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Part Number APTM10DHM05

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APTM10DHM05
A
P
T
M
10D
H
M
05­
R
e
v 0 M
a
y, 2005
APT website ­ http://www.advancedpower.com
1 - 6





G1
S1
S4
G4
CR3
VBUS
OUT2
0/VBUS
Q4
OUT1
CR2
Q1
-
S4
G4
VBUS
0/VBUS
S1
G1
OUT1
OUT2

Absolute maximum ratings
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed.
Symbol Parameter
Max ratings
Unit
V
DSS
Drain - Source Breakdown Voltage
100
V
T
c
= 25°C
278
I
D
Continuous
Drain
Current
T
c
= 80°C
207
I
DM
Pulsed Drain current
1100
A
V
GS
Gate - Source Voltage
±30
V
R
DSon
Drain - Source ON Resistance
5
m
P
D
Maximum Power Dissipation
T
c
= 25°C
780
W
I
AR
Avalanche current (repetitive and non repetitive)
100
A
E
AR
Repetitive Avalanche Energy
50
E
AS
Single Pulse Avalanche Energy
3000
mJ
V
DSS
= 100V
R
DSon
= 4.5m
typ @ Tj = 25°C
I
D
= 278A @ Tc = 25°C
Application
· Welding converters
· Switched Mode Power Supplies
· Uninterruptible Power Supplies
· Motor control

Features
· Power MOS V
®
MOSFETs
- Low R
DSon
- Low input and Miller capacitance
- Low gate charge
- Avalanche energy rated
- Very rugged
· Kelvin source for easy drive
· Very low stray inductance
- Symmetrical design
- M5 power connectors
· High level of integration
Benefits
· Outstanding performance at high frequency operation
· Direct mounting to heatsink (isolated package)
· Low junction to case thermal resistance
· Low profile
Asymmetrical - Bridge
MOSFET Power Module
APTM10DHM05
A
P
T
M
10D
H
M
05­
R
e
v 0 M
a
y, 2005
APT website ­ http://www.advancedpower.com
2 - 6
All ratings @ T
j
= 25°C unless otherwise specified

Electrical Characteristics
Symbol Characteristic
Test
Conditions
Min Typ Max Unit
V
GS
= 0V,V
DS
= 100V
T
j
= 25°C
200
I
DSS
Zero Gate Voltage Drain Current
V
GS
= 0V,V
DS
= 80V
T
j
= 125°C
1000
µA
R
DS(on)
Drain ­ Source on Resistance
V
GS
= 10V, I
D
= 125A
4.5 5 m
V
GS(th)
Gate
Threshold
Voltage
V
GS
= V
DS
, I
D
=
5mA
2 4 V
I
GSS
Gate ­ Source Leakage Current
V
GS
= ±30
V, V
DS
= 0V
±200
nA
Dynamic Characteristics
Symbol Characteristic
Test
Conditions
Min Typ Max Unit
C
iss
Input
Capacitance
20
C
oss
Output
Capacitance
8
C
rss
Reverse Transfer Capacitance
V
GS
= 0V
V
DS
= 25V
f = 1MHz
2.9
nF
Q
g
Total gate Charge
700
Q
gs
Gate ­ Source Charge
120
Q
gd
Gate ­ Drain Charge
V
GS
= 10V
V
Bus
= 50V
I
D
= 250A
360
nC
T
d(on)
Turn-on
Delay
Time
80
T
r
Rise Time
165
T
d(off)
Turn-off Delay Time
280
T
f
Fall Time
Resistive Switching
V
GS
= 15V
V
Bus
= 66V
I
D
=
250A
R
G
= 2.5
135
ns
E
on
Turn-on Switching Energy
1.1
E
off
Turn-off Switching Energy
Inductive switching @ 25°C
V
GS
= 15V, V
Bus
= 66V
I
D
= 250A,
R
G
=2.5
1.2
mJ
E
on
Turn-on Switching Energy
1.22
E
off
Turn-off Switching Energy
Inductive switching @ 125°C
V
GS
= 15V, V
Bus
= 66V
I
D
= 250A, R
G
= 2.5
1.28
mJ
E
on
includes diode reverse recovery.
In accordance with JEDEC standard JESD24-1.

Diode ratings and characteristics
Symbol Characteristic
Test
Conditions
Min Typ Max Unit
V
RRM
Maximum Peak Repetitive Reverse Voltage
200
V
T
j
= 25°C
350
I
RM
Maximum Reverse Leakage Current
V
R
=200V
T
j
= 125°C
600
µA
I
F(A V)
Maximum Average Forward Current
50% duty cycle
Tc = 80°C
200
A
I
F
= 200A
1
I
F
= 400A
1.4
V
F
Diode Forward Voltage
I
F
= 200A
T
j
= 125°C
0.9
V
T
j
= 25°C
60
t
rr
Reverse Recovery Time
T
j
= 125°C
110
ns
T
j
= 25°C
400
Q
rr
Reverse Recovery Charge
I
F
= 200A
V
R
= 133V
di/dt =600A/µs
T
j
= 125°C
1680
nC
APTM10DHM05
A
P
T
M
10D
H
M
05­
R
e
v 0 M
a
y, 2005
APT website ­ http://www.advancedpower.com
3 - 6
Thermal and package characteristics
Symbol Characteristic
Min Typ Max Unit
transistor 0.16
R
thJC
Junction
to
Case
diode
0.30
°C/W
V
ISOL
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
2500 V
T
J
Operating junction temperature range
-40 150
T
STG
Storage Temperature Range
-40
125
T
C
Operating Case Temperature
-40
100
°C
To heatsink
M6
3
5
Torque Mounting
torque
For terminals
M5
2
3.5
N.m
Wt Package
Weight
280 g
Package outline
(dimensions in mm)

APTM10DHM05
A
P
T
M
10D
H
M
05­
R
e
v 0 M
a
y, 2005
APT website ­ http://www.advancedpower.com
4 - 6
Typical Performance Curve
0.9
0.7
0.5
0.3
0.1
0.05
Single Pulse
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
0.00001
0.0001
0.001
0.01
0.1
1
10
rectangular Pulse Duration (Seconds)
The
r
m
a
l
I
m
pe
da
nc
e
(
°
C
/
W
)
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
6V
7V
8V
0
200
400
600
800
1000
1200
0
4
8
12
16
20
24
28
V
DS
, Drain to Source Voltage (V)
I
D
,
Dr
a
i
n

Cu
r
r
e
n
t

(
A
)
Low Voltage Output Characteristics
V
GS
=15V, 10V & 9V
Transfert Characteristics
T
J
=-55°C
T
J
=25°C
T
J
=125°C
0
40
80
120
160
200
240
0
1
2
3
4
5
6
7
V
GS
, Gate to Source Voltage (V)
I
D
,
D
r
a
i
n
C
u
r
r
e
nt
(
A
)
V
DS
> I
D
(on)xR
DS
(on)MAX
250µs pulse test @ < 0.5 duty cycle
R
DS(on)
vs Drain Current
V
GS
=10V
V
GS
=20V
0.8
0.9
1
1.1
1.2
0
25
50
75 100 125 150 175 200
I
D
, Drain Current (A)
R
DS
(
o
n
)

D
r
ai
n
t
o
S
o
u
r
ce O
N

R
e
s
i
st
an
ce
Normalized to
V
GS
=10V @ 125A
0
50
100
150
200
250
300
25
50
75
100
125
150
T
C
, Case Temperature (°C)
I
D
,
DC

D
r
a
i
n
Cu
r
r
e
n
t

(
A
)
DC Drain Current vs Case Temperature


APTM10DHM05
A
P
T
M
10D
H
M
05­
R
e
v 0 M
a
y, 2005
APT website ­ http://www.advancedpower.com
5 - 6
0.90
0.95
1.00
1.05
1.10
1.15
-50 -25
0
25 50 75 100 125 150
T
J
, Junction Temperature (°C)
BV
DS
S
,
D
r
a
i
n
t
o
S
o
u
r
c
e
B
r
e
a
k
dow
n
Vo
l
t
a
g
e
(
No
r
m
a
l
i
z
e
d
)
Breakdown Voltage vs Temperature
ON resistance vs Temperature
0.0
0.5
1.0
1.5
2.0
2.5
-50 -25
0
25 50 75 100 125 150
T
J
, Junction Temperature (°C)
R
D
S
(
o
n
)
,
D
r
ai
n

t
o
S
o
u
r
ce O
N

r
esi
s
t
an
ce
(N
o
r
ma
l
i
z
e
d
)
V
GS
=10V
I
D
= 125A
Threshold Voltage vs Temperature
0.6
0.7
0.8
0.9
1.0
1.1
1.2
-50 -25
0
25 50 75 100 125 150
T
C
, Case Temperature (°C)
V
GS
(
T
H
)
,
Thr
e
s
h
ol
d
V
o
l
t
a
g
e
(
N
or
m
a
l
i
z
e
d)
Maximum Safe Operating Area
10ms
1ms
100µs
10
100
1000
1
10
100
V
DS
, Drain to Source Voltage (V)
I
D
, D
r
a
i
n

C
u
r
r
e
n
t
(
A
)
Single pulse
T
J
=150°C
limited by
R
DSon
Ciss
Crss
Coss
1000
10000
100000
0
10
20
30
40
50
V
DS
, Drain to Source Voltage (V)
C
,
C
a
p
aci
t
a
n
ce (
p
F
)
Capacitance vs Drain to Source Voltage
V
DS
=20V
V
DS
=50V
V
DS
=80V
0
2
4
6
8
10
12
14
16
0
200
400
600
800
1000
Gate Charge (nC)
V
GS
,
G
a
t
e

t
o
S
o
u
r
ce V
o
l
t
ag
e
(
V
)
Gate Charge vs Gate to Source Voltage
I
D
=250A
T
J
=25°C

APTM10DHM05
A
P
T
M
10D
H
M
05­
R
e
v 0 M
a
y, 2005
APT website ­ http://www.advancedpower.com
6 - 6
Delay Times vs Current
t
d(on)
t
d(off)
0
50
100
150
200
250
300
350
0
100
200
300
400
I
D
, Drain Current (A)
t
d(
o
n
)
an
d
t
d(o
ff)
(n
s
)
V
DS
=66V
R
G
=2.5
T
J
=125°C
L=100µH
Rise and Fall times vs Current
t
r
t
f
0
50
100
150
200
250
0
100
200
300
400
I
D
, Drain Current (A)
t
r
a
nd t
f
(n
s
)
V
DS
=66V
R
G
=2.5
T
J
=125°C
L=100µH
Switching Energy vs Current
E
on
E
off
0
0.5
1
1.5
2
2.5
3
0
100
200
300
400
I
D
, Drain Current (A)
E
on
a
nd E
of
f
(m
J
)
V
DS
=66V
R
G
=2.5
T
J
=125°C
L=100µH
E
on
E
off
0
1
2
3
4
5
0
5
10
15
20
25
30
Gate Resistance (Ohms)
Sw
i
t
c
h
i
n
g
En
e
r
g
y

(
m
J
)
Switching Energy vs Gate Resistance
V
DS
=66V
I
D
=200A
T
J
=125°C
L=100µH
Hard
switching
ZVS
ZCS
0
20
40
60
80
100
50
100
150
200
250
I
D
, Drain Current (A)
Fr
e
que
nc
y
(
k
H
z
)
Operating Frequency vs Drain Current
V
DS
=66V
D=50%
R
G
=2.5
T
J
=125°C
T
C
=75°C
T
J
=25°C
T
J
=150°C
1
10
100
1000
0.3
0.5
0.7
0.9
1.1
1.3
1.5
V
SD
, Source to Drain Voltage (V)
I
DR
,
R
ever
se
D
r
ai
n
C
u
r
r
en
t

(
A
)
Source to Drain Diode Forward Voltage





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