane be provided in the circuit
board directly under the
transceiver to provide a low
inductance ground for signal
return current. This recommen-
dation is in keeping with good
high frequency board layout
practices.
Board Layout - Hole Pattern
The Hewlett-Packard transceiver
complies with the circuit board
"Common Transceiver Footprint"
hole pattern defined in the
original multisource announce-
ment for the 1x9 pin package
style. This drawing is reproduced
in Figure 7 with the addition of
ANSI Y14.5M compliant dimen-
sioning to be used as a guide in
the mechanical layout of your
circuit board.
Board Layout ­ Art Work
The Applications Engineering
group has developed Gerber file
art work for a multilayer printed
circuit board layout incorporating
the recommendations above.
Contact your local Hewlett-
Packard sales representative for
details.
Regulatory Compliance
These transceiver products are
intended to enable system
designers to develop equipment
that complies with the various
international regulations govern-
ing certification of Information
Technology Equipment. See the
Regulatory Compliance Table for
details.
Electromagnetic Interference
(EMI)
Most equipment designs utilizing
these high-speed transceivers
from Hewlett-Packard will need
to meet the requirements of the
FCC in the United States,
CENELEC EN55022 (CISPR 22)
in Europe and VCCI in Japan.
The HFBR-5301 and HFBR-5302
are suitable for use in designs
ranging from a single transceiver
in a desktop computer to large
quantities of transceivers in a
hub, switch or concentrator.
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage
is important.